H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2011
11/23/2011	CN101694542B Thin film transistor for electrowetting display device and manufacturing method thereof
11/23/2011	CN101673802B Integrated metal matrix aluminium nitride film substrate, high-power LED module of heat pipe and manufacturing method thereof
11/23/2011	CN101552250B A lead frame and packaging of a semiconductor device
11/23/2011	CN101479846B Flip-chip interconnection with formed couplings
11/23/2011	CN101465330B Metal thermal interfacial material as well as radiating module and encapsulation microelectron containing the material
11/23/2011	CN101373719B Manufacturing method of semiconductor device having relay board
11/23/2011	CN101322231B High density three dimensional semiconductor die package
11/23/2011	CN101271893B Semiconductor device
11/23/2011	CN101238577B Method of reducing warpage in an over-molded IC package
11/23/2011	CN101150098B 半导体器件 Semiconductor devices
11/22/2011	US8064872 On chip transformer isolator
11/22/2011	US8064235 Semiconductor device
11/22/2011	US8064222 Semiconductor integrated circuit device
11/22/2011	US8064213 Module with a built-in component, and electronic device with the same
11/22/2011	US8064204 Electronic apparatus
11/22/2011	US8064201 Securing device and thermal module incorporating the same
11/22/2011	US8063691 Semiconductor integrated circuit device
11/22/2011	US8063562 Light-emitting device and electronic apparatus
11/22/2011	US8063542 Piezoelectric devices and methods for manufacturing same
11/22/2011	US8063497 Liquid crystal display
11/22/2011	US8063496 Semiconductor integrated circuit device and method of fabricating the same
11/22/2011	US8063495 Semiconductor device
11/22/2011	US8063494 Semiconductor device and power supply unit utilizing the same
11/22/2011	US8063493 Semiconductor device assemblies and packages
11/22/2011	US8063489 Semiconductor integrated circuit device
11/22/2011	US8063488 Semiconductor device and manufacturing method thereof
11/22/2011	US8063487 Manufacturing method of semiconductor apparatus and semiconductor apparatus
11/22/2011	US8063486 Circuit board, method for manufacturing the same, and semiconductor device
11/22/2011	US8063484 Semiconductor device and heat sink with 3-dimensional thermal conductivity
11/22/2011	US8063483 On-chip temperature gradient minimization using carbon nanotube cooling structures with variable cooling capacity
11/22/2011	US8063482 Heat spreader as mechanical reinforcement for ultra-thin die
11/22/2011	US8063480 Printed board and semiconductor integrated circuit
11/22/2011	US8063479 Housing for a semiconductor component
11/22/2011	US8063478 Method of manufacturing a semiconductor device
11/22/2011	US8063477 Integrated circuit packaging system having asymmetric encapsulation structures and method of manufacture thereof
11/22/2011	US8063476 Semiconductor device
11/22/2011	US8063475 Semiconductor package system with through silicon via interposer
11/22/2011	US8063474 Embedded die package on package (POP) with pre-molded leadframe
11/22/2011	US8063473 Nanophotonic transceiver
11/22/2011	US8063472 Semiconductor package with stacked dice for a buck converter
11/22/2011	US8063471 Copper alloy sheet for electric and electronic parts
11/22/2011	US8063470 Method and apparatus for no lead semiconductor package
11/22/2011	US8063469 On-chip radio frequency shield with interconnect metallization
11/22/2011	US8063468 Semiconductor device, method for manufacturing semiconductor device, and method for designing manufacturing semiconductor device
11/22/2011	US8063452 Semiconductor device and method for manufacturing the same
11/22/2011	US8063417 Integrated circuit device and method for forming the same
11/22/2011	US8063416 Semiconductor device
11/22/2011	US8063415 Semiconductor device
11/22/2011	US8063402 Integrated circuit having a filler standard cell
11/22/2011	US8063401 Testing for correct undercutting of an electrode during an etching step
11/22/2011	US8063393 Memory devices, stylus-shaped structures, electronic apparatuses, and methods for fabricating the same
11/22/2011	US8063318 Electronic component with wire bonds in low modulus fill encapsulant
11/22/2011	US8063156 Composition containing cycloaliphatic epoxide, polyol oligomer, and curing catalyst
