H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
11/2011
11/30/2011	CN102263076A 封装结构及形成封装结构的方法 Package structure and method of forming a package structure
11/30/2011	CN102263075A 具有电接地热沉的电子装置及其制造方法 An electrically grounded heat sink of an electronic device and manufacturing method thereof
11/30/2011	CN102263074A 系统级封装 System in Package
11/30/2011	CN102263073A 金刚石和铝的接合体及其制造方法 Assembly and manufacturing method of diamond and aluminum
11/30/2011	CN102263072A 热辐射散热薄膜结构及其制作方法 Thermal radiation heat film structure and production methods
11/30/2011	CN102263071A 半导体模块和使用半导体模块的电动设备 The semiconductor module and the electric device using a semiconductor module
11/30/2011	CN102263070A 一种基于基板封装的wlcsp封装件 A substrate-based package wlcsp package
11/30/2011	CN102263069A 电路模块 Circuit module
11/30/2011	CN102263068A 带低温压力烧结连接的两个连接配对件系统及其制造方法 Temperature pressure sintering is connected with two mating parts and a manufacturing method of connecting the system
11/30/2011	CN102263067A 微凸块接合装置 Microbump engagement means
11/30/2011	CN102263066A 散热模组结合构造 Cooling modules combine structure
11/30/2011	CN102263055A 接触孔的形成方法、半导体结构 The method of forming a contact hole, a semiconductor structure
11/30/2011	CN102263040A 半导体电子元件的封装方法 The semiconductor packaging method of an electronic device
11/30/2011	CN102263011A 半导体结构的制造方法 The method of manufacturing a semiconductor structure
11/30/2011	CN102262427A 散热模组 Thermal Module
11/30/2011	CN101814470B 用于电子封装器件的微通道热沉 Microchannel heat sinks for electronic packaging devices
11/30/2011	CN101785097B 电子零件 Electronic Parts
11/30/2011	CN101740539B 四方平面无导脚封装单元及其制法和其导线架 Quartet plane without guide pin package and its wire rack unit Jiqizhifa
11/30/2011	CN101728352B 散热型半导体封装件及其导线架与设计方法 Cooling type semiconductor package and leadframe and design method
11/30/2011	CN101685764B 系统级封装模块结构的制造方法 The method of manufacturing the modular structure of the system in package
11/30/2011	CN101681893B 半导体集成电路装置及制造方法 The semiconductor integrated circuit device and method of manufacture
11/30/2011	CN101677093B 半导体器件及其设计方法 Semiconductor device and design methods
11/30/2011	CN101673754B 半导体器件 Semiconductor devices
11/30/2011	CN101661912B 用于直接基板冷却的具有分布式支撑的逆变器功率模块 For direct cooling of the substrate having a distributed inverter power module support
11/30/2011	CN101656240B 单一晶粒尺寸半导体元件绝缘被覆工艺 Single grain size of the semiconductor device having an insulating coating process
11/30/2011	CN101626015B 封装结构及其形成、量产方法与芯片堆叠结构 Package structure and formation, production methods and chip stack structure
11/30/2011	CN101619840B 光源模组及应用该光源模组的发光二极管灯具 Light source module and the application of the light-emitting diode lamp light source module
11/30/2011	CN101610656B 散热装置及其组装方法 The heat sink and method of assembling the
11/30/2011	CN101604668B 无Pb焊料连接结构和电子装置 Pb-free solder connection structure and electronic devices
11/30/2011	CN101583260B 散热器及其制造方法 Heat sink and a manufacturing method
11/30/2011	CN101582412B 输入/输出垫结构 Input / output pad structure
11/30/2011	CN101572246B 电阻存储器、含有电阻存储器的集成电路的制作方法 Production Method resistance memory, memory integrated circuits containing resistance
11/30/2011	CN101567355B 半导体封装基板及其制法 The semiconductor package substrate preparation method
11/30/2011	CN101556825B 一种集成电路 An integrated circuit
11/30/2011	CN101552311B 发光元件的封装制程 Packaging process emitting element
11/30/2011	CN101542726B 具有硅通孔和侧面焊盘的半导体芯片 A semiconductor chip having a silicon vias and side pads
11/30/2011	CN101494221B 半导体装置 Semiconductor device
11/30/2011	CN101452860B 多芯片堆叠结构及其制法 Multi-chip stack structure Jiqizhifa
11/30/2011	CN101425483B 集成电路结构 Integrated circuit structure
11/30/2011	CN101398015B 压电风扇、包含其的冷却装置及冷却微电子器件的方法 Pressure fans, including its cooling device and method for cooling of microelectronic devices
11/30/2011	CN101388376B 半导体封装基板结构 The semiconductor package substrate structure
11/30/2011	CN101383292B 修改芯片封装体上的载球层的方法 Modify the ball carrier layer on the chip package
11/30/2011	CN101373733B 集成电路器件结构形成方法及相应结构 The method of forming an integrated circuit device structure and the corresponding structures
11/30/2011	CN101304018B 影像显示系统 Image display system
11/30/2011	CN101286509B 静电保护电路 Electrostatic protection circuit
11/30/2011	CN101232794B 均热板及散热装置 Hot plate and heat sink
11/30/2011	CN101217137B 一种提高p阱栅氧化层电学厚度测量精确性的测量结构 Method for improving the electrical p-well of the gate oxide layer thickness measurement accuracy of the measurement structure
11/30/2011	CN101202256B 功率放大器 PA
11/30/2011	CN101156238B 电子零件连接用突起电极与电子零件安装体的制造方法 Connecting the electronic component manufacturing method of mounting electronic parts and bump electrodes
11/30/2011	CN101146428B 散热模组 Thermal Module
