H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2011
11/24/2011	WO2011146302A1 Set-top box having dissipating thermal loads
11/24/2011	WO2011146211A1 Enhanced modularity in heterogeneous 3d stacks
11/24/2011	WO2011145729A1 Composite sensor and method for manufacturing same
11/24/2011	WO2011145640A1 Cooling device with a plurality of fin pitches
11/24/2011	WO2011145638A1 Novel organosilicon compound and thermosetting resin composition, cured resin, and semiconductor sealing material containing said organosilicon compound
11/24/2011	WO2011145618A1 Ebullient cooling device
11/24/2011	WO2011145468A1 Memory device and semiconductor device
11/24/2011	WO2011145294A1 Wiring method, structure having wiring provided on surface, semiconductor device, wiring board, memory card, electric device, module, and multilayer circuit board
11/24/2011	WO2011145202A1 Semiconductor device
11/24/2011	WO2011145176A1 Semiconductor device and method for manufacturing the same
11/24/2011	WO2011145159A1 Semiconductor device, and process for production thereof
11/24/2011	WO2011144687A1 Method for building a substrate holder
11/24/2011	WO2011144249A1 Method and device for thermally coupling a heat sink to a component
11/24/2011	WO2011143934A1 Inductive loop formed by interconnecting through-silicon -via
11/24/2011	WO2011100190A3 Interconnect pattern for high performance interfaces
11/24/2011	WO2011056987A3 Stacked die assembly having reduced stress electrical interconnects
11/24/2011	WO2011028389A3 Heat transfer device
11/24/2011	WO2007093380A8 Bonding wire
11/24/2011	US20110287615 High-density nonvolatile memory and methods of making the same
11/24/2011	US20110287595 Semiconductor integrated circuit device
11/24/2011	US20110287585 Semiconductor device including semiconductor elements mounted on base plate
11/24/2011	US20110287250 Adhesive sheet, semiconductor device, and process for producing semiconductor device
11/24/2011	US20110285036 Overlay mark assistant feature
11/24/2011	US20110285035 Sealed cavity
11/24/2011	US20110285034 Electrical connections for multichip modules
11/24/2011	US20110285033 Chip Carrier
11/24/2011	US20110285032 Chip package and method for forming the same
11/24/2011	US20110285031 Interconnect Structure to Reduce Stress Induced Voiding Effect
11/24/2011	US20110285030 Method for producing chip packages, and chip package produced in this way
11/24/2011	US20110285029 Semiconductor structures including tight pitch contacts
11/24/2011	US20110285028 Semiconductor device and method for fabricating the same
11/24/2011	US20110285027 Semiconductor circuit structure and method of forming the same using a capping layer
11/24/2011	US20110285026 Process For Improving Package Warpage and Connection Reliability Through Use Of A Backside Mold Configuration (BSMC)
11/24/2011	US20110285025 Wafer Level Chip Scale Package Method Using Clip Array
11/24/2011	US20110285024 Semiconductor device and manufacturing method thereof
11/24/2011	US20110285023 Substrate Interconnections having Different Sizes
11/24/2011	US20110285022 Integrated circuit and method for fabricating the same
11/24/2011	US20110285021 Noble metal cap for interconnect structures
11/24/2011	US20110285020 Microelectronic assembly with joined bond elements having lowered inductance
11/24/2011	US20110285018 Multiple selectable function integrated circuit module
11/24/2011	US20110285017 Method for producing an optoelectronic device and optoelectronic device
11/24/2011	US20110285016 Semiconductor device and method of manufacturing the same
11/24/2011	US20110285015 Bump structure and fabrication method thereof
11/24/2011	US20110285014 Packaging structure and package process
11/24/2011	US20110285013 Controlling Solder Bump Profiles by Increasing Heights of Solder Resists
11/24/2011	US20110285012 Substrate Contact Opening
11/24/2011	US20110285011 Cu pillar bump with l-shaped non-metal sidewall protection structure
11/24/2011	US20110285010 Electric power converter
11/24/2011	US20110285009 Integrated circuit packaging system with dual side connection and method of manufacture thereof
11/24/2011	US20110285008 Semiconductor apparatus and semiconductor apparatus unit
11/24/2011	US20110285007 Semiconductor Device and Method of Forming Ultra Thin Multi-Die Face-to-Face WLCSP
11/24/2011	US20110285006 Semiconductor Package and Method for Making the Same
11/24/2011	US20110285005 Package systems having interposers
11/24/2011	US20110285004 Devices including, methods using, and compositions of reflowable getters
