H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2011
12/08/2011	US20110298465 Process monitor and semiconductor manufacturing apparatus
12/08/2011	US20110298140 Component having a through-contact
12/08/2011	US20110298139 Semiconductor Package
12/08/2011	US20110298138 Standard cell and semiconductor device including the same
12/08/2011	US20110298137 Semiconductor Device and Method of Forming Sacrificial Adhesive Over Contact Pads of Semiconductor Die
12/08/2011	US20110298136 Mems integrated chip with cross-area interconnection
12/08/2011	US20110298135 Integrated circuit and process for fabricating thereof
12/08/2011	US20110298134 Three dimensional interconnect structure and method thereof
12/08/2011	US20110298133 Semiconductor device
12/08/2011	US20110298132 Ultra-low power swnt interconnects for sub-threshold circuits
12/08/2011	US20110298131 Yttrium contacts for germanium semiconductor radiation detectors
12/08/2011	US20110298130 Semiconductor devices with through-silicon vias
12/08/2011	US20110298129 Stacked package
12/08/2011	US20110298128 Multi-chip package with pillar connection
12/08/2011	US20110298127 Semiconductor Device
12/08/2011	US20110298126 Carrier-free semiconductor package and fabrication method
12/08/2011	US20110298125 Integrated circuit packaging system with multipart conductive pillars and method of manufacture thereof
12/08/2011	US20110298124 Semiconductor Structure
12/08/2011	US20110298123 Cu pillar bump with non-metal sidewall spacer and metal top cap
12/08/2011	US20110298122 Integrated circuit apparatus, systems, and methods
12/08/2011	US20110298121 Power semiconductor device
12/08/2011	US20110298120 Apparatus for Thermally Enhanced Semiconductor Package
12/08/2011	US20110298118 Semiconductor device
12/08/2011	US20110298117 Pad configurations for an electronic package assembly
12/08/2011	US20110298116 Semiconductor device and production method thereof
12/08/2011	US20110298115 Semiconductor component and method of manufacture
12/08/2011	US20110298114 Stacked interposer leadframes
12/08/2011	US20110298113 Integrated circuit packaging system with increased connectivity and method of manufacture thereof
12/08/2011	US20110298112 Semiconductor module and semiconductor device
12/08/2011	US20110298111 Semiconductor package and manufactring method thereof
12/08/2011	US20110298110 Semiconductor Device and Method of Forming Thermally Conductive Layer Between Semiconductor Die and Build-Up Interconnect Structure
12/08/2011	US20110298109 Semiconductor device and method of forming prefabricated emi shielding frame with cavities containing penetrable material over semiconductor die
12/08/2011	US20110298108 Non-leaded integrated circuit package system with multiple ground sites
12/08/2011	US20110298106 Integrated circuit packaging system with magnetic film and method of manufacture thereof
12/08/2011	US20110298105 Semiconductor Device and Method of Forming Shielding Layer After Encapsulation and Grounded Through Interconnect Structure
12/08/2011	US20110298104 Semiconductor Body with a Protective Structure and Method for Manufacturing the Same
12/08/2011	US20110298103 Semiconductor package and method of manufacturing the semiconductor package
12/08/2011	US20110298102 Semiconductor package and method of manufacturing the semiconductor package
12/08/2011	US20110298101 Semiconductor Device and Method of Forming EMI Shielding Layer with Conductive Material Around Semiconductor Die
12/08/2011	US20110298096 Semiconductor chip
12/08/2011	US20110298095 Passivation layer extension to chip edge
12/08/2011	US20110298087 Electrical fuse device based on a phase-change memory element and corresponding programming method
12/08/2011	US20110298086 Fuse Structures, E-Fuses Comprising Fuse Structures, and Semiconductor Devices Comprising E-Fuses
12/08/2011	US20110298077 Methods of fabrication of package assemblies for optically interactive electronic devices and package assemblies therefor
12/08/2011	US20110298056 Contact resistivity reduction in transistor devices by deep level impurity formation
12/08/2011	US20110298031 Semiconductor memory device including multi-layer gate structure
12/08/2011	US20110298020 Semiconductor device
12/08/2011	US20110298013 Vertical Structure Semiconductor Memory Devices And Methods Of Manufacturing The Same
12/08/2011	US20110297935 Semiconductor device with appraisal circuitry
12/08/2011	US20110297933 Semiconductor Packages
12/08/2011	US20110297932 Semiconductor device and integrated semiconductor device
12/08/2011	US20110297362 Micro-chimney and thermosiphon die-level cooling
12/08/2011	DE102011076886A1 Leistungshalbleitervorrichtung Power semiconductor device
12/08/2011	DE102011076883A1 Halbleitervorrichtung Semiconductor device
12/08/2011	DE102011076610A1 Stromsensor, inverterschaltung und diese aufweisende halbleitervorrichtung Current sensor, inverter circuit and semiconductor device having these
12/08/2011	DE102011050228A1 Halbleiter-Package mit Induktionsspule The semiconductor package with induction coil
