H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2011
12/22/2011	US20110309527 Insulating member, metal base substrate, and semiconductor module, and manufacturing methods thereof
12/22/2011	US20110309526 Printed Circuit Board And Semiconductor Package Including The Same
12/22/2011	US20110309525 Multi-chip package semiconductor memory device
12/22/2011	US20110309524 Semiconductor device and method of forming metal line of semiconductor device
12/22/2011	US20110309523 Pop precursor with interposer for top package bond pad pitch compensation
12/22/2011	US20110309522 Semiconductor integrated circuit device comprising different level interconnection layers connected by conductor layers including conductor layer for redundancy
12/22/2011	US20110309521 Chip stack with conductive column through electrically insulated semiconductor region
12/22/2011	US20110309520 Semiconductor device and manufacturing method of the device
12/22/2011	US20110309519 Semiconductor device with through-silicon vias
12/22/2011	US20110309518 Semiconductor device with configurable through-silicon vias
12/22/2011	US20110309517 Semiconductor device and method of manufacturing the same
12/22/2011	US20110309516 Semiconductor package and method for making the same
12/22/2011	US20110309515 Semiconductor integrated circuit device and method for designing the same
12/22/2011	US20110309514 Packaged semiconductor device having improved locking properties
12/22/2011	US20110309513 Buried thermally conductive layers for heat extraction and shielding
12/22/2011	US20110309512 Semiconductor Device
12/22/2011	US20110309511 METHOD FOR PRODUCING LOW-k FILM, SEMICONDUCTOR DEVICE, AND METHOD FOR MANUFACTURING THE SAME
12/22/2011	US20110309510 Array substrate, display device having the same and method of manufacturing the same
12/22/2011	US20110309509 Semiconductor chip with conductive diffusion regions, method for manufacturing the same, and stack package using the same
12/22/2011	US20110309508 Method and Structure of Forming Silicide and Diffusion Barrier Layer With Direct Deposited Film on Silicon
12/22/2011	US20110309507 Methodology for evaluation of electrical characteristics of carbon nanotubes
12/22/2011	US20110309506 Conductive interconnect structures and formation methods using supercritical fluids
12/22/2011	US20110309505 Semiconductor device and method for fabricating the same
12/22/2011	US20110309504 Stack package
12/22/2011	US20110309503 Semiconductor device and manufacturing method thereof
12/22/2011	US20110309502 Semiconductor device, method for manufacturing semiconductor device, and manufacturing apparatus for semiconductor device
12/22/2011	US20110309501 Semiconductor package module and electric circuit assembly with the same
12/22/2011	US20110309500 Semiconductor Device and Method of Self-Confinement of Conductive Bump Material During Reflow Without Solder Mask
12/22/2011	US20110309499 Method of manufacturing devices
12/22/2011	US20110309498 Semiconductor device
12/22/2011	US20110309497 Multi-chip stack package structure
12/22/2011	US20110309496 Multi-chip stack package structure
12/22/2011	US20110309495 Multi-chip stack package structure
12/22/2011	US20110309494 Semiconductor device and fabrication method therefor
12/22/2011	US20110309493 Electronic Device Package Locking System and Method
12/22/2011	US20110309492 Integrated circuit system with recessed through silicon via pads and method of manufacture thereof
12/22/2011	US20110309491 Tungsten stiffener for flexible substrate assembly
12/22/2011	US20110309490 Plasma Treatment for Semiconductor Devices
12/22/2011	US20110309489 Method for forming a doped region in a semiconductor layer of a substrate and use of such method
12/22/2011	US20110309488 Semiconductor Device and Method of Forming Dam Material Around Periphery of Die to Reduce Warpage
12/22/2011	US20110309487 Semiconductor device, a method of manufacturing the same and an electronic device
12/22/2011	US20110309486 Method of Etching and Singulating a Cap Wafer
12/22/2011	US20110309485 Etched surface mount islands in a leadframe package
12/22/2011	US20110309484 Lead frame, method of manufacturing the same, and semiconductor package using the same
12/22/2011	US20110309483 Semiconductor Device
12/22/2011	US20110309482 Finger sensor including encapsulating layer over sensing area and related methods
12/22/2011	US20110309481 Integrated circuit packaging system with flip chip mounting and method of manufacture thereof
12/22/2011	US20110309479 Plasma Dicing and Semiconductor Devices Formed Thereof
12/22/2011	US20110309473 Chip package with die and substrate
12/22/2011	US20110309472 Anti-Fuse Element
12/22/2011	US20110309468 Semiconductor chip package and method of manufacturing the same
12/22/2011	US20110309421 One-time programmable memory and method for making the same
12/22/2011	US20110309375 Semiconductor device
12/22/2011	US20110309359 Semiconductor device
12/22/2011	US20110309358 Semiconductor chip with fine pitch leads for normal testing of same
12/22/2011	US20110308595 Thick-film pastes containing lead- and tellurium-oxides, and their use in the manufacture of semiconductor devices
