H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2011
12/06/2011	US8072058 Semiconductor package having a plurality input/output members
12/06/2011	US8072057 Semiconductor device and method of fabrication
12/06/2011	US8072056 Apparatus for restricting moisture ingress
12/06/2011	US8072055 High density stacked die assemblies, structures incorporated therein and methods of fabricating the assemblies
12/06/2011	US8072054 Lead frame
12/06/2011	US8072053 Leadless integrated circuit package having electrically routed contacts
12/06/2011	US8072052 Trench substrate
12/06/2011	US8072051 Folded lands and vias for multichip semiconductor packages
12/06/2011	US8072049 Polysilicon drift fuse
12/06/2011	US8072048 Semiconductor apparatus
12/06/2011	US8072047 Integrated circuit package system with shield and tie bar
12/06/2011	US8072046 Through-electrode, circuit board having a through-electrode, semiconductor package having a through-electrode, and stacked semiconductor package having the semiconductor chip or package having a through-electrode
12/06/2011	US8072037 Method and system for electrically coupling a chip to chip package
12/06/2011	US8072030 Semiconductor device
12/06/2011	US8072008 Biosensor having ultra fine fiber
12/06/2011	US8071997 LED with light transmissive heat sink
12/06/2011	US8071996 Wavelength-converting casting composition and light-emitting semiconductor component
12/06/2011	US8071893 Methods and apparatus for shielding circuitry from interference
12/06/2011	US8071431 Overmolded semiconductor package with a wirebond cage for EMI shielding
12/06/2011	US8071426 Method and apparatus for no lead semiconductor package
12/06/2011	US8071262 Reticles with subdivided blocking regions
12/06/2011	US8071187 Method for fabricating metallized ceramics substrate, metallized ceramics substrate fabricated by the method, and package
12/06/2011	US8070971 Etch method
12/06/2011	US8069908 Heat dissipation device having a fan holder
12/06/2011	US8069739 Base design for self-centering
12/06/2011	US8069560 Method of manufacturing multilayer wiring board
12/02/2011	DE202011108050U1 Wärmeleitung, wärmeableitendes Modul und Beleuchtungseinrichtung Heat conduction, heat dissipating module and illumination device
12/01/2011	WO2011149780A1 Heat and energy exchange
12/01/2011	WO2011149567A1 Semiconductor device having bucket-shaped under-bump metallization and method of forming same
12/01/2011	WO2011149561A1 Through-silicon vias with low parasitic capacitance
12/01/2011	WO2011149422A1 Method of packaging a wire-bonded integrated circuit
12/01/2011	WO2011149097A1 Multi-chip wiring board and process for producing same, and wiring board and process for producing same
12/01/2011	WO2011149019A1 Method for manufacturing base material having gold-plated metal fine pattern, base material having gold-plated metal fine pattern, printed wiring board, interposer, and semiconductor device
12/01/2011	WO2011148923A1 Curable resin composition and cured product thereof
12/01/2011	WO2011148802A1 Control circuit
12/01/2011	WO2011148728A1 Display device and method for manufacturing same
12/01/2011	WO2011148665A1 Heat dissipation structure for electronic equipment
12/01/2011	WO2011148662A1 Heat dissipating structure of electronic apparatus
12/01/2011	WO2011148628A1 Semiconductor-sealing epoxy resin composition and semiconductor device using same
12/01/2011	WO2011148627A1 Method for producing an esterified substance
12/01/2011	WO2011148505A1 Heat exchanger and method for manufacturing same
12/01/2011	WO2011148491A1 Process for production of semiconductor device
12/01/2011	WO2011148445A1 Semiconductor device and process for production thereof
12/01/2011	WO2011148444A1 Semiconductor device and method for manufacturing same
12/01/2011	WO2011148441A1 Method for manufacturing semiconductor device, and semiconductor device
12/01/2011	WO2011147322A1 Composite getter for maintaining medium and low vacuum environment, and method for producing same
12/01/2011	WO2011147283A1 Heat radiation dissipation film structure and method for making the same
12/01/2011	WO2011147099A1 Arrangement with chip and carrier
12/01/2011	US20110295543 Performance improvement for a multi-chip system via kerf area interconnect
12/01/2011	US20110294238 Semiconductor wafer with electrically connected contact and test areas
12/01/2011	US20110293962 Solder joints with enhanced electromigration resistance
12/01/2011	US20110292742 Stacked Semiconductor Memory Device, Memory System Including The Same, And Method Of Repairing Defects Of Through Silicon Vias
