Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2014
12/10/2014CN102299621B 开关电源用装置、开关电源电路以及电气设备 Switching power supply equipment, switching power supply circuit and electrical equipment
12/10/2014CN102299177B 一种接触的制造方法以及具有该接触的半导体器件 A method of manufacturing a semiconductor device having a contact and the contact
12/10/2014CN102246299B 用于制作通路互连的方法 The method for making the interconnection path
12/10/2014CN102187570B 包括具有不同开启功率水平的并联晶体管放大器组的集成电路 An integrated circuit including a transistor amplifier connected in parallel groups that have different power levels open
12/10/2014CN102153960B 倒装芯片型半导体背面用膜 The back of a flip-chip type semiconductor film
12/10/2014CN102142404B 半导体器件和通信方法 Semiconductor device and communication method
12/10/2014CN102127391B 一种抗辐射复合材料及其配备方法 A radiation composite material and is equipped with anti-method
12/10/2014CN102097391B 功率半导体模块 Power Semiconductor Modules
12/10/2014CN102082138B 导电结构和集成电路器件 Conductive structure and integrated circuit devices
12/10/2014CN102082104B 用于制造半导体器件的方法 The method for manufacturing a semiconductor device
12/10/2014CN101996894B 半导体器件和围绕管芯周边形成坝材料以减小翘曲的方法 Semiconductor device and method of forming a dam around the periphery of the die to reduce the warpage of the material
12/10/2014CN101946403B 压电振动器、压电振动器的制造方法、振荡器、电子设备及电波钟 A piezoelectric vibrator, a method of manufacturing a piezoelectric vibrator, an oscillator, an electronic device and radio clock
12/10/2014CN101893774B 液晶显示面板及其制造方法 A liquid crystal display panel and manufacturing method thereof
12/10/2014CN101827782B 使用纳米结构连接和粘接相邻层 Use nanostructures connection and bonding of adjacent layers
12/09/2014US8909135 Wireless communication with dielectric medium
12/09/2014US8908385 Interface module
12/09/2014US8908384 Motherboard substrate having no memory interconnects
12/09/2014US8908373 Cooling structure for an electronic component and electronic instrument
12/09/2014US8908345 Semiconductor device
12/09/2014US8908069 Handheld imaging device with quad-core image processor integrating image sensor interface
12/09/2014US8908051 Handheld imaging device with system-on-chip microcontroller incorporating on shared wafer image processor and image sensor
12/09/2014US8907503 Manufacturing an underfill in a semiconductor chip package
12/09/2014US8907502 Encapsulating layer-covered semiconductor element, producing method thereof, and semiconductor device
12/09/2014US8907501 Method of packaging a die
12/09/2014US8907500 Multi-die wirebond packages with elongated windows
12/09/2014US8907499 Three dimensional structure memory
12/09/2014US8907498 Semiconductor device and method of forming a shielding layer between stacked semiconductor die
12/09/2014US8907497 Semiconductor device with self-aligned interconnects and blocking portions
12/09/2014US8907496 Circuit structures and methods of fabrication with enhanced contact via electrical connection
12/09/2014US8907495 Semiconductor device and manufacturing method thereof
12/09/2014US8907494 Electrical leakage reduction in stacked integrated circuits having through-silicon-via (TSV) structures
12/09/2014US8907493 Semiconductor device and method of manufacturing the same
12/09/2014US8907492 Semiconductor device
12/09/2014US8907491 Pitch quartering to create pitch halved trenches and pitch halved air gaps
12/09/2014US8907490 Semiconductor packages having the first and second chip inclined sidewalls contact with each other
12/09/2014US8907489 Wiring substrate, method of manufacturing the same, and semiconductor device
12/09/2014US8907488 Microbump and sacrificial pad pattern
12/09/2014US8907487 Electronic device packages having bumps and methods of manufacturing the same
12/09/2014US8907485 Copper ball bond features and structure
12/09/2014US8907484 Semiconductor device and method for manufacturing same
12/09/2014US8907483 Semiconductor device having a self-forming barrier layer at via bottom
12/09/2014US8907482 Integrated circuit package including wire bond and electrically conductive adhesive electrical connections
12/09/2014US8907481 Stack of semiconductor structures and corresponding manufacturing method
12/09/2014US8907480 Chip arrangements
12/09/2014US8907479 Treating copper surfaces for packaging
12/09/2014US8907478 Bump pad structure
12/09/2014US8907477 Unit for semiconductor device and semiconductor device
12/09/2014US8907476 Semiconductor device and method of forming sacrificial protective layer to protect semiconductor die edge during singulation
12/09/2014US8907475 Pb-free solder-connected structure
