Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2011
12/21/2011CN202084524U Packaging plate
12/21/2011CN202084523U 表面形成玻璃层的硅晶圆 A glass layer formed on the surface of the silicon wafer
12/21/2011CN1922727B 半导体器件及ic卡、ic标签、rfid、转发器、票据、证券、护照、电子装置、包和外衣的制造方法 Method for manufacturing semiconductor devices and ic cards, ic tags, rfid, transponder, notes, securities, passports, electronic devices, packages and outerwear
12/21/2011CN1855476B 半导体装置 Semiconductor device
12/21/2011CN1848423B 半导体装置和电路装置 The semiconductor device and the circuit means
12/21/2011CN102293072A 线路板及其制造方法 Circuit board and its manufacturing method
12/21/2011CN102292813A 用于基于隔离型nmos的esd箝位单元的系统和方法 System and method based on the esd nmos isolated for clamping unit
12/21/2011CN102292803A 半导体装置 Semiconductor device
12/21/2011CN102292797A 用于生成激光束辐射轨迹的方法 Method to generate a laser beam radiation for track
12/21/2011CN102291936A 印刷线路板 Printed circuit boards
12/21/2011CN102291099A 电子部件 Electronic components
12/21/2011CN102290431A 平板显示装置及其制造方法与母基底及其制造方法 Flat panel display device and manufacturing method of the master substrate and manufacturing method thereof
12/21/2011CN102290425A 具有三维层叠结构的半导体器件的制造方法 Method of manufacturing a semiconductor device having a three-dimensional stacked structure
12/21/2011CN102290418A 静电放电保护装置 ESD protection device
12/21/2011CN102290415A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/21/2011CN102290411A 一种抗光干扰红外线接收模组及其制造方法 An anti-light interference infrared receiver module and manufacturing method
12/21/2011CN102290405A 一种用于模块化多电平电压源换流器的晶闸管压装结构 SCR press-fit structure of a modular multi-level voltage source inverter for the
12/21/2011CN102290404A 半导体芯片封装及其制造方法 The semiconductor chip package and method of manufacturing
12/21/2011CN102290403A 模块基板、具有该基板的半导体模块及其制造方法 Module substrate, comprising a semiconductor module and a manufacturing method of the substrate
12/21/2011CN102290402A 卧式光控水冷晶闸管阀组 Water-cooled horizontal light control thyristor valve
12/21/2011CN102290401A 堆叠多芯片封装结构 Stacked multi-chip package structure
12/21/2011CN102290400A 半导体封装模块及具有该模块的电子电路组件 The semiconductor package module and an electronic circuit assembly having the module
12/21/2011CN102290399A 堆叠式芯片封装结构及方法 Stacked chip packaging structure and method
12/21/2011CN102290398A 储存电容架构及其制造方法与像素结构 Storage capacitor structure and method of manufacturing the pixel structure
12/21/2011CN102290397A 硅晶圆结构及多晶粒的堆栈结构 Silicon structure and multi-stack structure grains
12/21/2011CN102290396A Sma集成电路冲切成型产品及sma多排引线框架 Sma IC punching molding products and multi-row leadframe sma
12/21/2011CN102290395A 堆叠封装 Stacking
12/21/2011CN102290394A Heat radiating electronic package structure and method of manufacturing the same
12/21/2011CN102290393A 具有导线架的集成电路封装系统及其制造方法 System and method for manufacturing an integrated circuit package having a lead frame
12/21/2011CN102290392A 具有导电扩散区的半导体芯片、其制造方法以及堆叠封装 A semiconductor chip having a conductive diffusion region, its manufacturing method, and the stacked package
12/21/2011CN102290391A 半导体器件及其制造方法和制造装置 Semiconductor device and manufacturing method and apparatus
12/21/2011CN102290390A 散热器及具有该散热器的电子装置 The heat sink and electronic device having a heat sink
12/21/2011CN102290389A 具散热风扇的半导体封装件及其堆叠结构 A cooling fan and stack structure of the semiconductor package
12/21/2011CN102290388A 电控设备、热管散热器及其制作方法 Electronic control equipment, heat pipe radiator and its production method
12/21/2011CN102290387A 半导体装置 Semiconductor device
12/21/2011CN102290386A 锁定装置和用于制造锁定装置的方法 Locking means locking apparatus and a method for producing
12/21/2011CN102290385A 一种门极可关断晶闸管用水冷散热器 One kind of gate turn-off thyristor with a water cooler
12/21/2011CN102290384A Insulating member, metal base substrate, and semiconductor module, and manufacturing methods thereof
12/21/2011CN102290383A 散热片 Heatsink
12/21/2011CN102290382A 热交换面积大的散热片 Large area of ​​heat exchange fins
12/21/2011CN102290381A Thermally enhanced electronic package
12/21/2011CN102290380A 玻璃保护式二极管及其制法 Glass protection diode Jiqizhifa
12/21/2011CN102290379A 半导体结构及半导体装置的制造方法 The method of manufacturing a semiconductor structure and a semiconductor device
12/21/2011CN102290378A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/21/2011CN102290372A 半导体器件制造方法以及半导体器件制造设备 The semiconductor device manufacturing method and semiconductor device manufacturing apparatus
12/21/2011CN102290358A 四方扁平无引脚封装体及其制造方法 Quad flat no-lead package and manufacturing method thereof
12/21/2011CN102290357A 键合封装及其方法 Bond package and method
12/21/2011CN102290349A 半导体结构及其形成方法 And method of forming a semiconductor structure
12/21/2011CN102290336A 一种薄膜、图案层及其制造方法 A thin film, the pattern layer and manufacturing method thereof
