H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2011
11/23/2011	EP1856727B1 Method of manufacturing a wafer assembly with junction-isolated vias
11/23/2011	EP1825511B1 Semiconductor switching module
11/23/2011	EP1440470B1 Method of wire bonding a microelectronic die
11/23/2011	CN202050627U Heat radiation structure
11/23/2011	CN202050364U Bridge rectifier
11/23/2011	CN202050352U IGBT (Insulated Gate Bipolar Transistor) power system
11/23/2011	CN202049991U Radiation assembly used for light-emitting diode (LED), as well as LED and LED lamp
11/23/2011	CN202049955U Polycrystalline packaging structure using constant voltage power supply and used for increasing magnitude of current
11/23/2011	CN202049949U Three-phase arc-shaped semi-bridge rectifier module
11/23/2011	CN202049948U QFN (Quad Flat No-lead) frame
11/23/2011	CN202049947U Optimized triode lead wire framework
11/23/2011	CN202049946U Optimized lead frame
11/23/2011	CN202049945U Water cooling radiator
11/23/2011	CN202049944U Cooling water cavity of water-cooling radiator
11/23/2011	CN202049943U Water-cooling type liquid cooling plate
11/23/2011	CN202049942U Pump-free thermal-drive liquid cooling system
11/23/2011	CN202049941U Water faucet locking mechanism for water-cooled radiator
11/23/2011	CN202049940U Radiating component
11/23/2011	CN202049939U Chip array position protection base
11/23/2011	CN202049938U Die holder disc for IGBT packaging
11/23/2011	CN202049937U High-power high-vacuum anti-explosion ceramic tube shell
11/23/2011	CN202049936U Explosion-proof flange
11/23/2011	CN202049935U Metal line structure of output tube pressure point of integrated circuit
11/23/2011	CN202049512U Electronic authentication main control chip
11/23/2011	CN202049314U Signal wire connecting structure as well as array substrate and liquid crystal display using same
11/23/2011	CN1964053B Nanotube based nonvolatile memory device
11/23/2011	CN1914725B Microelectronic assembly having thermoelectric elements to cool a die and a method of making the same
11/23/2011	CN1909367B Ceramic packaging piece for crystal oscillator and its preparation method
11/23/2011	CN1790691B Semiconductor device
11/23/2011	CN1682359B Semiconductor device and method for manufacturing the same
11/23/2011	CN1647272B Chip integrated circuit block for demarcating a dynamic voltage and integrated circuit
11/23/2011	CN1532943B Silicon carbide semiconductor device and its producting method
11/23/2011	CN102257614A Integrated sensor including sensing and processing die mounted on opposite sides of package substrate
11/23/2011	CN102257613A Telephony and digital media services device
11/23/2011	CN102257612A Wafer and method for manufacturing package product
11/23/2011	CN102257516A Device for protecting an electronic integrated circuit housing against physical or chemical ingression
11/23/2011	CN102257374A Device and method for producing a device
11/23/2011	CN102257064A 液体树脂组合物和半导体器件 Liquid resin composition and a semiconductor device
11/23/2011	CN102256469A Heat radiating module and electronic device using same
11/23/2011	CN102256452A Circuit board with built-in semiconductor chip and method of manufacturing the same
11/23/2011	CN102256443A Inductors occupying space above circuit board components
11/23/2011	CN102256442A Welding pad structure for ball grid array packaging chip and multilayer printed circuit board for mobile phone
11/23/2011	CN102256435A Multilayer printed circuit board using flexible interconnect structure, and method of making same
11/23/2011	CN102255479A Bridge rectifier for intelligent servo transformer
11/23/2011	CN102254936A Compound semiconductor device and method for manufacturing compound semiconductor device
11/23/2011	CN102254929A Display apparatus
11/23/2011	CN102254928A Pixel structure and electric bridging structure
11/23/2011	CN102254916A Integration of memory cells comprising capacitors with logic circuits comprising interconnects
11/23/2011	CN102254915A Semiconductor device with buried bit lines and method for fabricating the same
11/23/2011	CN102254908A Molded power-supply module with bridge inductor over other components
11/23/2011	CN102254901A Semiconductor structure having electromagnetic interference resisting structure and method manufacturing same