11/30/2011	CN101013686B 互连衬底、半导体器件及其制造方法 Interconnect substrate, a semiconductor device and manufacturing method thereof
11/29/2011	USRE42972 Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof
11/29/2011	US8069491 Probe testing structure
11/29/2011	US8068346 Circuit board with high density power semiconductors
11/29/2011	US8068077 Contact structure of conductive films and thin film transistor array panel including the same
11/29/2011	US8067842 Integrated circuit package, notably for image sensor, and method of positioning
11/29/2011	US8067841 Semiconductor devices having a resin with warpage compensated surfaces
11/29/2011	US8067840 Power amplifier assembly
11/29/2011	US8067839 Stacked semiconductor package and method for manufacturing the same
11/29/2011	US8067838 Semiconductor device having pad structure for preventing and buffering stress of silicon nitride film
11/29/2011	US8067837 Metallization structure over passivation layer for IC chip
11/29/2011	US8067836 Semiconductor device with reduced increase in copper film resistance
11/29/2011	US8067835 Method and apparatus for manufacturing semiconductor module
11/29/2011	US8067834 Semiconductor component
11/29/2011	US8067833 Low noise high thermal conductivity mixed signal package
11/29/2011	US8067832 Embedded integrated circuit package system and method of manufacture thereof
11/29/2011	US8067831 Integrated circuit package system with planar interconnects
11/29/2011	US8067830 Dual or multiple row package
11/29/2011	US8067829 System and method for multi-chip module die extraction and replacement
11/29/2011	US8067828 System for solder ball inner stacking module connection
11/29/2011	US8067826 Power device package comprising metal tab die attach paddle (DAP) and method of fabricating the package
11/29/2011	US8067825 Integrated circuit package system with multiple die
11/29/2011	US8067824 Integrated circuit module package and assembly method thereof
11/29/2011	US8067823 Chip scale package having flip chip interconnect on die paddle
11/29/2011	US8067822 Integrated circuit package for semiconductor devices with improved electric resistance and inductance
11/29/2011	US8067821 Flat semiconductor package with half package molding
11/29/2011	US8067819 Semiconductor wafer including semiconductor chips divided by scribe line and process-monitor electrode pads formed on scribe line
11/29/2011	US8067802 Flexible device and method of manufacturing the same
11/29/2011	US8067790 Semiconductor device with less power supply noise
11/29/2011	US8067789 Semiconductor integrated circuit device
11/29/2011	US8067784 Semiconductor chip assembly with post/base heat spreader and substrate
11/29/2011	US8067781 Light emitting structure and securing device thereof
11/29/2011	US8067699 Semiconductor element, method of manufacturing semiconductor element, multi-layer printed circuit board, and method of manufacturing multi-layer printed circuit board
11/29/2011	US8067313 Semiconductor device, method of manufacturing the same, and electronic apparatus
11/29/2011	US8067310 Semiconductor device and method for manufacturing of same
11/29/2011	US8067309 Semiconductor device using metal nitride as insulating film and its manufacture method
11/29/2011	US8067307 Integrated circuit package system for stackable devices
11/29/2011	US8067275 Integrated circuit package system with package integration
11/29/2011	US8067272 Integrated circuit package system for package stacking and manufacturing method thereof
11/29/2011	US8067271 Integrated circuit package system with encapsulation lock
11/29/2011	US8067268 Stacked integrated circuit package system and method for manufacturing thereof
11/29/2011	US8067251 Semiconductor device and a method of manufacturing the same
11/29/2011	US8066891 Wet etchable laminated body, insulation film, and electronic circuit part using the laminated body and the film
11/29/2011	US8066057 Flow distributing unit and cooling unit
11/29/2011	CA2519747C Semiconductor apparatus employing light-triggered type semiconductor devices, and method of assembling the same
11/29/2011	CA2462252C Electronic circuit comprising conductive bridges and method for making such bridges
11/24/2011	WO2011146789A1 High q vertical ribbon inductor on semiconducting substrate
11/24/2011	WO2011146755A1 Electrically broken, but mechanically continuous die seal for integrated circuits
11/24/2011	WO2011146751A1 Process for improving package warpage and connection reliability through use of a backside mold configuration (bsmc)
11/24/2011	WO2011146550A1 Uv-curable polymer thick film dielectric compositions with excellent adhesion to ito

1 ... 432 433 434 435 436 437 438 439 440 441 442 443 444 445 446 447 448 449 450 451 452 ... 2262