12/01/2011	US20110292708 3d semiconductor device
12/01/2011	US20110292632 Method for manufacturing a semiconductor component and structure therefor
12/01/2011	US20110291741 Current Control Using Thermally Matched Resistors
12/01/2011	US20110291304 Method of making microelectronic package using integrated heat spreader stiffener panel and microelectronic package formed according to the method
12/01/2011	US20110291303 Semiconductor Device, Substrate for Producing Semiconductor Device and Method of Producing Them
12/01/2011	US20110291302 Method and apparatus for manufacturing an electronic assembly, electronic assembly manufactured with the method or in the apparatus
12/01/2011	US20110291301 Method for Producing Semiconductor Components, and Corresponding Semiconductor Component
12/01/2011	US20110291299 Stress Reduction in Chip Packaging by a Stress Compensation Region Formed Around the Chip
12/01/2011	US20110291298 Chip Package Including Multiple Sections for Reducing Chip Package Interaction
12/01/2011	US20110291297 Microelectronic packages having cavities for receiving microelectronic elements
12/01/2011	US20110291296 Package stacking through rotation
12/01/2011	US20110291295 Semiconductor device
12/01/2011	US20110291294 Multi-Chip Package
12/01/2011	US20110291293 Method for manufacturing an electronic module and an electronic module
12/01/2011	US20110291292 Selective Shrinkage of Contact Elements in a Semiconductor Device
12/01/2011	US20110291291 Silicon Chip Having Penetrative Connection Holes
12/01/2011	US20110291290 Semiconductor device
12/01/2011	US20110291289 Semiconductor integrated circuit
12/01/2011	US20110291288 Package systems having interposers
12/01/2011	US20110291287 Through-silicon vias with low parasitic capacitance
12/01/2011	US20110291286 Electronic device and method for connecting a die to a connection terminal
12/01/2011	US20110291285 Semiconductor Device Comprising a Die Seal with Graded Pattern Density
12/01/2011	US20110291284 INTERCONNECT STRUCTURE WITH AN OXYGEN-DOPED SiC ANTIREFLECTIVE COATING AND METHOD OF FABRICATION
12/01/2011	US20110291283 Integrated circuit package system with embedded die superstructure and method of manufacture thereof
12/01/2011	US20110291282 Junction body, semiconductor module, and manufacturing method for junction body
12/01/2011	US20110291281 Partial air gap formation for providing interconnect isolation in integrated circuits
12/01/2011	US20110291280 Semiconductor device and manufacturing method thereof
12/01/2011	US20110291279 Semiconductor article having a through silicon via and guard ring
12/01/2011	US20110291278 Semiconductor devices with low resistance back-side coupling
12/01/2011	US20110291277 Semiconductor device and method of forming semiconductor device
12/01/2011	US20110291275 Method of assembling chips
12/01/2011	US20110291274 Method of manufacturing a semiconductor device
12/01/2011	US20110291273 Chip bump structure and method for forming the same
12/01/2011	US20110291272 Chip structure
12/01/2011	US20110291271 Semiconductor chip and semiconductor device
12/01/2011	US20110291270 Manufacturing method of semiconductor device, and mounting structure thereof
12/01/2011	US20110291269 Semiconductor Device Comprising a Stacked Die Configuration Including an Integrated Peltier Element
12/01/2011	US20110291268 Semiconductor wafer structure and multi-chip stack structure
12/01/2011	US20110291267 Semiconductor wafer structure and multi-chip stack structure
12/01/2011	US20110291266 Semiconductor integrated circuit having a multi-chip structure
12/01/2011	US20110291265 Semiconductor integrated circuit having a multi-chip structure
12/01/2011	US20110291264 Integrated circuit packaging system with posts and method of manufacture thereof
12/01/2011	US20110291263 Ic having dielectric polymeric coated protruding features having wet etched exposed tips
12/01/2011	US20110291262 Strength of Micro-Bump Joints
12/01/2011	US20110291261 Three dimensional stacked package structure
12/01/2011	US20110291260 Semiconductor encapsulation adhesive composition, semiconductor encapsulation film-like adhesive, method for producing semiconductor device and semiconductor device
12/01/2011	US20110291259 Reliable metal bumps on top of I/O pads after removal of test probe marks
12/01/2011	US20110291258 Heat radiation component and semiconductor package including same

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