H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2011
12/01/2011	US20110291257 Integrated circuit packaging system with dual side connection and method of manufacture thereof
12/01/2011	US20110291256 Method for Fabricating a Semiconductor Chip Package and Semiconductor Chip Package
12/01/2011	US20110291255 Carrier for chip packages
12/01/2011	US20110291254 Semiconductor device package featuring encapsulated leadframe with projecting bumps or balls
12/01/2011	US20110291253 Lead frame, electronic component including the lead frame, and manufacturing method thereof
12/01/2011	US20110291252 Method and system for forming a thin semiconductor device
12/01/2011	US20110291251 Integrated circuit packaging system with multiple row leads and method of manufacture thereof
12/01/2011	US20110291250 Semiconductor chip package
12/01/2011	US20110291249 Semiconductor Device and Method of Forming Conductive Posts and Heat Sink Over Semiconductor Die Using Leadframe
12/01/2011	US20110291248 Shielding structure for transmission lines
12/01/2011	US20110291246 Semiconductor chip and semiconductor package with stack chip structure
12/01/2011	US20110291245 Semiconductor Device with Substrate-Side Exposed Device-Side Electrode and Method of Fabrication
12/01/2011	US20110291243 Planarizing etch hardmask to increase pattern density and aspect ratio
12/01/2011	US20110291236 Semiconductor module with electrical switching elements
12/01/2011	US20110291234 Semiconductor circuit structure and method of making the same
12/01/2011	US20110291231 Method of manufacturing a semiconductor component and structure
12/01/2011	US20110291230 Fuse of a Semiconductor Device
12/01/2011	US20110291229 Semiconductor integrated circuit and method for fabricating the same
12/01/2011	US20110291227 Semiconductor device and method for manufacturing
12/01/2011	US20110291195 Depletion-Mode MOSFET Circuit and Applications
12/01/2011	US20110291194 Protection circuit for semiconductor device
12/01/2011	US20110291111 Semiconductor device and semiconductor device manufacturing method
12/01/2011	US20110290552 Method and system for packaging mems devices with incorporated getter
12/01/2011	US20110290545 Through wiring board and method of manufacturing the same
12/01/2011	US20110290543 Method for producing wiring board and wiring board
12/01/2011	US20110290322 Substrate with transparent conductive film and thin film photoelectric conversion device
12/01/2011	DE202011100820U1 Leistungshalbleiter Power semiconductor
12/01/2011	DE102011076651A1 Stromregelung mit thermisch gepaarten Widerständen Current control with thermally matched resistors
12/01/2011	DE102011001770A1 Verfahren und System zum Ausbilden eines dünnen Halbleiterbauelements Method and system for forming a thin semiconductor device
12/01/2011	DE102010029550A1 Verfahren zur Herstellung von Halbleiter-Bauelementen und entsprechendes Halbleiter-Bauelement Process for the preparation of semiconductor devices and corresponding semiconductor device
12/01/2011	DE102010029529A1 Component carrier i.e. metal core printed circuit board, for LED lighting device, has heat guide element arranged on mounting plate and in contact with electronic component, where heat guide element passes through heat sink
12/01/2011	DE102010029526A1 Halbleiterbauelement mit einer gestapelten Chipkonfiguration mit einem integrierten Peltier-Element A semiconductor device comprising a stacked chip configuration with an integrated Peltier element
12/01/2011	DE102010029522A1 Verspannungsverringerung beim Einbringen eines Chips in ein Gehäuse mittels eines um den Chip herum ausgebildeten Spannungskompensationsgebiets Tension reduction during the introduction of a chip into a housing by means of a trained around the chip voltage compensation area
12/01/2011	DE102010029521A1 Chipgehäuse mit mehreren Abschnitten zum Verringern der Chip-Gehäuse-Wechselwirkung Chip package with multiple sections to reduce the chip package interaction
12/01/2011	DE102010029504A1 Bauelement mit einer Durchkontaktierung und Verfahren zu dessen Herstellung Component with a plated-through hole and process for its preparation
12/01/2011	DE102010029368A1 Elektronische Anordnung und Verfahren zum Herstellen einer elektronischen Anordnung An electronic device and method for manufacturing an electronic device
12/01/2011	DE102010021765A1 Anordnung zweier Verbindungspartner mit einer Niedertemperatur Druckinterverbindung Herstellungsverfahren hierzu Arrangement of two link partners with a low-temperature pressure sintering connect method therefor
12/01/2011	DE102010021764A1 Verfahren zur Niedertemperatur Drucksinterverbindung zweier Verbindungspartner und hiermit hergestellte Anordnung Method for low temperature pressure sintering connection of two link partners and hereby made arrangement
12/01/2011	DE102008054932B4 Leistungshalbleitermodul mit versteifter Bodenplatte Power semiconductor module with stiffened bottom plate
12/01/2011	DE102007024160B4 Leistungshalbleitermodul The power semiconductor module
12/01/2011	DE102005042083B4 Chipkartenmodul und Verfahren zur Herstellung eines Chipkartenmoduls Chip card module and method of producing a smart card module
