H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2011
12/28/2011	CN101677091B 采用水蒸气压缩系统促进电子装置机架冷却的装置和方法 Promote the use of vapor compression system apparatus and method for cooling electronic equipment racks
12/28/2011	CN101674705B 柔性布线基板及制法、配芯片的柔性布线基板及电子设备 Flexible wiring board and manufacturing method, the flexible wiring board with chips and electronic equipment
12/28/2011	CN101657896B 电子电路封装 Electronic circuit package
12/28/2011	CN101616569B 散热装置 Cooling devices
12/28/2011	CN101610659B 散热器 Heat sink
12/28/2011	CN101608786B 具有组合散热体的led灯 With a combination of radiator led lights
12/28/2011	CN101600322B 散热装置 Cooling devices
12/28/2011	CN101600321B 散热风扇及采用该散热风扇的电子装置 Cooling fans and electronic device using the cooling fan
12/28/2011	CN101578697B 高频封装件 High-frequency package
12/28/2011	CN101562960B 散热装置组合及其扣具 Its combination of heat sink clip
12/28/2011	CN101554756B 一种可提高切割成品率的切割道 Capable of improving the yield of the cutting scribe
12/28/2011	CN101547584B 散热装置、散热装置组合及其固定装置 Heat sink, heat sink combination and fixtures
12/28/2011	CN101546753B 发电、led照明双用聚光太阳电池组件 Power generation, led lighting double concentrator solar modules with
12/28/2011	CN101522793B 半导体密封用环氧树脂组合物及半导体装置 The semiconductor encapsulating epoxy resin composition and a semiconductor device
12/28/2011	CN101515573B 用于一半导体集成电路的导电结构 For the conductive structure of a semiconductor integrated circuit
12/28/2011	CN101483169B 用于封装芯片的承载带及其芯片封装结构 Carrier tape and chip packaging structure for packaging chips
12/28/2011	CN101461063B 基板检查及修正装置、以及基板评估系统 Board inspection and correction device, as well as board evaluation system
12/28/2011	CN101453858B 散热装置 Cooling devices
12/28/2011	CN101419918B 制造印刷电路板的方法以及通过该方法制造的印刷电路板 The method of manufacturing a printed circuit board and by the method of manufacturing the printed circuit board
12/28/2011	CN101415313B 散热装置 Cooling devices
12/28/2011	CN101399248B 配线基板及其制造的方法 And a method of manufacturing the wiring substrate
12/28/2011	CN101399246B 覆晶封装基板结构及其制法 Flip chip package substrate structure Jiqizhifa
12/28/2011	CN101383329B 嵌埋有芯片的封装结构及其制作方法 There embedded chip package structure and method of making
12/28/2011	CN101364591B 挤出失效监视器结构及其方法 Failure Monitor extrusion structure and method
12/28/2011	CN101345247B 光电动势装置及其制造方法 A photovoltaic device and its manufacturing method
12/28/2011	CN101315932B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/28/2011	CN101312169B 半导体模块、半导体模块的制造方法以及便携式设备 Semiconductor module, method for manufacturing the semiconductor module and a portable device
12/28/2011	CN101232778B 印刷布线板 A printed circuit board
12/28/2011	CN101211891B 连接结构、电光装置及其制造方法 Connection structure, an electro-optical device and manufacturing method thereof
12/28/2011	CN101167251B 集成智能功率开关 Integrated Smart Power Switch
12/28/2011	CN101127384B 发光装置 Light-emitting device
12/28/2011	CN101087508B 散热器 Heat sink
12/28/2011	CN101005224B 集成有控制设备的电动发电机 Integrated electric generator control device
12/27/2011	US8084871 Redistribution layer enhancement to improve reliability of wafer level packaging
12/27/2011	US8084870 Semiconductor devices and electrical parts manufacturing using metal coated wires
12/27/2011	US8084869 Semiconductor device and method for manufacturing the same
12/27/2011	US8084868 Semiconductor package with fast power-up cycle and method of making same
12/27/2011	US8084867 Apparatus, system, and method for wireless connection in integrated circuit packages
12/27/2011	US8084866 Microelectronic devices and methods for filling vias in microelectronic devices
12/27/2011	US8084865 Anchoring structure and intermeshing structure
12/27/2011	US8084864 Electromigration resistant aluminum-based metal interconnect structure
12/27/2011	US8084863 Circuitized substrate with continuous thermoplastic support film dielectric layers
12/27/2011	US8084862 Interconnect structures with patternable low-k dielectrics and method of fabricating same
12/27/2011	US8084860 Liquid crystal display device and manufacturing method therefor
12/27/2011	US8084859 Semiconductor device
12/27/2011	US8084858 Metal wiring structures for uniform current density in C4 balls
12/27/2011	US8084857 Method and article of manufacture for wire bonding with staggered differential wire bond pairs
12/27/2011	US8084856 Thermal spacer for stacked die package thermal management
12/27/2011	US8084855 Integrated circuit tampering protection and reverse engineering prevention coatings and methods
12/27/2011	US8084854 Pass-through 3D interconnect for microelectronic dies and associated systems and methods
12/27/2011	US8084853 Semiconductor flip chip package utilizing wire bonding for net switching
