H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2011
11/17/2011	US20110278726 Method of forming a semiconductor device having an etch stop layer and related device
11/17/2011	US20110278725 Stacking of transfer carriers with aperture arrays as interconnection joints
11/17/2011	US20110278724 Chip package and method for forming the same
11/17/2011	US20110278723 Semiconductor device
11/17/2011	US20110278722 Semiconductor device and manufacturing method thereof
11/17/2011	US20110278721 Semiconductor Package and Method of Mounting Semiconductor Die to Opposite Sides of TSV Substrate
11/17/2011	US20110278720 Semiconductor substrate structure and semiconductor device
11/17/2011	US20110278719 Directing the flow of underfill materials using magnetic particles
11/17/2011	US20110278718 Assembly of multi-chip modules using reflowable features
11/17/2011	US20110278717 Semiconductor Device and Method of Embedding Bumps Formed on Semiconductor Die Into Penetrable Adhesive Layer to Reduce Die Shifting During Encapsulation
11/17/2011	US20110278716 Method of fabricating bump structure
11/17/2011	US20110278715 Semiconductor device
11/17/2011	US20110278714 Chip package device and manufacturing method thereof
11/17/2011	US20110278713 Embedded component substrate, semiconductor package structure using the same and fabrication methods thereof
11/17/2011	US20110278712 Semiconductor Device and Method of Forming Perforated Opening in Bottom Substrate of Flipchip POP Assembly to Reduce Bleeding of Underfill Material
11/17/2011	US20110278711 Leadless Package for High Current Devices
11/17/2011	US20110278710 Direct Contact Leadless Package
11/17/2011	US20110278709 Stacked-die package for battery power management
11/17/2011	US20110278708 Lead frame, semiconductor device, and method for manufacturing semiconductor device
11/17/2011	US20110278707 Semiconductor Device and Method of Forming Prefabricated Multi-Die Leadframe for Electrical Interconnect of Stacked Semiconductor Die
11/17/2011	US20110278706 Power Electronic Device Package
11/17/2011	US20110278705 Semiconductor Device and Method of Mounting Semiconductor Die to Heat Spreader on Temporary Carrier and Forming Polymer Layer and Conductive Layer Over the Die
11/17/2011	US20110278704 Three-dimensional package structure
11/17/2011	US20110278703 Semiconductor Device and Method of Forming Discontinuous ESD Protection Layers Between Semiconductor Die
11/17/2011	US20110278701 Scribe line structure for wafer dicing
11/17/2011	US20110278695 Semiconductor device
11/17/2011	US20110278654 Semiconductor device
11/17/2011	US20110278643 Semiconductor unit and semiconductor apparatus using same
11/17/2011	US20110278569 Wafer level integration module with interconnects
11/17/2011	US20110278568 Manufacturing process of integrated electronic circuits and circuits thereby obtained
11/17/2011	US20110278527 Semiconductor device
11/17/2011	US20110277963 Thermal module and method of manufacturing the same
11/17/2011	DE102011002233A1 GaN based power devices with integrated protection devices: structures and methods GaN based power devices with integrated protection devices: structures and methods
11/17/2011	DE102010020749A1 Electronic device e.g. direct current (DC)-DC converter has silicon chip with metal film directly connected to electronic component that is connected to solder ball and connection elements, to serve as carrier for electronic component
11/17/2011	DE102009029769B4 Verfahren zur Herstellung eines elektronischen Bauteils mit einem mediendichten Kunststoffgehäuse A method of manufacturing an electronic component having a media-impermeable plastic housing
11/17/2011	DE102007002744B4 Halbleiterbauelement Semiconductor device
11/17/2011	DE102006006424B4 Anordnung mit mindestens einem Leistungshalbleitermodul und einem Kühlbauteil und zugehöriges Herstellungsverfahren Arrangement with at least one power semiconductor module and a cooling component and associated production method
11/17/2011	DE102005055713B4 Leistungshalbleitermodul mit Anschlusselementen Power semiconductor module with connecting elements
11/17/2011	DE102004061930B4 Optisches Halbleiterbauelement zur Ankopplung an eine optische Faser und damit ausgerüstete elektronische Einrichtung An optical semiconductor device for coupling to an optical fiber and electronic device equipped therewith
11/16/2011	EP2387295A1 IC-Package with integrated impedance matching and harmonic suppression
11/16/2011	EP2387112A2 Socket connector assembly with compressive contacts
11/16/2011	EP2387074A2 Carrier body for components or circuits
11/16/2011	EP2387073A2 Carrier body for components or circuits
11/16/2011	EP2387072A2 Carrier body for components or circuits
11/16/2011	EP2387071A2 Carrier body for components or circuits