11/22/2011	US8062974 Semiconductor device with grounding structure
11/22/2011	US8062929 Semiconductor device and method of stacking same size semiconductor die electrically connected through conductive via formed around periphery of the die
11/22/2011	US8062537 Method for manufacturing an electronics module
11/22/2011	CA2622581C Laminated substrate for mounting electronic parts
11/22/2011	CA2548994C Barrier layer for an organic electronic device
11/17/2011	WO2011142899A1 Systems and methods for digitally decoding integrated circuit blocks
11/17/2011	WO2011142582A2 Stacked semiconductor package
11/17/2011	WO2011142581A2 Stacked semiconductor package
11/17/2011	WO2011142466A1 Epoxy resin, epoxy resin composition, and cured product thereof
11/17/2011	WO2011142318A1 Electronic component and method for producing same
11/17/2011	WO2011142079A1 Differential signal transmission line, ic package, and method for testing said differential signal transmission line and ic package
11/17/2011	WO2011142059A1 Semiconductor device and method for producing same
11/17/2011	WO2011142013A1 Semiconductor device
11/17/2011	WO2011142006A1 Semiconductor device and method for manufacturing same
11/17/2011	WO2011141981A1 Semiconductor device
11/17/2011	WO2011141979A1 Masking jig, substrate heating apparatus, and film formation method
11/17/2011	WO2011141976A1 Semiconductor device and method for manufacturing same
11/17/2011	WO2011141471A1 Polymer compositions based on eco-friendly vegetable and/or animal oils as thermally conductive materials
11/17/2011	WO2011141272A1 Cooling apparatus for electrical devices
11/17/2011	WO2011140994A1 Chip with double layers of pins
11/17/2011	WO2011100207A3 Interconnect pattern for transceiver package
11/17/2011	WO2011100021A3 Bond pad with multiple layer over pad metallization and method of formation
11/17/2011	WO2011097165A3 Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
11/17/2011	WO2011097089A3 Recessed semiconductor substrates
11/17/2011	WO2011093961A3 Method and apparatus for interconnect layout in an integrated circuit
11/17/2011	WO2011049764A3 Leadframe packages having enhanced ground-bond reliability
11/17/2011	WO2010104610A8 Stacked microelectronic assembly with microelectronic elements having vias extending through bond pads
11/17/2011	US20110283034 Semiconductor chip, and semiconductor package and system each including the semiconductor chip
11/17/2011	US20110281138 Method of mounting semiconductor chips, semiconductor device obtained using the method,method of connecting semiconductor chips, three-dimensional structure in which wiring is provided on its surface, and method of producing the same
11/17/2011	US20110279764 Active matrix substrate and display device
11/17/2011	US20110278743 Layout structure and version control circuit for integrated circuits
11/17/2011	US20110278742 Circuitry and Method for Encapsulating the Same
11/17/2011	US20110278741 Semiconductor Device and Method of Forming Interconnect Structure and Mounting Semiconductor Die in Recessed Encapsulant
11/17/2011	US20110278740 Scalable transfer-join bonding lock-and-key structures
11/17/2011	US20110278739 Semiconductor Package
11/17/2011	US20110278738 Self-aligned, integrated circuit contact
11/17/2011	US20110278737 Stacking Integrated Circuits containing Serializer and Deserializer Blocks using Through Silicon Via
11/17/2011	US20110278736 Semiconductor Device and Method of Forming a Vertical Interconnect Structure for 3-D FO-WLCSP
11/17/2011	US20110278735 Chip package and method for forming the same
11/17/2011	US20110278734 Chip package and method for forming the same
11/17/2011	US20110278733 Process for fabricating semiconductor devices and a semiconductor device comprising a chip with through-vias
11/17/2011	US20110278732 Interconnect Structures for Substrate
11/17/2011	US20110278731 Method for integrated circuit design and manufacture using diagonal minimum-width patterns
11/17/2011	US20110278730 Semiconductor Devices and Structures Thereof
11/17/2011	US20110278729 Extendable Network Structure
11/17/2011	US20110278728 Chip Packaging
11/17/2011	US20110278727 Chip structure and process for forming the same

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