H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2011
12/14/2011	CN102280417A 一种用于电路板的散热装置 A heat sink for the circuit board
12/14/2011	CN102280416A Semiconductor device and method of manufacture thereof
12/14/2011	CN102280415A 封装结构、印制电路板组件和固定方法 Package, printed circuit board assembly and method of fixing
12/14/2011	CN102280414A 制造半导体器件的方法 The method of manufacturing a semiconductor device
12/14/2011	CN102280413A 应力释放单元及其制造方法、安装结构和电子装置 Stress relief unit and its manufacturing method, and electronic device mounting structure
12/14/2011	CN102280392A 具有敷镀通孔的结构元件 Having a through-hole plating structural element
12/14/2011	CN102280391A 晶圆级封装结构及其形成方法 Wafer-level packaging structure and method of forming
12/14/2011	CN102280389A 一种提高单晶铜键合丝封装性能的制备工艺 An increase preparation of single crystal copper bonding wire package performance
12/14/2011	CN102280388A 基于单晶铜键合丝的制备方法 Based on the preparation method of single crystal copper bonding wire
12/14/2011	CN102280371A 可挠性电子元件及其制造方法 The flexible electronic device and manufacturing method
12/14/2011	CN102280367A 保护对准标记的方法及以此方法形成的半导体元件 The semiconductor protection element and a method of alignment marks formed in this way
12/14/2011	CN102277124A 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 Adhesive composition, a circuit connecting material, a circuit member connection structure and a semiconductor device
12/14/2011	CN102277123A 粘接剂组合物、电路连接材料、电路构件的连接结构及半导体装置 Adhesive composition, a circuit connecting material, a circuit member connection structure and a semiconductor device
12/14/2011	CN102277096A 各向异性导电性粘结剂及使用了该粘结剂的电极连接方法 The anisotropic conductive adhesive and electrically connected using the method of the binder
12/14/2011	CN102277091A 粘接剂组合物、电路连接材料、电路构件的连接构造及半导体装置 Adhesive composition, a circuit connecting material, circuit member connection structure and a semiconductor device
12/14/2011	CN101826482B 晶片固持系统、系统及配合晶片载具使用的晶片 Chip wafer holding systems, systems and tools for use with the wafer
12/14/2011	CN101814479B 电极接触结构及其制造方法 Electrode contact structure and manufacturing method
12/14/2011	CN101762195B 传热装置、电子设备以及生产传热装置的方法 The method of heat transfer device, the electronic device and the production of the heat transfer device
12/14/2011	CN101752347B 一种防静电保护结构及其制作方法 An electrostatic protection structure and method of making anti-
12/14/2011	CN101743619B 半导体器件的分离 Separating the semiconductor device
12/14/2011	CN101740468B 深沟槽二次刻蚀接触孔及刻蚀方法 The second contact hole deep trench etching and etching method
12/14/2011	CN101710580B Bipolar电路的多层复合钝化层结构及其生成工艺方法 Passivation layer multilayer composite structure Bipolar circuit and method for generating process
12/14/2011	CN101677092B 芯片封装结构 Chip package
12/14/2011	CN101647110B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/14/2011	CN101635301B 光电转换装置 Photoelectric conversion means
12/14/2011	CN101581880B 半导体封装件及其制造方法 Semiconductor package and its manufacturing method
12/14/2011	CN101577247B 把金属和超低k值电介质集成 Metal and ultra low-k dielectric integration
12/14/2011	CN101561090B 一种具有散热装置的led灯模组 Having a heat sink module led lights
12/14/2011	CN101472444B 散热装置 Cooling devices
12/14/2011	CN101447460B 制造电子装置的方法及电子装置 The method of manufacturing an electronic device and electronic apparatus
12/14/2011	CN101394729B 散热器及其制造方法 Heat sink and a manufacturing method
12/14/2011	CN101373742B 具有密封环结构的半导体器件及其形成方法 Semiconductor device having a sealing ring structure and method of forming
12/14/2011	CN101362585B 半导体装置、引线框架及传声器封装结构 The semiconductor device, lead frame and the microphone package
12/14/2011	CN101295722B 半导体器件及其制造方法、光测定装置、光检测装置 Semiconductor device and manufacturing method for an optical device, an optical detection means measuring
12/14/2011	CN101110293B 超小型电力变换装置及其制造方法 Device and method for manufacturing ultra-small power conversion
12/14/2011	CN101043033B 半导体集成电路装置 The semiconductor integrated circuit device
12/13/2011	US8077466 Heat sink, semiconductor device, and method of manufacturing heat sink
12/13/2011	US8077465 Heat sink assembly with fixing member
12/13/2011	US8077248 Optical device and production method thereof
12/13/2011	US8076788 Off-chip vias in stacked chips
12/13/2011	US8076787 Semiconductor device, manufacturing method thereof, and manufacturing method of semiconductor module
12/13/2011	US8076786 Semiconductor package and method for packaging a semiconductor package
12/13/2011	US8076785 Semiconductor device
12/13/2011	US8076784 Stacked semiconductor chips
12/13/2011	US8076783 Memory devices having contact features
12/13/2011	US8076780 Semiconductor device with pads of enhanced moisture blocking ability
12/13/2011	US8076779 Reduction of macro level stresses in copper/low-K wafers
12/13/2011	US8076778 Method for preventing Al-Cu bottom damage using TiN liner