12/08/2011	DE102011000751A1 Halbleiter-Bauelement mit einem einen Hohlraum aufweisenden Träger und Herstellungsverfahren Semiconductor device with a carrier having a cavity and manufacturing method
12/08/2011	DE102010038731B3 Submodul und Leistungshalbleitermodul Submodule and power semiconductor module
12/08/2011	DE102010029760A1 Bauelement mit einer Durchkontaktierung Component with a via
12/08/2011	DE102010029650A1 Halbleiterbauelement und Verfahren zur Herstellung desselben A semiconductor device and method of manufacturing the same
12/08/2011	DE102010022968A1 Vorrichtung zum thermoelektrischen Erzeugen von elektrischer Energie Apparatus for thermoelectric generating electrical energy
12/08/2011	DE102010022668A1 Thermoelektrisches Element und Modul umfassend mehrere derartige Elemente The thermoelectric element and module comprising a plurality of such elements
12/08/2011	DE102009017733B4 Leistungshalbleitermodul mit einer Verbindungseinrichtung und mit als Kontaktfeder ausgebildeten internen Anschlusselementen Power semiconductor module with a connection device and designed as a contact spring with internal connection elements
12/08/2011	DE102007014389B4 Ein Verfahren zum Erzeugen einer Mehrzahl von Halbleiterbauteilen A method for generating a plurality of semiconductor devices
12/08/2011	DE102006013721B4 Halbleiterschaltungsanordnung und zugehöriges Verfahren zur Temperaturerfassung A semiconductor circuit arrangement, and associated method for temperature detection
12/08/2011	DE102005051065B4 Integrierte Halbleiterschaltung zum Zuschalten einer Spannungsdomäne Integrated semiconductor circuit for switching a voltage domain
12/08/2011	DE102005031658B4 Bleifreies Glas für elektronische Bauelemente Lead-free glass for electronic components
12/08/2011	DE102004014709B4 Halbleiteranordnung mit Abstrahlungsteilen A semiconductor device having radiating parts
12/08/2011	DE10136285B4 Integrierte Halbleiterschaltungsvorrichtung und Verfahren zum Anbringen von Schaltungsblöcken in der integrierten Halbleiterschaltungsvorrichtung A semiconductor integrated circuit apparatus and method for attaching of circuit blocks in the semiconductor integrated circuit device
12/07/2011	EP2393113A1 Semiconductor device and power supply circuit
12/07/2011	EP2393112A2 Inductive circuit arrangement
12/07/2011	EP2393111A1 Inductive bond-wire circuit
12/07/2011	EP2393110A1 Heat dissipating base body and electronic device using same
12/07/2011	EP2393109A1 Semiconductor components including conductive through-wafer vias
12/07/2011	EP2392607A2 Composition for thermosetting silicone resin
12/07/2011	EP2392028A2 Integrated circuit inductor with doped substrate
12/07/2011	EP2392027A1 Composite component and method for producing a composite component
12/07/2011	EP2392026A2 Method and apparatus for performing rlc modeling and extraction for three-dimensional integrated circuit (3d-ic) designs
12/07/2011	EP2392009A1 Structure and method for fabricating cladded conductive lines in magnetic memories
12/07/2011	CN202068706U 恒温热腔式散热器 Thermostatic radiator heat chamber
12/07/2011	CN202068360U 适用于抽出式中压固态软起动器的功率组件 Suitable for withdrawable medium voltage solid-state soft starter power components
12/07/2011	CN202067817U 光伏电池接线盒 PV Junction Box
12/07/2011	CN202067793U 高抗静电能力的肖特基二极管 High antistatic ability Schottky diode
12/07/2011	CN202067792U Semiconductor chip and memory device
12/07/2011	CN202067789U 一种to220b-5l防水密封引线框架 One kind to220b-5l waterproof seal leadframe
12/07/2011	CN202067788U 一种to220b-7l防水密封引线框架 One kind to220b-7l waterproof seal leadframe
12/07/2011	CN202067301U 双基板式存储卡封装构造 Dual memory card package substrate structure
12/07/2011	CN202064018U 一种改进的半导体引线框架中圆盘电镀结构 An improved semiconductor lead frame plating disc structure
12/07/2011	CN1768559B 多层印刷电路板 Multilayer printed circuit board
12/07/2011	CN1716587B 内插器及其制造方法以及使用该内插器的半导体器件 Interpolator using the method of manufacturing the interposer and a semiconductor device
12/07/2011	CN102272925A 用于制造照明用具的方法 Method for manufacturing lighting appliances
12/07/2011	CN102272922A 具有夹互连的半导体管芯封装 Sandwiched interconnected semiconductor die package
12/07/2011	CN102272921A 电或电子复合元件以及制造电或电子复合元件的方法 Electrical or electronic component and a method of manufacturing a composite electrical or electronic composite component
12/07/2011	CN102272920A 包括低应力配置的半导体管芯封装 Including low stress configuration of a semiconductor die package
12/07/2011	CN102272919A 半导体器件及其制造方法、毫米波电介质内传输装置及其制造方法、以及毫米波电介质内传输系统 Semiconductor device and manufacturing method of the millimeter-wave dielectric transmission device and its manufacturing method, and a millimeter-wave dielectric transmission power in the system
12/07/2011	CN102272916A 具有熔丝型硅通孔的3d芯片叠层 3d chip stack has a fuse-type silicon vias
12/07/2011	CN102272904A 通过用于晶圆到晶圆结合的化学机械抛光工艺来形成沟道式电容器和通孔连接的方法 A method of forming a trench capacitor and a through hole for connection by a wafer-to-wafer bonding chemical mechanical polishing process of
12/07/2011	CN102272903A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/07/2011	CN102270657A 半导体元件 Semiconductor components
12/07/2011	CN102270645A 显示装置及其制造方法 Display device and manufacturing method

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