11/23/2011	CN102254900A Integrated circuit device and the manufacturing method thereof
11/23/2011	CN102254899A Structure and method for alignment marks
11/23/2011	CN102254898A Flexible substrate package-based shielding structure and manufacturing process thereof
11/23/2011	CN102254897A Package systems having interposers
11/23/2011	CN102254896A 电子器件及其制造方法 Electronic device and manufacturing method thereof
11/23/2011	CN102254895A Semiconductor device, semiconductor unit, and power semiconductor device
11/23/2011	CN102254894A Improved triode lead frame
11/23/2011	CN102254893A Quadrilateral flat leadless package with double convex points and production method thereof
11/23/2011	CN102254892A Thin high-power semiconductor module
11/23/2011	CN102254891A Flip chip packaging structure and manufacturing method thereof
11/23/2011	CN102254890A Stacked semiconductor package and method for manufacturing the same
11/23/2011	CN102254889A High-power semiconductor device and packaging method thereof
11/23/2011	CN102254888A Manufacturing method of printed circuit board unit, manufacturing apparatus thereof, manufacturing method of electronic component, and electronic component
11/23/2011	CN102254887A Semiconductor device structure and manufacturing method thereof
11/23/2011	CN102254886A Lead bonding-free IGBT (Insulated Gate Bipolar Translator) module
11/23/2011	CN102254885A Passive device, passive device-embedded circuit board and manufacturing method
11/23/2011	CN102254884A Water-cooling radiator for high-power thyristors
11/23/2011	CN102254883A Component welding structure and welding method thereof
11/23/2011	CN102254882A 电功率转换器 Electrical power converter
11/23/2011	CN102254881A 半导体装置 Semiconductor device
11/23/2011	CN102254880A Chip packaging device and manufacturing method thereof
11/23/2011	CN102254879A Controlled silicon for large-size silicon chip employing plastic entity package and packaging process thereof
11/23/2011	CN102254878A 半导体装置 Semiconductor device
11/23/2011	CN102254877A Power module without metal baseplate
11/23/2011	CN102254876A Semiconductor apparatus and semiconductor apparatus unit
11/23/2011	CN102254875A Ceramic package and manufacturing method thereof
11/23/2011	CN102254874A Semiconductor module, mthod for manufacturing semiconductor module, and portable device
11/23/2011	CN102254873A 面板 Panel
11/23/2011	CN102254872A Semiconductor structure and method of forming semiconductor component
11/23/2011	CN102254871A Semiconductor eevice and manufacturing method thereof
11/23/2011	CN102254870A Integrated circuit element, forming method thereof and packaging assembly
11/23/2011	CN102254869A Integrated circuit device
11/23/2011	CN102254865A Ic component production method
11/23/2011	CN102254858A Process for fabricating semiconductor devices and a semiconductor device comprising a chip with through-vias
11/23/2011	CN102254857A Semiconductor process and structure
11/23/2011	CN102254856A Semiconductor device used in interconnection technology and manufacturing method thereof
11/23/2011	CN102254842A Activation treatments in plating processes
11/23/2011	CN102254840A Semiconductor device and manufacture method thereof
11/23/2011	CN102254839A Simple out-core integration method for integrated circuit and novel frame
11/23/2011	CN102254836A Manufacturing method of electronic device package, electronic device package, and oscillator
11/23/2011	CN102254835A Semiconductor device and the manufacturing method thereof
11/23/2011	CN102254834A Semiconductor packaging structure and method thereof
11/23/2011	CN102253513A Tape-coiling substrate of COF (chip on film) structure of liquid crystal display (LCD) panel as well as LCD panel
11/23/2011	CN102252553A Fin structure and heat dissipation device thereof
11/23/2011	CN102249009A Thermochromism emittance-variable thermal control device for spacecrafts
11/23/2011	CN101906238B Epoxy resin composition and semiconductor device
11/23/2011	CN101785090B Semiconductor device manufacturing method, semiconductor device manufacturing apparatus
11/23/2011	CN101707194B production method of palladium-plated bonded copper wire
11/23/2011	CN101706055B LED medium strong heat-conducting circulating system module

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