H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2011
12/15/2011	US20110304024 Vertical conductive connections in semiconductor substrates
12/15/2011	US20110304023 method of generating a hole or recess or well in a substrate
12/15/2011	US20110304016 Wiring board, method of manufacturing the same, and semiconductor device
12/15/2011	US20110304015 Semiconductor package
12/15/2011	US20110304012 Semiconductor Device and Method of Forming RF FEM With LC Filter and IPD Filter Over Substrate
12/15/2011	US20110304010 Electrostatic discharge protection scheme for semiconductor device stacking process
12/15/2011	US20110304006 Method of alignment mark protection and semiconductor device formed thereby
12/15/2011	US20110303948 ESD and EMC optimized HV-MOS Transistor
12/15/2011	US20110303457 Electronic Device, Resonator, Oscillator and Method for Manufacturing Electronic Device
12/15/2011	US20110303451 Multilayer printed wiring board
12/15/2011	US20110303288 Solar Cell Structure And Composition and Method For Forming The Same
12/15/2011	DE10348446B4 Anordnung für eine ESD-Schutzschaltung Assembly for an ESD protection circuit
12/15/2011	DE10317210B4 Elektrische Einrichtung mit einem Halbleitersubstrat und Anschlussmitteln dafür An electrical device comprising a semiconductor substrate and connecting means for
12/15/2011	DE10213648B4 Leistungshalbleitermodul The power semiconductor module
12/15/2011	DE102011077543A1 Halbleitervorrichtung Semiconductor device
12/15/2011	DE102011075365A1 Halbleitervorrichtung und Herstellungsverfahren hierfür A semiconductor device and manufacturing method thereof
12/15/2011	DE102011014395A1 Wärmetauscherplatte Heat exchanger plate
12/15/2011	DE102011005251A1 Optoelektronische Transistorkontur (Transistor Outline, TO)-Hülsensockelbaugruppe, welche eine Konfiguration aufweist, die die Wärmedissipation verbessert und einen thermischen Widerstand reduziert Optoelectronic contour transistor (transistor outline, TO) -Hülsensockelbaugruppe having a configuration that enhances the heat dissipation and reduces a thermal resistance
12/15/2011	DE102011002198A1 ESD- und EMC-optimierter MOS-Transistor ESD and EMC optimized MOS transistor
12/15/2011	DE102011001402A1 Halbleiter-Bauelement und Herstellungsverfahren Semiconductor device and manufacturing method
12/15/2011	DE102010043982A1 Sensor arrangement, has mold-housing comprising access port provided with sensitive region and sense element, and stress decoupling structure formed in sense element, where sense element is formed between mold-housing and sensitive region
12/15/2011	DE102010035223B3 Mehrstufig justierbare Fassungsbaugruppe für zwei optische Bauteile Multi-stage adjustable socket assembly for two optical components
12/15/2011	DE102010030064A1 Schutzschaltung Protection circuit
12/15/2011	DE102010029869A1 Cooling device for power electronics, has pin-fin array extending from foot point of base body, and pins continuously tapered from proximate end to distal end of foot point in cone form or truncated cone form
12/15/2011	DE102010023833A1 Flat heat pipe for cooling fin that is utilized for cooling electronic component, has capillary structural layer arranged in side of inner space of continuous rotating pipe wall, where side of inner space faces pipe wall
12/15/2011	DE102010023815A1 Oberflächenmontierbares optoelektronisches Bauelement und Verfahren zur Herstellung eines oberflächenmontierbaren optoelektronischen Bauelements Surface-mountable optoelectronic component and method for manufacturing a surface-mounted optoelectronic component
12/15/2011	DE102008037090B4 Leistungshalbleitermodul mit verbesserter Wärmeübertragung Power semiconductor module with improved heat transfer