12/27/2011	US8084852 Hybrid integrated circuit device, and method for fabricating the same, and electronic device
12/27/2011	US8084851 Side stacking apparatus and method
12/27/2011	US8084850 Semiconductor chip package, stacked package comprising semiconductor chips and methods of fabricating chip and stacked packages
12/27/2011	US8084849 Integrated circuit package system with offset stacking
12/27/2011	US8084848 Leadframe, leadframe type package and lead lane
12/27/2011	US8084847 Prefabricated lead frame and bonding method using the same
12/27/2011	US8084846 Balanced semiconductor device packages including lead frame with floating leads and associated methods
12/27/2011	US8084839 Circuit board having conductive shield member and semiconductor package using the same
12/27/2011	US8084821 Integrated circuit including a power MOS transistor
12/27/2011	US8084816 Semiconductor module
12/27/2011	US8084794 Semiconductor device and manufacturing method thereof
12/27/2011	US8084769 Testkey design pattern for gate oxide
12/27/2011	US8084768 Semiconductor device
12/27/2011	US8084553 Curable adhesive compositions, process, and applications
12/27/2011	US8084353 Methods for pitch reduction formation
12/27/2011	US8084302 Semiconductor package having semiconductor die with internal vertical interconnect structure and method therefor
12/27/2011	US8084279 Method of manufacturing semiconductor device that uses both a normal photomask and a phase shift mask for defining interconnect patterns
12/27/2011	US8084130 Epoxy resin molding material for sealing and electronic component device
12/27/2011	US8083153 Securities, chip mounting product, and manufacturing method thereof
12/22/2011	WO2011160074A1 Method for creating and packaging three dimensional stacks of biochips containing microelectro-mechanical systems
12/22/2011	WO2011159961A1 Low form factor synthetic jet thermal management system
12/22/2011	WO2011159417A2 Thermal interface material assemblies, and related methods
12/22/2011	WO2011158976A1 Device for supplying an epoxy moulding compound
12/22/2011	WO2011158942A1 Thermally conductive sheet and process for producing same
12/22/2011	WO2011158929A1 Optical energy-crosslinkable insulating layer material for organic thin film transistor, overcoat insulating layer, and organic thin film transistor
12/22/2011	WO2011158821A1 Semiconductor device and manufacturing method for semiconductor device
12/22/2011	WO2011158756A1 Structure for attaching heat sink, and heat sink attached using the structure
12/22/2011	WO2011158731A1 Substrate for mounting semiconductor element and method for manufacturing the substrate
12/22/2011	WO2011158719A1 Typical metal containing polysiloxane composition, process for production of same, and uses thereof
12/22/2011	WO2011158704A1 Method for manufacturing semiconductor device
12/22/2011	WO2011158698A1 Process for production of semiconductor device, and semiconductor device
12/22/2011	WO2011158638A1 Electronic device, display device, and television receiver
12/22/2011	WO2011158615A1 Heat dissipation structure for electronic device
12/22/2011	WO2011158565A1 Heat transfer sheet, manufacturing method for heat transfer sheet, and heat radiation device
12/22/2011	WO2011158456A1 Semiconductor device and process for production thereof, and mounting body equipped with the semiconductor device
12/22/2011	WO2011158412A1 Package structure, method for manufacturing same, and method for repairing package structure
12/22/2011	WO2011157267A1 Semiconductor device with integrated chamber for a coolant and method for producing a semiconductor device with integrated chamber for a coolant and receptacle device for receiving such a semiconductor device
12/22/2011	WO2011157171A2 Insulating ring for packaging, insulating ring assembly and package
12/22/2011	WO2011156887A1 Semiconductor device with through-silicon vias
12/22/2011	WO2011097400A3 Improved heat sink
12/22/2011	WO2011090364A3 Curable composition
12/22/2011	US20110312982 Cancer Treatment Method
12/22/2011	US20110312166 Methods of Manufacturing Power Semiconductor Devices with Shield and Gate Contacts
12/22/2011	US20110312138 Methods of Manufacturing Power Semiconductor Devices with Trenched Shielded Split Gate Transistor
12/22/2011	US20110310585 Power Semiconductor Device and Power Conversion Device
12/22/2011	US20110309532 Semiconductor structure with alignment control mask
12/22/2011	US20110309531 Molded beam for optoelectronic sensor chip substrate
12/22/2011	US20110309530 Integrated circuit packaging system with leadframe and method of manufacture thereof
12/22/2011	US20110309528 Electronic Modules and Methods for Forming the Same

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