12/22/2011	DE112004002747B4 Reaktive nanopartikuläre Cyclodextrinderivate als porenbildende Matrizen, diese enthaltende dielektrische Matrix und ultragering dielektrische Zusammensetzung, sowie unter deren Verwendung hergestellte gering und ultragering dielektrische Filme Reactive nanoparticulate cyclodextrin derivatives as pore-forming matrices containing these dielectric matrix and ultra low dielectric composition, as well as using them produced low and ultra-low dielectric films
12/22/2011	DE102011077769A1 Spannungsspitzenschutz für Leistungs-DMOS-Vorrichtungen Transient protection for power DMOS devices
12/22/2011	DE102011077504A1 Insulating member, metal base substrate, and semiconductor module, and manufacturing methods thereof Insulating member base metal substrates, and semiconductor modules, and manufacturing methods thereof
12/22/2011	DE102011076130A1 Semiconductor device for recovering regenerative energy of motor in vehicle, has housing comprising bus bar in contact with terminal and upwardly extended from housing side, where terminal is upwardly extended
12/22/2011	DE102011050895A1 Mikrosensor Microsensor
12/22/2011	DE102011002170A1 Elektronikbauelement-Package-Verriegelungssystem und Verfahren Electronic component package locking system and method
12/22/2011	DE102010024523A1 Mehrschichtiges Folienelement The multilayer film element
12/22/2011	DE102010024520A1 Method for increasing thermal mechanical resistance of ceramic substrate for mounting electrical components, involves covering edges of metallization layer by applying electrical isolation fill material between edges and substrate
12/22/2011	DE102010023955A1 Optoelektronisches Bauteil The optoelectronic device
12/22/2011	DE102010017483A1 Integrated lateral power circuit i.e. integrated power semiconductor component, for use in electronic control unit utilized in e.g. motor car for heating airbag, has trench extending from horizontal surface to insulation area
12/22/2011	DE102008057833B4 Leistungshalbleitermodul mit Steuerfunktionalität und integriertem Übertrager Power semiconductor module with control functionality and integrated transformer
12/22/2011	DE102006051489B4 Teststruktur für durch OPC-hervorgerufene Kurzschlüsse zwischen Leitungen in einem Halbleiterbauelement und Messverfahren Test structure for OPC caused by short-circuiting between lines in a semiconductor device and methods of measurement
12/22/2011	DE102006008454B4 Kontaktstellenstruktur, Kontaktstellen-Layoutstruktur, Halbleiterbauelement und Kontaktstellen-Layoutverfahren Pad structure, pads layout structure, semiconductor device and pads layout method
12/22/2011	DE102005054177B4 Verfahren zum Herstellen einer Vielzahl von gehäusten Sensormodulen A method of manufacturing a plurality of sensor modules packaged
12/21/2011	EP2398074A1 Semiconductor light emitting device, method of manufacturing the same, and lighting apparatus and display apparatus using the same
12/21/2011	EP2398050A2 Carrier body for construction elements or circuits
12/21/2011	EP2398049A2 Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
12/21/2011	EP2398048A1 Semiconductor protection film-forming film with dicing sheet, method for manufacturing semiconductor device using same, and semiconductor device
12/21/2011	EP2398046A1 Integrated circuit package with a copper-tin joining layer and manufacturing method thereof
12/21/2011	EP2397754A2 Carrier body for construction elements or circuits
12/21/2011	EP2397455A1 Substrate comprising aluminum/graphite composite, heat dissipation part comprising same, and led luminescent member
12/21/2011	EP2396275A2 Display device with desiccant
12/21/2011	EP2041186B1 Process for producing moulding powder
12/21/2011	EP2002477B1 A fabrication method for a low ohmic through substrate connection for semiconductor carriers
12/21/2011	EP1849167B1 Thin-film resistor with a current-density-enhancing layer
12/21/2011	EP1098368B1 Module component and method of manufacturing the same
12/21/2011	CN202084544U 方块式桥堆 Box type bridge rectifiers
12/21/2011	CN202084543U 直列式小型桥堆 Small-line bridge rectifiers
12/21/2011	CN202084542U 贴片直列式小型桥堆 SMD-line small bridge rectifiers
12/21/2011	CN202084541U 电焊机整流组件 Welding rectifier module
12/21/2011	CN202084540U Surface-mount type power transistor module
12/21/2011	CN202084537U 具有静电放电防护功能的集成电路 Electrostatic discharge protection IC
12/21/2011	CN202084536U 一种新型引线框架铆合结构 A new leadframe structure riveting
12/21/2011	CN202084535U L型铜合金带 L-copper alloy strip
12/21/2011	CN202084534U To92s型号封装盒及配套模具 To92s Model Package box and a mold
12/21/2011	CN202084533U T0126 packaging box and matched mould
12/21/2011	CN202084532U To92型号封装盒及配套模具 To92 Model Package box and a mold
12/21/2011	CN202084531U 一种环保散热器 An environmentally friendly radiator
12/21/2011	CN202084530U 散热模块 Thermal Module
12/21/2011	CN202084529U 鳍片式散热器固定结构 Finned heat sink structure
12/21/2011	CN202084528U 具有散热片的散热装置 A heat sink having fins
12/21/2011	CN202084527U 一种新型晶体管构造 A new transistor structure
12/21/2011	CN202084526U 一种弧形散热器 One kind of curved radiator
12/21/2011	CN202084525U 一种igbt模块及其支撑装置 One kind igbt module and its supporting device

1 ... 423 424 425 426 427 428 429 430 431 432 433 434 435 436 437 438 439 440 441 442 443 ... 2262