H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2011
12/07/2011	CN102270638A 一种半导体集成器件及其制造方法 A semiconductor integrated device and manufacturing method thereof
12/07/2011	CN102270635A 化合物半导体装置及其制造方法 The compound semiconductor device and manufacturing method thereof
12/07/2011	CN102270625A 一种虚拟金属填充结构及带虚拟金属填充物的平面电感器 A virtual metal fill structures and planar inductor with virtual metal filler
12/07/2011	CN102270624A 配线基板及其制造方法 Wiring board and manufacturing method thereof
12/07/2011	CN102270623A 芯片的凸块结构及凸块结构的制造方法 Bump structure and manufacturing method of the chip bump structure
12/07/2011	CN102270622A 裸片尺寸半导体元件封装及其制造方法 Die size and method of manufacturing a semiconductor device package
12/07/2011	CN102270621A 包括多个管芯和引线取向的管芯封装 Includes a plurality of dies and the leads of the die package orientation
12/07/2011	CN102270620A 在边缘引脚具有凹槽的半导体封装结构 At the edge of a semiconductor package pin recess
12/07/2011	CN102270619A 用于电子封装组件的焊盘配置 The pad configuration for an electronic package assembly
12/07/2011	CN102270618A 晶片封装体 Chip package
12/07/2011	CN102270617A 一种倒装芯片凸块结构及其制作工艺 A flip chip bump structure and manufacturing process
12/07/2011	CN102270616A 晶片级封装结构及其制造方法 Wafer-level package structure and manufacturing method
12/07/2011	CN102270615A 功率半导体装置 Power semiconductor device
12/07/2011	CN102270614A 具有备援功能的散热风扇系统 Have redundant cooling fan system function
12/07/2011	CN102270613A 功率半导体装置 The power semiconductor device
12/07/2011	CN102270612A 芯片封装体与电子组装体 Chip package and electronic assembly
12/07/2011	CN102270611A 半导体装置 Semiconductor device
12/07/2011	CN102270610A 集成电路装置及封装组件 The integrated circuit device and package assembly
12/07/2011	CN102270590A 晶圆级封装结构及封装方法 Wafer-level packaging structure and packaging method
12/07/2011	CN102270589A 半导体元件的制造方法和相应的半导体元件 The method of manufacturing a semiconductor element and the corresponding semiconductor element
12/07/2011	CN102270588A 在半导体管芯周围形成emi屏蔽层的半导体器件和方法 Semiconductor device and method of the semiconductor die is formed around the shielding layer emi
12/07/2011	CN102270585A 电路板结构、封装结构与制作电路板的方法 Circuit board structure, package structure and method of making the circuit board
12/07/2011	CN102270584A 电路板结构、封装结构与制作电路板的方法 Circuit board structure, package structure and method of making the circuit board
12/07/2011	CN102270532A 3d电感器和变压器 3d inductors and transformers
12/07/2011	CN102270457A 长形条及晶圆 An elongated strip and wafer
12/07/2011	CN102267260A 具有激光烧结的底板的基片 A laser sintered substrate plate
12/07/2011	CN102005431B Flip-dual face graphic-chip plating-first and etching-second single encapsulation method
12/07/2011	CN101955629B 可用作半导体封装材料的环氧树脂组合物 The epoxy resin composition useful as semiconductor encapsulating material
12/07/2011	CN101901769B 引线框的微爆处理方法 Microburst treatment leadframe
12/07/2011	CN101894834B Bridge drive circuit chip
12/07/2011	CN101887883B 一种mtm反熔丝单元结构及其制备方法 Mtm one kind of anti-fuse unit structure and its preparation method
12/07/2011	CN101866892B 芯片的布局结构与方法 Chip layout structure and methods
12/07/2011	CN101859738B 大面积液冷式散热装置 Large liquid-cooled heat sink
12/07/2011	CN101853832B Base island exposed type and embedded type base island lead frame structure and first-engraving last-plating method thereof
12/07/2011	CN101814525B 用于FinFET的ESD保护 ESD protection for FinFET
12/07/2011	CN101814446B Island expose and multi-salient-point island expose lead frame structure and carving and plating method thereof
12/07/2011	CN101800206B 半导体封装构造及其封装方法 Semiconductor package and packaging method
12/07/2011	CN101789429B 金属-绝缘体-金属电容结构及其制造方法 Metal - insulator - metal capacitor structure and manufacturing method
12/07/2011	CN101789423B U盘结构及其封装方法 U disk structure and packaging method
12/07/2011	CN101752360B 静电放电保护电路及元件 Electrostatic discharge protection circuit and components
12/07/2011	CN101752320B 半导体芯片结构 Semiconductor chip structures
12/07/2011	CN101752261B 半导体工艺及应用此工艺所形成的硅基板及芯片封装结构 Silicon substrate of semiconductor technology and application of this process and the formation of the chip package structure
12/07/2011	CN101740416B 一种四方扁平无引脚封装结构及其封装方法 One kind of quad flat no-lead package and packaging method
12/07/2011	CN101724361B 各向异性导电胶和导电膜以及电连接方法 Anisotropic conductive adhesive and electrically connected to the conductive film and a method
12/07/2011	CN101681900B 接触垫和形成用于集成电路的接触垫的方法 Contacting the contact pads and method for forming an integrated circuit pad
12/07/2011	CN101656255B Nand闪存及其制作方法 Nand Flash and production methods
12/07/2011	CN101626154B 集成电路esd全芯片防护电路 Esd full-chip integrated circuit protection circuit
12/07/2011	CN101621045B 电路基板及其形成方法以及半导体封装 And a circuit board and method of forming a semiconductor package
12/07/2011	CN101609819B 导线架芯片封装结构及其制造方法 Lead frame chip package structure and manufacturing method
12/07/2011	CN101587902B 一种纳米绝缘体上硅结构材料及其制作方法 Silicon structure material and manufacturing method of a nano-on-insulator
12/07/2011	CN101577233B 集成电路元件的封装结构及其制造方法 Package structure and method of manufacturing an integrated circuit device