12/21/2011CN102290329A 形成具有lc滤波器和ipd滤波器的rf fem的半导体器件和方法 Ipd form a lc filter and filter rf fem semiconductor device and method
12/21/2011CN102290117A 一种低温烧结纳米银浆及其制备方法 Low-temperature sintering of nano silver and its preparation method
12/21/2011CN102005430B Double-sided graphics chip flip-chip module packaging method adopting plating firstly and etching secondly
12/21/2011CN101958299B Method for packaging single double-sided graphic chip by way of directly arranging and then sequentially plating and etching
12/21/2011CN101937835B 熔丝类晶圆修调参数的方法 Fuse class wafer trimming method parameters
12/21/2011CN101872654B 一种应用于厚膜电路的灌孔银浆料 Applied to Houmodianlu of silver paste filling holes
12/21/2011CN101840915B 一种引脚共享装置及方法 One kind of pin sharing device and method
12/21/2011CN101834182B 一种动态栅极电阻调制的栅极耦合nmos管 A dynamic gate resistance modulator coupled to the gate nmos tube
12/21/2011CN101826501B 高密度接点的无引脚集成电路元件及其制造方法 No pin high-density integrated circuit elements and a manufacturing method of contacts
12/21/2011CN101819940B 测试晶片的方法及测试结构 The method and the test wafer test structure
12/21/2011CN101803013B 半导体装置以及导线焊接方法 Semiconductor device and method of welding wire
12/21/2011CN101764120B 半导体器件无引线封装结构 Leadless package structure of semiconductor devices
12/21/2011CN101740550B 带屏蔽装置的电子部件及其制造方法 With a shielding device and a manufacturing method for an electronic component
12/21/2011CN101740544B 半导体测试垫结构 Semiconductor Test pad structure
12/21/2011CN101728400B 像素结构 Pixel structure
12/21/2011CN101728370B 化合物半导体元件的封装模块结构及其制造方法 Encapsulation module structure and manufacturing method of the compound semiconductor element
12/21/2011CN101719488B 具有锥形轮廓的再分布线的焊垫连接 Having a tapered profile redistribution pad connection line
12/21/2011CN101719483B 用于生长纤锌矿型晶体的衬底、其制造方法和半导体器件 The substrate for growing a wurtzite type crystal, and a semiconductor device manufacturing method thereof
12/21/2011CN101707196B 一种改进的静电放电防护装置及相应的方法、集成电路 An improved electrostatic discharge protection device and a corresponding method, an integrated circuit
12/21/2011CN101689490B 成膜方法和处理系统 Film-forming method and processing system
12/21/2011CN101621905B 散热器扣具及使用该扣具的散热装置 Heat sink clip and use the clip of the cooling unit
12/21/2011CN101606242B 半导体装置及其制造方法、拾光模块 Semiconductor device and manufacturing method, the optical pickup module
12/21/2011CN101604699B 固体拍摄装置 Solid shooting device
12/21/2011CN101600325B 一种密闭壳体电子设备的组合散热装置 A closed shell electronic device cooling apparatus combination
12/21/2011CN101558505B 热电模块及金属化基板 Thermoelectric modules and metal substrates
12/21/2011CN101466227B 散热装置 Cooling devices
12/21/2011CN101452935B 芯片与晶圆 Chip and wafer
12/21/2011CN101434737B 用于集成电路管芯的封装 A package for an integrated circuit die
12/21/2011CN101431052B 双重图像传感器及其制造方法 Dual image sensor and its manufacturing method
12/21/2011CN101430083B 路灯散热装置 Street light heat sink
12/21/2011CN101425501B 半导体器件 Semiconductor devices
12/21/2011CN101414593B 半导体安装用引脚和印制电路板 Semiconductor mounting pins and printed circuit board
12/21/2011CN101394727B 散热装置 Cooling devices
12/21/2011CN101393907B 用于电路板的保护 For the protection circuit board
12/21/2011CN101383349B 静态随机存取存储单元 Static random access memory cell
12/21/2011CN101316495B 散热模组 Thermal Module
12/21/2011CN101286507B 半导体装置及便携式设备 Semiconductor device and a portable device
12/21/2011CN101261973B 半导体装置 Semiconductor device
12/21/2011CN101237219B 振荡器 Oscillator
12/21/2011CN101221952B 用以保护一内部集成电路的半导体结构及其制造方法 Semiconductor structure and method for protecting an internal integrated circuits
12/21/2011CN101219576B 无线使能装置 Wireless-enabled device
12/21/2011CN101145579B 具有槽沟的源体短路电极的、逆槽沟和源极接地的场效应晶体管结构 Source body having a groove of the short-circuiting electrode, and the inverse grooves source grounded field effect transistor structure
12/21/2011CN101013695B 半导体装置 Semiconductor device
12/21/2011CN101005062B 使用相互连接的三维层片将垂直封装的mosfet和集成电路功率器件构建成集成模块 The vertical packaged mosfet power devices and integrated circuits to construct a three-dimensional integrated module interconnected layers
12/20/2011US8081481 Apparatus and method for a clip device for coupling a heat sink plate system with a burn-in board system
12/20/2011US8081478 Fluid cooled electronics module cover
12/20/2011US8081474 Embossed heat spreader
12/20/2011US8081473 Apparatus and method of direct water cooling several parallel circuit cards each containing several chip packages
12/20/2011US8081472 Electric circuit device, electric circuit module, and power converter
12/20/2011US8081461 Cooling apparatus with thermally conductive porous material and jet impingement nozzle(s) extending therein
12/20/2011US8081454 Gas ejector, electronic device, and gas-ejecting method
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