12/15/2011	DE102007009521B4 Bauteil und Verfahren zu dessen Herstellung Component and process for its preparation
12/15/2011	DE102006025671B4 Verfahren zur Herstellung von dünnen integrierten Halbleitereinrichtungen A process for the production of thin semiconductor integrated devices
12/15/2011	DE102005043657B4 Chipmodul, Verfahren zur Verkapselung eines Chips und Verwendung eines Verkapselungsmaterials Chip module, a chip and method of encapsulating the encapsulating material using a
12/15/2011	DE102005039947B4 Leistungshalbleitermodul mit Befestigungseinrichtung Power semiconductor module with mounting means
12/14/2011	EP2395820A1 Board reinforcing structure, board assembly, and electronic device
12/14/2011	EP2395549A1 Device for cooling integrated circuits
12/14/2011	EP2395548A1 Silicon-on-insulator structure
12/14/2011	EP2395547A2 Substrate having sintered underplate
12/14/2011	EP2395309A1 Heat pipe
12/14/2011	EP2394303A2 Iii-nitride devices and circuits
12/14/2011	CN202077324U 一种热柱式高效散热器 A thermal column efficient radiator
12/14/2011	CN202076439U 电连接器组件 The electrical connector assembly
12/14/2011	CN202076272U 一种用于脉冲功率电源的薄型晶闸管 Thin thyristor for pulsed power supply
12/14/2011	CN202076261U 一种智能功率模块的功率封装结构 Power package structure an intelligent power module
12/14/2011	CN202076260U Sheet type diode
12/14/2011	CN202076259U 一种贴片式二极管的框架 A framework SMD diodes
12/14/2011	CN202076258U 一种结构优化的引线框架 A structure optimization of a lead frame
12/14/2011	CN202076257U Semi-conductor block with lead retaining clips
12/14/2011	CN202076256U 回路式热管散热器 Loop heat pipe radiator
12/14/2011	CN202076255U 电子控制单元组件以及包括所述电子控制单元组件的车辆 The electronic control unit includes a vehicle component, and the electronic control unit components
12/14/2011	CN202076254U Semiconductor assembly with heat radiation plate
12/14/2011	CN202076253U 逆变焊机电源导热绝缘装置 Inverter welding power supply thermal insulation means
12/14/2011	CN202076252U 一种用于dvr主芯片的导热硅胶片 A thermal silica film dvr main chip for
12/14/2011	CN202076251U 一种用于蓝光dvd的导热硅胶片 A Blu-ray dvd for thermal silica films
12/14/2011	CN202076250U 一种高倍翅冷板散热器 One kind of high-powered cold plate fin heat sink
12/14/2011	CN202076249U Cpu散热装置 Cpu heatsink
12/14/2011	CN202076248U 一种二极管的散热结构 Cooling structure for a diode
12/14/2011	CN202076247U 薄型半导体封装结构 Thin semiconductor package
12/14/2011	CN202076246U Ceramic plate of semiconductor device
12/14/2011	CN202076245U Semiconductor block with substrate having lead clamping groove
12/14/2011	CN202076244U Package structure of integrated circuit chip made from hybrid gold-plated alloy wire
12/14/2011	CN202075772U Contact-type integrated card (IC) module
12/14/2011	CN1849260B 金属纳米粒子及其制造方法、金属纳米粒子分散液及其制造方法、以及金属细线和金属薄膜及其制造方法 A method of manufacturing the metal nanoparticles, metal nanoparticles dispersion liquid and manufacturing method thereof, and a metal thin film and its manufacturing method and metal
12/14/2011	CN1655356B 集成电路器件及其制造方法 Integrated circuit device and manufacturing method thereof
12/14/2011	CN102282717A 燃料仪电路以及电池组 Fuel meter circuit and battery pack
12/14/2011	CN102282686A 用于制造光电子器件的方法和光电子器件 Method of manufacturing optoelectronic devices and optoelectronic devices for
12/14/2011	CN102282671A 封装组件和调谐封装的固有共振频率的方法 The method of the packaging component and the natural resonance frequency of the tuning package
12/14/2011	CN102282670A 封装件的制造方法及圆片接合体、压电振动器、振荡器、电子设备及电波钟表 Wafer manufacturing method and a package assembly, the piezoelectric vibrator, an oscillator, an electronic device and a radio clock
12/14/2011	CN102282669A 用于减少半导体封装件的拉应力的方法与设备 To reduce the tensile stress of the semiconductor package of the method and apparatus