12/07/2011	CN101567363B 双极结型晶体管发射极的镇流电阻 Bipolar junction transistor emitter ballast resistors
12/07/2011	CN101567359B 半导体装置 Semiconductor device
12/07/2011	CN101563776B 引线框固定材料、引线框及半导体装置 Fixed leadframe material, lead frame and semiconductor device
12/07/2011	CN101558499B 用于在沟槽栅极fet内形成横向延伸电介质层的结构及方法 Laterally extended dielectric layer structure and a method for forming the gate electrode in the trench fet
12/07/2011	CN101552258B 半导体器件的熔丝部以及制造方法 Fuse unit and a method of manufacturing a semiconductor device
12/07/2011	CN101510559B 功率金属氧化物半导体晶体管元件与布局 Power metal oxide semiconductor transistor elements and layout
12/07/2011	CN101494207B 半导体芯片及具有该半导体芯片的叠层半导体封装 The semiconductor chip and a semiconductor package having a laminate of the semiconductor chip
12/07/2011	CN101473433B 功率放大器装置 Power amplifier device
12/07/2011	CN101465336B 具有含硅铜布线层的半导体器件及其制造方法 Semiconductor device and manufacturing method of a copper wiring layer having a silicon-containing
12/07/2011	CN101359618B 通孔填充方法、通孔填充结构及通孔制作方法 The method of filling the through hole, the through hole filling structure and method of making the through hole
12/07/2011	CN101355092B 用于光电装置的封装结构 For photovoltaic device package structure
12/07/2011	CN101351399B 电子部件密封用基板、可取多个形态的电子部件密封用基板、及使用了电子部件密封用基板的电子装置及其制法 Electronic component sealing substrate, preferably a plurality of electronic component sealing substrate morphology, and using the electronic component sealing substrate of the electronic device and its preparation method
12/07/2011	CN101308161B 具有模制树脂壳体的电子设备及其制造方法和模制工具 Electronic device and method of manufacturing a molded resin case having a molding tool and
12/07/2011	CN101295759B 功率型led封装底座 Power type led package base
12/07/2011	CN101290912B 半导体装置及其制造方法 Semiconductor device and manufacturing method
12/07/2011	CN101286492B 半导体封装及层叠型半导体封装 The semiconductor package and the laminated semiconductor package
12/07/2011	CN101238555B 层间绝缘膜、布线结构以及它们的制造方法 An interlayer insulating film, a wiring structure and manufacturing method thereof
12/07/2011	CN101236946B 布线板和半导体器件 Wiring boards and semiconductor devices
12/07/2011	CN101211897B 多芯片半导体封装结构及封装方法 Multi-chip semiconductor package structure and encapsulation method
12/07/2011	CN101165879B 非易失性存储器件及其形成方法 Non-volatile memory device and method of forming
12/07/2011	CN101150102B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/07/2011	CN101064270B 半导体器件的制造方法 The method of manufacturing a semiconductor device
12/06/2011	US8074197 Shielding mesh design for an integrated circuit device
12/06/2011	US8072761 Power semiconductor heatsinking
12/06/2011	US8072336 Rubber-covered RFID module, and pneumatic tire having the it is embedded
12/06/2011	US8072085 Semiconductor device with plastic package molding compound, semiconductor chip and leadframe and method for producing the same
12/06/2011	US8072084 Integrated circuit, circuit system, and method of manufacturing
12/06/2011	US8072083 Stacked electronic component package having film-on-wire spacer
12/06/2011	US8072082 Pre-encapsulated cavity interposer
12/06/2011	US8072081 Microelectromechanical system package
12/06/2011	US8072080 Connection structure, electro-optical device, and method for production of electro-optical device
12/06/2011	US8072079 Through hole vias at saw streets including protrusions or recesses for interconnection
12/06/2011	US8072078 Semiconductor device and dummy pattern arrangement method
12/06/2011	US8072077 Semiconductor memory device
12/06/2011	US8072076 Bond pad structures and integrated circuit chip having the same
12/06/2011	US8072075 CuSiN/SiN diffusion barrier for copper in integrated-circuit devices
12/06/2011	US8072074 Semiconductor device and method of manufacturing same
12/06/2011	US8072072 Integrated circuit including different types of gate stacks, corresponding intermediate integrated circuit structure and corresponding integrated circuit
12/06/2011	US8072071 Semiconductor device including conductive element
12/06/2011	US8072070 Low fabrication cost, fine pitch and high reliability solder bump
12/06/2011	US8072069 Semiconductor device and method of manufacturing a semiconductor device
12/06/2011	US8072068 Semiconductor device and a method for manufacturing the same
12/06/2011	US8072067 Semiconductor structure
12/06/2011	US8072066 Metal interconnects for integrated circuit die comprising non-oxidizing portions extending outside seal ring
12/06/2011	US8072065 System and method for integrated waveguide packaging
12/06/2011	US8072062 Circuit device with at least partial packaging and method for forming
12/06/2011	US8072061 Semiconductor device with cooling element
12/06/2011	US8072060 Semiconductor fingerprint apparatus with flat touch surface
12/06/2011	US8072059 Semiconductor device and method of forming UBM fixed relative to interconnect structure for alignment of semiconductor die

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