H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2011
12/20/2011	US8081081 Electronic apparatus and method of manufacturing the same
12/20/2011	US8080886 Integrated circuit semiconductor device with overlay key and alignment key and method of fabricating the same
12/20/2011	US8080885 Integrated circuit packaging system with multi level contact and method of manufacture thereof
12/20/2011	US8080884 Mounting structure and mounting method
12/20/2011	US8080883 Wiring placement method of wirings having different length and semiconductor integrated circuit device
12/20/2011	US8080882 Semiconductor device and method of forming stepped-down RDL and recessed THV in peripheral region of the device
12/20/2011	US8080881 Contact pad supporting structure and integrated circuit for crack suppresion
12/20/2011	US8080878 Semiconductor device having insulating film with surface modification layer and method for manufacturing the same
12/20/2011	US8080877 Damascene interconnection structure and dual damascene process thereof
12/20/2011	US8080876 Structure and method for creating reliable deep via connections in a silicon carrier
12/20/2011	US8080875 Interconnection substrate and semiconductor device, manufacturing method of interconnection substrate
12/20/2011	US8080874 Providing additional space between an integrated circuit and a circuit board for positioning a component therebetween
12/20/2011	US8080873 Semiconductor device, semiconductor package, and method for testing semiconductor device
12/20/2011	US8080872 Surface mount package with high thermal conductivity
12/20/2011	US8080871 Carbon nanotube-based structures and methods for removing heat from solid-state devices
12/20/2011	US8080870 Die-warpage compensation structures for thinned-die devices, and methods of assembling same
12/20/2011	US8080869 Wafer level package structure and production method therefor
12/20/2011	US8080868 Semiconductor memory device and semiconductor memory card
12/20/2011	US8080867 Integrated circuit packaging system with stacked integrated circuit and method of manufacture thereof
12/20/2011	US8080866 3-D integrated semiconductor device comprising intermediate heat spreading capabilities
12/20/2011	US8080865 RF-coupled digital isolator
12/20/2011	US8080864 Solution of power consumption reduction for inverter covered by metal case
12/20/2011	US8080862 Systems and methods for enabling ESD protection on 3-D stacked devices
12/20/2011	US8080861 Semiconductor device
12/20/2011	US8080860 Semiconductor device and method of blowing fuse thereof
12/20/2011	US8080858 Semiconductor component having a space saving edge structure
12/20/2011	US8080855 Semiconductor device and method of manufacturing the same
12/20/2011	US8080852 Semiconductor device and method of manufacturing the same
12/20/2011	US8080851 Deep trench electrostatic discharge (ESD) protect diode for silicon-on-insulator (SOI) devices
12/20/2011	US8080823 IC chip package and image display device incorporating same
12/20/2011	US8080731 Restrained solar collector and method
12/20/2011	US8080462 Mark structure for coarse wafer alignment and method for manufacturing such a mark structure
12/20/2011	US8080446 Integrated circuit packaging system with interposer interconnections and method of manufacture thereof
12/20/2011	US8080442 Vertical system integration
12/20/2011	US8079528 Input/output pads placement for a smart card chip
12/20/2011	US8079142 Printed circuit board manufacturing method
12/20/2011	CA2460840C Thin electronic label and method for making same
12/19/2011	DE202011107527U1 LED-Modul, insbesondere zur Montage in herkömmlichen Raster-, Einbau-, Pendel- und Anbauleuchten LED module, in particular for installation in conventional grid, recessed, pendant and surface mounted
12/16/2011	DE202011104205U1 Befestigungsvorrichtung für Kühlmodul Fastening device for cooling module
12/15/2011	WO2011156221A2 Wafer backside coating process with pulsed uv light source
12/15/2011	WO2011156051A1 Stacked interposer leadframes
12/15/2011	WO2011156028A2 Porous and non-porous nanostructures
12/15/2011	WO2011156019A2 Group iv metal or semiconductor nanowire fabric
12/15/2011	WO2011155946A1 Flexible electronic devices and related methods
12/15/2011	WO2011155638A1 Method of redistributing functional element
12/15/2011	WO2011155600A1 Oscillator
12/15/2011	WO2011155583A1 Curable resin composition and cured product thereof
12/15/2011	WO2011155562A1 Flow channel member, heat exchanger using same, and electronic component device
12/15/2011	WO2011155333A1 Semiconductor integrated circuit device
12/15/2011	WO2011155322A1 Seal material, solar cell module and photoelectric diode