12/01/2011	CA2800209A1 Heat and energy exchange
11/2011
11/30/2011	EP2391192A1 Multilayer circuit substrate
11/30/2011	EP2390914A1 Assembly of two connection partners with low temperature pressure interconnection and method for producing same
11/30/2011	EP2390913A2 Locking device and method for making the same
11/30/2011	EP2390912A1 Cooling module assembly method
11/30/2011	EP2390911A2 Electronic device having electrically grounded heat sink and method of manufacturing the same
11/30/2011	EP2390910A1 Board for mounting component, and package for holding component using same
11/30/2011	EP2390909A1 Miniature packaging for discrete circuit components
11/30/2011	EP2390908A2 Method of manufacturing an electronic device package
11/30/2011	EP2390904A2 Method for low temperature pressure interconnection of two connection partners and assembly manufactured using same
11/30/2011	EP2389686A2 Ic package with capacitors disposed on an interposal layer
11/30/2011	EP2119754B1 Light-emitting device
11/30/2011	EP1979941B1 Structure and method for making high density mosfet circuits with different height contact lines
11/30/2011	EP1759412B1 Electrical subassembly comprising a protective sheathing
11/30/2011	EP1678746B1 Method for forming a dielectric on a copper-containing metallisation
11/30/2011	EP1612891B1 Anisotropic electrically conductive film and method of producing the same
11/30/2011	EP1361610B1 Vaporizer and deposition device using the same
11/30/2011	CN202059718U 散热模组 Thermal Module
11/30/2011	CN202058728U 芯片组合型半导体集成器件 Combined chip semiconductor integrated device
11/30/2011	CN202058727U Aluminum bracket for packaging infrared receiver
11/30/2011	CN202058726U 散热结构 Thermal structure
11/30/2011	CN202058725U 冷凝装置结构改良及其散热模组 Condensing units and cooling modules structural improvements
11/30/2011	CN202058724U 散热装置组合结构 Heat sink composite structure
11/30/2011	CN202058723U 一种功率器件的安装组件 A power device installed components
11/30/2011	CN202058722U 散热模组结构 Thermal module structure
11/30/2011	CN202058721U 一种散热装置的固定结构 A fixing structure of the heat sink
11/30/2011	CN202058720U 散热板改良结构 Improved heat dissipation plate structure
11/30/2011	CN202058719U 蜂巢散热器 Honeycomb radiator
11/30/2011	CN202058718U 一种具有软磁线涂层的芯片 Having a soft magnetic wire coated chip
11/30/2011	CN202058717U Soft display
11/30/2011	CN202058087U Water-cooling head radiator for high-performance CPU
11/30/2011	CN202058082U 改良的散热固定支架结构 Improved heat fixation structure
11/30/2011	CN1965407B 图像传感器的金属互连 Metal interconnect image sensor
11/30/2011	CN102265514A 压电振动设备、压电振动设备的制造方法以及构成压电振动设备的结构构件的蚀刻方法 The method of manufacturing a piezoelectric vibration device, a piezoelectric vibration device and a method of etching the piezoelectric vibration device constituting the structural member
11/30/2011	CN102265395A 用于物理不可复制功能的物理结构 The physical structure of the physical features can not be copied
11/30/2011	CN102265394A 多行引线框架的结构及其半导体封装及制造方法 Structure and method for manufacturing a semiconductor package and a multi-row lead frame
11/30/2011	CN102265393A 电气的或者电子的复合构件以及用于制造该复合构件的方法 Electrical or electronic composite member and a method for manufacturing the composite member
11/30/2011	CN102265323A 显示装置 Display device
11/30/2011	CN102264802A 可uv固化的无机-有机混合树脂及其制备方法 Uv curing can be inorganic - organic hybrid resin and preparation method
11/30/2011	CN102263194A 半导体封装与制造半导体封装的方法 Semiconductor package and method of fabricating a semiconductor package
11/30/2011	CN102263106A 半导体集成电路 The semiconductor integrated circuit
11/30/2011	CN102263103A 包括具有分等级的图案密度的管芯密封的半导体器件 Includes a pattern having a graded density die sealed semiconductor device
11/30/2011	CN102263099A 3d集成电路及其制造方法 3d integrated circuit and its manufacturing method
11/30/2011	CN102263094A 非互联型多芯片封装二极管 Non-interconnected multi-chip package diode
11/30/2011	CN102263093A 桥式器件的封装结构 Bridge device package
11/30/2011	CN102263091A 导线式桥接整流装置 Lead-in bridge rectifier
11/30/2011	CN102263090A 封装系统 Packaging system
11/30/2011	CN102263089A 具有多芯片结构的半导体集成电路 The semiconductor integrated circuit having a multi-chip structure
11/30/2011	CN102263088A 包含多个芯片的封装结构 The package structure comprises a plurality of chips
11/30/2011	CN102263086A 半导体封装结构 Semiconductor package structure
11/30/2011	CN102263085A 封装结构以及封装工艺 Package and packaging process
11/30/2011	CN102263084A 半导体芯片及具有堆叠芯片结构的半导体封装 The semiconductor chip and a semiconductor chip package having stacked structure
11/30/2011	CN102263083A 集成电路结构与其形成方法 The method for forming an integrated circuit structure and its
11/30/2011	CN102263082A 封装基板结构及其制造方法 Package substrate structure and manufacturing method
11/30/2011	CN102263081A 带双凸点的四边扁平无引脚双ic芯片封装件及其生产方法 Four sides with double bump ic chip dual flat no-lead package and its production method
11/30/2011	CN102263080A 带双凸点的四边扁平无引脚三ic芯片封装件及其生产方法 Four sides with dual flat no-lead bumps three ic chip package and its production method
11/30/2011	CN102263079A 半导体封装结构 Semiconductor package structure
11/30/2011	CN102263078A 一种wlcsp封装件 One kind wlcsp package
11/30/2011	CN102263077A 一种双扁平无载体无引脚的ic芯片封装件 A dual flat no-no pin ic chip carrier package

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