12/13/2011	US8076777 Glass compositions used in conductors for photovoltaic cells
12/13/2011	US8076776 Integrated circuit package having security feature and method of manufacturing same
12/13/2011	US8076775 Semiconductor package and method for making the same
12/13/2011	US8076774 Transistor clamping device
12/13/2011	US8076773 Thermal interface with non-tacky surface
12/13/2011	US8076772 Printed circuit board, memory module having the same and fabrication method thereof
12/13/2011	US8076771 Semiconductor device having metal cap divided by slit
12/13/2011	US8076770 Semiconductor device including a first land on the wiring substrate and a second land on the sealing portion
12/13/2011	US8076769 Semiconductor device and manufacturing method of semiconductor device
12/13/2011	US8076768 IC interconnect
12/13/2011	US8076767 Semiconductor device
12/13/2011	US8076766 Stacked semiconductor memory device
12/13/2011	US8076764 Stacked type semiconductor memory device and chip selection circuit
12/13/2011	US8076763 Electrical shielding in stacked dies by using conductive die attach adhesive
12/13/2011	US8076762 Variable feature interface that induces a balanced stress to prevent thin die warpage
12/13/2011	US8076761 Reduced inductance IC leaded package
12/13/2011	US8076760 Semiconductor fuse arrangements
12/13/2011	US8076759 Semiconductor package with a controlled impedance bus and method of forming same
12/13/2011	US8076758 Wafer structure
12/13/2011	US8076757 Semiconductor device having electrical devices mounted to IPD structure and method of shielding electromagnetic interference
12/13/2011	US8076756 Structure for inhibiting back end of line damage from dicing and chip packaging interaction failures
12/13/2011	US8076748 Semiconductor device
12/13/2011	US8076728 Integrated circuit arrangements with ESD-resistant capacitor and corresponding method of production
12/13/2011	US8076692 LED package
12/13/2011	US8076683 Surface-textured encapsulations for use with light emitting diodes
12/13/2011	US8076681 White organic electroluminescent device
12/13/2011	US8076673 Recessed gate dielectric antifuse
12/13/2011	US8076586 Heat conduction from an embedded component
12/13/2011	US8076576 Electronic component package
12/13/2011	US8076260 Substrate structure and manufacturing method of the same
12/13/2011	US8076243 Metal precursors for deposition of metal-containing films
12/13/2011	US8076235 Semiconductor device and fabrication method thereof
12/13/2011	US8076214 Display substrate and method of manufacturing the same
12/13/2011	US8075948 forming a transparent SiO2 thin film on a surface of a transparent base film such as PET by vacuum deposition, sputtering or ion implanting, forming a transparent conductive thin film of indium-tin complex oxide on the transparent SiO2 thin film; wear and bending resistance
12/13/2011	US8075721 Low exothermic thermosetting resin compositions useful as underfill sealants and having reworkability
12/13/2011	US8074868 Fabrication method of semiconductor integrated circuit device
12/08/2011	WO2011153499A1 Systems and methods of manufacturing printed circuit boards using blind and internal micro vias to couple subassemblies
12/08/2011	WO2011153162A1 Through via inductor or transformer in a high-resistance substrate with programmability
12/08/2011	WO2011153054A2 Contact holder
12/08/2011	WO2011152526A1 Control device for electric power converter
12/08/2011	WO2011152424A1 Semiconductor module and method for producing semiconductor module
12/08/2011	WO2011152363A2 Method for producing ceramic for heat-radiating members, ceramic for heat-radiating members, and solar cell module and led light-emitting module using said ceramic
12/08/2011	WO2011152255A1 Esd protection device
12/08/2011	WO2011152151A1 Method for predicting lifetime of element, and circuit board provided with function of predicting lifetime of element
12/08/2011	WO2011152003A1 Semiconductor device, solid-state imaging device, and camera system
12/08/2011	WO2011151998A1 Light-emitting device and manufacturing method therefor
12/08/2011	WO2011151973A1 Electronic control device and method for predicting residual life of same
12/08/2011	WO2011151961A1 Semiconductor device and process for production thereof
12/08/2011	WO2011151351A1 Electronic chip having channels through which a heat transport coolant can flow, electronic components and communication arm incorporating said chip
12/08/2011	US20110300704 Semiconductor devices having contact plugs with stress buffer spacers and methods of fabricating the same
12/08/2011	US20110300413 Battery-operated wireless-communication apparatus and method
12/08/2011	US20110298485 Semiconductor device test method and apparatus, and semiconductor device

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