12/09/2014US8907473 Semiconductor device having a diamond substrate heat spreader
12/09/2014US8907472 3DIC package comprising perforated foil sheet
12/09/2014US8907471 Window interposed die packaging
12/09/2014US8907470 Millimeter wave wafer level chip scale packaging (WLCSP) device and related method
12/09/2014US8907469 Integrated circuit package assembly and method of forming the same
12/09/2014US8907468 Semiconductor device
12/09/2014US8907467 PCB based RF-power package window frame
12/09/2014US8907466 Stackable molded microelectronic packages
12/09/2014US8907465 Methods and devices for packaging integrated circuits
12/09/2014US8907464 Helix substrate and three-dimensional package with same
12/09/2014US8907463 Semiconductor device including stacked semiconductor chips
12/09/2014US8907462 Integrated circuit package
12/09/2014US8907461 Heat dissipation device embedded within a microelectronic die
12/09/2014US8907460 Semiconductor device
12/09/2014US8907459 Three-dimensional semiconductor integrated circuit device and method of fabricating the same
12/09/2014US8907458 Creation of vias and trenches with different depths
12/09/2014US8907457 Microelectronic devices with through-substrate interconnects and associated methods of manufacturing
12/09/2014US8907451 Semiconductor chip and semiconductor apparatus with embedded capacitor
12/09/2014US8907448 Small size and fully integrated power converter with magnetics on chip
12/09/2014US8907446 Integrated circuit structure with capacitor and resistor and method for forming
12/09/2014US8907442 System comprising a semiconductor device and structure
12/09/2014US8907441 Methods for double-patterning-compliant standard cell design
12/09/2014US8907424 Protection diode
12/09/2014US8907407 Semiconductor device covered by front electrode layer and back electrode layer
12/09/2014US8907405 Semiconductor structures with dual trench regions and methods of manufacturing the semiconductor structures
12/09/2014US8907393 Semiconductor device having buried bit lines and method for fabricating the same
12/09/2014US8907382 Semiconductor device and fabrication method thereof
12/09/2014US8907373 Electronic device for protecting from electrostatic discharge
12/09/2014US8907367 Light emission device
12/09/2014US8907354 Optoelectronic device having an elastic electrode
12/09/2014US8907340 Semiconductor arrangement with an integrated hall sensor
12/09/2014US8907323 Microprocessor assembly
12/09/2014US8907225 Structures and methods related to detection, sensing, and/or mitigating undesirable structures or intrusion events on structures
12/09/2014US8907038 Typical metal containing polysiloxane composition, process for its production, and its uses
12/09/2014US8906809 Multichip electronic packages and methods of manufacture
12/09/2014US8906804 Composition including material, methods of depositing material, articles including same and systems for depositing materials
12/09/2014US8906803 Method of forming through substrate vias (TSVs) and singulating and releasing die having the TSVs from a mechanical support substrate
12/09/2014US8906801 Processes for forming integrated circuits and integrated circuits formed thereby
12/09/2014US8906800 Stacked digital/RF system-on-chip with integral isolation layer
12/09/2014US8906799 Random local metal cap layer formation for improved integrated circuit reliability
12/09/2014US8906797 Microelectronic flip chip packages with solder wetting pads and associated methods of manufacturing
12/09/2014US8906791 Method of improving film non-uniformity and throughput
12/09/2014US8906781 Method for electrically connecting wafers using butting contact structure and semiconductor device fabricated through the same
12/09/2014US8906777 Methods for evaluating and manufacturing semiconductor wafer
12/09/2014US8906749 Method for fabricating a semiconductor device
12/09/2014US8906748 Method for packaging a semiconductor structure
12/09/2014US8906747 Cavity-type semiconductor package and method of packaging same
12/09/2014US8906746 Method for producing semiconductor device
12/09/2014US8906744 Microelectronic die packages with metal leads, including metal leads for stacked die packages, and associated systems and methods
12/09/2014US8906743 Semiconductor device with molded casing and package interconnect extending therethrough, and associated systems, devices, and methods
12/09/2014US8906741 Electronic package structure having side-wing parts outside of a package layer for dissipating heat and method for making the same
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