11/24/2011	US20110285003 Optical device and method for manufacturing optical device, and camera module and endoscope module equipped with optical device
11/24/2011	US20110285002 Leadless package system having external contacts
11/24/2011	US20110285001 Leadless integrated circuit packaging system and method of manufacture thereof
11/24/2011	US20110285000 Semiconductor system with fine pitch lead fingers and method of manufacturing thereof
11/24/2011	US20110284999 Integrated circuit packaging system with isolated pads and method of manufacture thereof
11/24/2011	US20110284998 Integrated circuit package system with offset stacked die
11/24/2011	US20110284997 Chip-Exposed Semiconductor Device and Its Packaging Method
11/24/2011	US20110284996 Semiconductor device and method of manufacturing the same
11/24/2011	US20110284994 Electrically Broken, but Mechanically Continuous Die Seal for Integrated Circuits
11/24/2011	US20110284988 Electrical fuse device
11/24/2011	US20110284963 Semiconductor device
11/24/2011	US20110284936 Semiconductor device and method of fabricating the same
11/24/2011	US20110284916 Devices including, methods using, and compositions of reflowable getters
11/24/2011	US20110284843 Probe Pad On A Corner Stress Relief Region In A Semiconductor Chip
11/24/2011	US20110284842 Integrated circuit package system with laminate base
11/24/2011	US20110284841 Semiconductor device and method of manufacturing the same
11/24/2011	US20110284840 Process Monitor for Monitoring an Integrated Circuit Chip
11/24/2011	US20110284709 Solar module array pre-assembly method and apparatus
11/24/2011	US20110284271 Heat sink
11/24/2011	DE202011102590U1 Flachwärmerohr Flat heat pipe
11/24/2011	DE202011102586U1 Vapor-Chamber-Kühler Vapor Chamber cooler
11/24/2011	DE10321452B4 Implementierung eines Temperatursensors zum Steuern von internen Chipspannungen Implementation of a temperature sensor for controlling internal chip voltages
11/24/2011	DE102011050402A1 Elektrischer Leistungswandler An electric power converter
11/24/2011	DE102011007624A1 Halbleitervorrichtung Semiconductor device
11/24/2011	DE102011007228A1 Semiconductor device, has main housing provided on base plate, support secured at housing, and projection formed on inner wall of housing, where head-side surface of projection is separated from lower surface of cover
11/24/2011	DE102010029178A1 Elektronikkühler und Verfahren zum Herstellen eines Elektronikkühlers Electronics cooler and method of manufacturing an electronic cooler
11/24/2011	DE102010022204A1 Elektrisches Bauelement mit flacher Bauform und Herstellungsverfahren Electrical component with a flat design and manufacturing processes
11/24/2011	DE102010020932A1 Isothermal cooling system for cooling of i.e. microprocessor of computer, has isothermal vaporization radiators with cooling fins to dissipate heat to environment, where inner cavity of fins comprises vaporization and gas portions
11/24/2011	DE102007044795B4 Elektronisches Modul mit einem Bauelementstapel Electronic module with a component stack
11/24/2011	CA2799671A1 High q vertical ribbon inductor on semiconducting substrate
11/23/2011	EP2389057A1 Electronics cooler and method for manufacturing the same
11/23/2011	EP2389049A1 Multilayer printed circuit board using flexible interconnect structure, and method of making same
11/23/2011	EP2388817A2 Press-pack module with power overlay interconnection
11/23/2011	EP2388815A1 A transistor package
11/23/2011	EP2388814A2 Electronic device and manufacturing method therefor
11/23/2011	EP2388813A2 Method for manufacturing power semiconductor substrates
11/23/2011	EP2388812A2 Heat dissipating assembly
11/23/2011	EP2388811A2 Carrier body for compnents or circuits
11/23/2011	EP2388810A2 Semiconductor device with a connecting portion comprising two or more layers of diffusion-joined metal nanoparticles and corresponding manufacturing method
11/23/2011	EP2388807A1 Semiconductor die with venting channel
11/23/2011	EP2388806A1 Fabrication process of semiconductor chips having longitudinal wire insertion notches
11/23/2011	EP2388516A1 Heat sink device, in particular for a light
11/23/2011	EP2388349A1 Copper alloy sheet for electric and electronic parts
11/23/2011	EP2388348A1 Copper alloy sheet for electric and electronic parts
11/23/2011	EP2388347A1 Copper alloy sheet for electric and electronic parts
11/23/2011	EP2387798A2 Method for verifying an identification circuit

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