11/16/2011	EP2387070A1 Device for energy conversion and equipment for energy conversion
11/16/2011	EP2387069A2 Carrier body for components or circuits
11/16/2011	EP2387068A2 Carrier body for components or circuits
11/16/2011	EP2387067A1 Method for manufacturing semiconductor package, method for encapsulating semiconductor, and solvent-borne semiconductor encapsulating epoxy resin composition
11/16/2011	EP2226841A9 Interposer and manufacturing method of the interposer
11/16/2011	EP1932176B1 Wafer with scribe lanes comprising external pads and/or active circuits for die testing
11/16/2011	EP1568260B1 Cooling of electric appliance unit
11/16/2011	EP0977251B1 Resin sealed semiconductor device and method for manufacturing the same
11/16/2011	DE202011051639U1 Kühlkörperrippe sowie Kühlkörpervorrichtung mit Selbiger Fin heat sink and heat sink device with Selbiger
11/16/2011	CN202043375U Circuit board module and crystal seat thereof
11/16/2011	CN202042483U Package structure of power semiconductor device
11/16/2011	CN202042482U High-voltage large power driver module
11/16/2011	CN202042481U Power module
11/16/2011	CN202042480U Microstructure for measuring bonding intensity of silicon wafers
11/16/2011	CN202042479U SMA (surface mount assembly) high-density integrated frame
11/16/2011	CN202042478U Semiconductor element capsulation and light emitting element using same
11/16/2011	CN202042477U IC packaging device
11/16/2011	CN202042476U Device packaging structure
11/16/2011	CN202042475U Liquid-cooling radiator
11/16/2011	CN202042474U Capsulation structure of metal oxide semiconductor (MOS) pipe
11/16/2011	CN202042473U Base plate for high-power electronic device module
11/16/2011	CN202042472U Semiconductor device with silicon through holes for high current, high frequency and heat dissipation
11/16/2011	CN202042471U Power device of copper aluminum lead structure
11/16/2011	CN1988137B 半导体装置 Semiconductor device
11/16/2011	CN1973377B High frequency transistor layout for low source drain capacitance
11/16/2011	CN1947262B LDMOS transistor and manufacture method thereof
11/16/2011	CN1790682B Semiconductor composite apparatus, method for manufacturing it, LED head and imaging device
11/16/2011	CN1714447B Forming a cap above a metal layer
11/16/2011	CN1531093B Microminiature power converter with multiple output
11/16/2011	CN102246616A 电路模块 Circuit module
11/16/2011	CN102246612A Rectifier module with cooled busbar
11/16/2011	CN102246611A Rectifier module with cooled busbar
11/16/2011	CN102246311A Cu alloy film and display device
11/16/2011	CN102246300A Ultraviolet light filter layer in image sensors
11/16/2011	CN102246299A Method for making via interconnection
11/16/2011	CN102246298A Semiconductor die interconnect formed by aerosol application of electrically conductive material
11/16/2011	CN102246297A Silanol condensation catalyst, heat-curable silicone resin composition for sealing photosemiconductors and sealed photosemiconductor using same
11/16/2011	CN102246296A Semiconductor-sealing resin composition, method for producing semiconductor device, and semiconductor device
11/16/2011	CN102246295A Granulated epoxy resin composition for semiconductor encapsulation, semiconductor device using same, and method for manufacturing semiconductor device
11/16/2011	CN102246293A Interconnect structure with improved dielectric line to via electromigration resistant interfacial layer and method of fabricating same
11/16/2011	CN102246292A Method of plating through wafer vias in a wafer for 3D packaging
11/16/2011	CN102246262A Method for encapsulating semiconductor dies
11/16/2011	CN102246261A System for encapsulation of semiconductor dies
11/16/2011	CN102246027A An arrangement related to a gas sensor
11/16/2011	CN102244972A Circuit board and application thereof
11/16/2011	CN102244132A Combined heat and power concentrated photovoltaic system based on water cooling of internal micro pipes
11/16/2011	CN102244124A Photovoltaic cell junction box
11/16/2011	CN102244076A Electrostatic discharge protective device for radio frequency integrated circuit
11/16/2011	CN102244070A Structure for providing electro-static discharge (ESD) protection for high-voltage path of ultra-high voltage assembly
11/16/2011	CN102244069A Semiconductor structure having concave part and manufacturing thereof
11/16/2011	CN102244068A Semiconductor device, method for manufacturing the same, and electronic device
11/16/2011	CN102244067A Fuse wire structure
11/16/2011	CN102244066A Power semiconductor module
11/16/2011	CN102244065A Strip package substrate and alignment structure thereof
11/16/2011	CN102244064A Strip package base plate and composition structure thereof

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