12/15/2011	WO2011155317A1 Heat dissipation structure for electronic device
12/15/2011	WO2011155247A1 Heat sink, and method for producing same
12/15/2011	WO2011155165A1 Resin-sealed semiconductor device and method for manufacturing same
12/15/2011	WO2011155125A1 Thin film transistor substrate, liquid crystal display device provided with same, and thin film transistor substrate production method
12/15/2011	WO2011155032A1 Crack identification device, and semiconductor device
12/15/2011	WO2011154366A1 Heat exchange apparatus
12/15/2011	WO2011154316A1 Flexible heat exchanger
12/15/2011	WO2011153654A1 Heat-conducting element, assembly and use of the same
12/15/2011	WO2011153609A1 Multi-chip package with pillar connection
12/15/2011	WO2011090361A3 Curable composition
12/15/2011	US20110304994 Conductive via structures for routing porosity and low via resistance, and processes of making
12/15/2011	US20110304944 Apparatus and method for electronic systems reliability
12/15/2011	US20110304364 Device For Removing Electromagnetic Interference And Semiconductor Package Including The Same
12/15/2011	US20110304349 Lateral coupling enabled topside only dual-side testing of tsv die attached to package substrate
12/15/2011	US20110304062 Chip package structure, chip package mold chase and chip package process
12/15/2011	US20110304061 Semiconductor device
12/15/2011	US20110304060 Metal thin film connection structure, manufacturing method thereof and array substrate
12/15/2011	US20110304059 Circuit board, circuit board assembly, and semiconductor device
12/15/2011	US20110304058 Semiconductor Device and Method of Forming Flipchip Interconnection Structure with Bump on Partial Pad
12/15/2011	US20110304057 Semiconductor device and manufacturing method of the device
12/15/2011	US20110304056 Stack-type semiconductor package and method of manufacturing the same
12/15/2011	US20110304055 Semiconductor integrated circuit with multi-cut via and automated layout method for the same
12/15/2011	US20110304054 Semiconductor device and method of fabricating the same
12/15/2011	US20110304053 Interconnect structure and method of fabricating
12/15/2011	US20110304052 Power grid optimization
12/15/2011	US20110304051 Thermal interface material with support structure
12/15/2011	US20110304050 Semiconductor apparatus
12/15/2011	US20110304049 Semiconductor integrated circuit device and method of manufacturing the same
12/15/2011	US20110304048 Semiconductor apparatus
12/15/2011	US20110304047 Method for Producing a Composite Material, Associated Composite Material and Associated Semiconductor Circuit Arrangements
12/15/2011	US20110304046 Semiconductor device and method for producing the same
12/15/2011	US20110304045 Thermally enhanced electronic package and method of manufacturing the same
12/15/2011	US20110304044 Stacked chip package structure and its fabrication method
12/15/2011	US20110304043 Semiconductor device and manufacturing method of the same
12/15/2011	US20110304042 Copper Bump Structures Having Sidewall Protection Layers
12/15/2011	US20110304041 Electrically connecting routes of semiconductor chip package consolidated in die-attachment
12/15/2011	US20110304040 Sample liquid supply container, sample liquid supply container set, and microchip set
12/15/2011	US20110304039 Semiconductor device
12/15/2011	US20110304038 Semiconductor chip designed to dissipate heat effectively, semiconductor package including the same, and stack package using the same
12/15/2011	US20110304037 Semiconductor device
12/15/2011	US20110304036 Semiconductor package with heat dissipation devices
12/15/2011	US20110304034 Semiconductor wafer bonding product, method of manufacturing semiconductor wafer bonding product and semiconductor device
12/15/2011	US20110304033 Semiconductor device, semiconductor device storage method, semiconductor device manufacturing method, and semiconductor manufacturing apparatus
12/15/2011	US20110304032 No lead package with heat spreader
12/15/2011	US20110304031 Semiconductor device equipped with bonding wires and manufacturing method of semiconductor device equipped with bonding wires
12/15/2011	US20110304030 Semiconductor device and manufacturing method thereof
12/15/2011	US20110304029 Semiconductor device and manufacturing method thereof, wiring board and manufacturing method thereof, semiconductor package, and electronic apparatus
12/15/2011	US20110304027 Semiconductor chip with through electrodes and method for manufacturing the same
12/15/2011	US20110304026 Via and method of via forming and method of via filling
12/15/2011	US20110304025 Nitride compound semiconductor element and production method therefor

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