12/14/2011	CN102282661A 半导体芯片的安装方法、使用该方法获得的半导体装置以及半导体芯片的连接方法与表面设有布线的立体结构物及其制法 A semiconductor chip mounting method, a method for connecting the surface of the semiconductor device and a semiconductor chip obtained by the method has a three-dimensional wiring structure and its preparation method
12/14/2011	CN102282660A 半导体封装的制造方法、半导体封装方法和溶剂型半导体封装环氧树脂组合物 Method of manufacturing a semiconductor package, a semiconductor packaging method and solvent-based semiconductor package epoxy resin composition
12/14/2011	CN102282658A 使用不导电丝网印刷与施涂粘合剂的半导体裸片附接方法 Use non-conductive semiconductor die screen printing and applying adhesive attachment methods
12/14/2011	CN102282656A 半导体装置及半导体装置的制造方法 Semiconductor device and manufacturing method of a semiconductor device
12/14/2011	CN102281738A 散热模块及其风扇与壳体 Cooling fan module and the casing
12/14/2011	CN102281720A 基板及其制造方法、电路装置及其制造方法 Substrate and manufacturing method of the circuit device and its manufacturing method
12/14/2011	CN102281707A 电路模块 Circuit module
12/14/2011	CN102281702A 基板布局与其形成方法 Its method of forming the substrate layout
12/14/2011	CN102280478A 可堆栈式功率mosfet、功率mosfet堆栈及其制备工艺 Stackable power mosfet, power mosfet stack and its preparation process
12/14/2011	CN102280457A 影像感测模组及相机模组 Image sensing module and camera module
12/14/2011	CN102280441A 半导体装置 Semiconductor device
12/14/2011	CN102280440A 一种叠层封装结构及制造方法 A laminated package structure and method of manufacture
12/14/2011	CN102280439A 一种微波功率晶体管内匹配网络及其制造方法 A matching network and a manufacturing method in the microwave power transistor
12/14/2011	CN102280438A 微影过程中临界尺寸的测试标记 Lithography process, the critical dimension of the test mark
12/14/2011	CN102280437A 校准标记及制造方法 And a method of manufacturing the alignment marks
12/14/2011	CN102280436A 薄膜金属层接线结构及其制造方法和阵列基板 Thin-film metal-layer wiring structure and its manufacturing method and array substrate
12/14/2011	CN102280435A 配线基板及其制造的方法 And a method of manufacturing the wiring substrate
12/14/2011	CN102280434A 真空气密的有机封装载体与传感器组件封装结构 Organic package carrier and sensor assembly package vacuumtight
12/14/2011	CN102280433A 晶圆级芯片尺寸封装结构及其封装方法 Wafer-level chip size package and packaging method
12/14/2011	CN102280432A Qfn封装框架结构 Qfn package framework
12/14/2011	CN102280431A 具有保护层的半导体封装及其制作方法 Semiconductor package and method of making a protective layer
12/14/2011	CN102280430A 安装结构、电子部件、电路板、板组件、电子装置及应力缓解部件 Mounting structure, electronic components, circuit boards, board assembly, an electronic device and the strain relief member
12/14/2011	CN102280429A 电路板、电路板组件和半导体装置 Circuit boards, circuit board assembly and semiconductor device
12/14/2011	CN102280428A 封装件及其制造方法 Package and manufacturing method thereof
12/14/2011	CN102280427A 一种金属与塑料混合封装的可控硅封装结构及其方法 A thyristor package structure and method of mixing metal and plastic packaging
12/14/2011	CN102280426A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/14/2011	CN102280425A 具备键合引线的半导体器件及其制造方法 The method of manufacturing a semiconductor device and bonding wires
12/14/2011	CN102280424A 非挥发性内存装置、集成电路装置及集成电路制造方法 Non-volatile memory devices, integrated circuits and integrated circuit device manufacturing method
12/14/2011	CN102280423A 集成电路装置及其制造方法 Integrated circuit device and manufacturing method thereof
12/14/2011	CN102280422A 包含金属和粒子填充的硅片直通通路的集成电路芯片 Containing silicon metal and particle-filled paths straight integrated circuit chip
12/14/2011	CN102280421A 具有过硅通孔的半导体器件 With over a semiconductor device silicon vias
12/14/2011	CN102280420A 半导体模块以及半导体装置 The semiconductor module and semiconductor device
12/14/2011	CN102280419A 一种大型电子设备用散热板及其制造方法 A large, electronic equipment cooling plate and its manufacturing method
12/14/2011	CN102280418A 带有散热装置的半导体封装 The semiconductor package with heat sink

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