H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2011
12/28/2011	CN202094128U Surface-contact diode
12/28/2011	CN202094122U 像素阵列基板及显示面板 Pixel array substrate and display panel
12/28/2011	CN202094121U 一种存储模块 A memory module
12/28/2011	CN202094120U 智能发光数码管 Intelligent LED digital tube
12/28/2011	CN202094117U High-current high-voltage high-frequency high-performance IGBT (insulated gate bipolar transistor) module
12/28/2011	CN202094116U 玻璃面板 Glass panel
12/28/2011	CN202094115U Packaging structure for semiconductor crystal grain
12/28/2011	CN202094114U 一种增强型高可靠性防渗透引线框架 An enhanced high reliability impervious leadframe
12/28/2011	CN202094113U 一种新型散热器 A new radiator
12/28/2011	CN202094112U 一种具有支撑柱结构的均热板 Having a support column structure hot plate
12/28/2011	CN202094111U 一种高效铝合金散热器 An efficient aluminum radiator
12/28/2011	CN202094110U 用于电子元件的支托架 Electronic components for supporting the carriage
12/28/2011	CN202094109U 晶圆封装的承载装置 Wafer carrying device package
12/28/2011	CN202093520U 一种用于USB Key的主控芯片 A master chip USB Key
12/28/2011	CN1944499B 降低硅氧烷橡胶硫化产品的表面粘度的方法、用于密封半导体的液体硅氧烷橡胶组合物、硅氧烷橡胶密封的半导体装置和生产半导体装置的方法 Reduce the surface viscosity of the silicone rubber vulcanized product of a method, the liquid silicone rubber for sealing a semiconductor composition, the silicone rubber sealing semiconductor device and a method for producing a semiconductor device
12/28/2011	CN1922401B 压电泵驱动电路和使用该驱动电路的冷却系统 The piezoelectric pump drive circuit and the driver circuit using a cooling system
12/28/2011	CN1879268B 高频信号传输光学模块及其制造方法 High-frequency signal transmitting optical module and its manufacturing method
12/28/2011	CN102301472A 用于在芯片内放置有源和无源装置的技术 Active and passive techniques for placing the device in the chip
12/28/2011	CN102301469A 具有焊球和管脚的集成电路附接结构 IC attachment structure with balls and pins
12/28/2011	CN102301468A 复合部件以及用于制造复合部件的方法 Composite component and a method for manufacturing a composite member
12/28/2011	CN102301467A 可拆卸封装下侧器件附着 Removable devices attached to the underside of the package
12/28/2011	CN102301465A 贯穿衬底的通路 Through the passage of the substrate
12/28/2011	CN102301454A 成膜方法和等离子体成膜装置 Plasma film forming apparatus and film forming method
12/28/2011	CN102300909A 预浸料坯、带有树脂的膜、带有树脂的金属箔、覆金属箔层叠板及印制电路板 Prepreg, a resin film with a metal foil with a resin, a metal-clad laminated board and printed circuit board
12/28/2011	CN102300441A 电子装置及其散热器 Electronic device and radiator
12/28/2011	CN102300440A 可挠式散热导管 Flexible cooling duct
12/28/2011	CN102300397A Metal matrix circuit board and manufacturing method thereof
12/28/2011	CN102300396A 配线基板 Wiring board
12/28/2011	CN102299621A Switching power supply device, switching power supply circuit, and electrical equipment
12/28/2011	CN102299177A 一种接触的制造方法以及具有该接触的半导体器件 A method of manufacturing a semiconductor device having a contact and the contact
12/28/2011	CN102299153A 具有低栅极输入电阻的功率半导体组件及其制作方法 Power semiconductor components and their production methods with low gate input resistance
12/28/2011	CN102299148A 资料储存装置 Data storage device
12/28/2011	CN102299144A 分立igbt模组和基板 Igbt discrete modules and substrates
12/28/2011	CN102299143A 半导体元件 Semiconductor device
12/28/2011	CN102299142A 具有天线的封装结构及其制作方法 Package structure and a method of preparing an antenna
12/28/2011	CN102299141A 一种直接在led芯片上制造esd保护电路的方法 A method of manufacturing the chip directly on led esd protection circuit
12/28/2011	CN102299140A Package for a wireless enabled integrated circuit
12/28/2011	CN102299139A 半导体集成电路 The semiconductor integrated circuit
12/28/2011	CN102299138A 金铁合金互联线及其制作方法 Ferroalloys interconnection lines and production methods
12/28/2011	CN102299137A Semiconductor device and method of fabricating the same
12/28/2011	CN102299136A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/28/2011	CN102299135A 半导体结构 Semiconductor structure
12/28/2011	CN102299134A 一种内插有Dummy金属阵列的片上集成电感 An on-chip interpolating Dummy metal array of integrated inductors
12/28/2011	CN102299133A 半导体结构及其制造方法 Semiconductor structure and manufacturing method
12/28/2011	CN102299132A 半导体装置用封装及其制造方法、以及半导体装置 The semiconductor device package and a manufacturing method, and semiconductor device
12/28/2011	CN102299131A 一种sod-123封装结构的二极管 One kind of sod-123 diode package structure
12/28/2011	CN102299130A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/28/2011	CN102299129A 有关防失控电路模块端口的安全布局方法 Methods circuit layout module port security related anti-runaway
12/28/2011	CN102299128A 发热构件和散热构件的组装用配件及使用了该组装用配件的散热器装配体 Heat radiating member and assembled with parts and components used for assembling parts of the radiator assembly
12/28/2011	CN102299127A 用于封装元件的双向散热器及其组装方法 Bidirectional radiator assembly and method for encapsulating components
12/28/2011	CN102299126A 散热基底以及制造该散热基底的方法 Cooling the substrate and a method of manufacturing the heat dissipation substrate
12/28/2011	CN102299125A 半导体装置用封装及其制造方法、以及半导体装置 The semiconductor device package and a manufacturing method, and semiconductor device
12/28/2011	CN102299124A 树脂密封型电子控制装置及其制造方法 Apparatus and method for manufacturing a resin sealed type electronic control
12/28/2011	CN102299123A 一种光电子器件的封装方法 An encapsulation method for optoelectronic devices
12/28/2011	CN102299122A 一种光电子器件的封装方法 An encapsulation method for optoelectronic devices
12/28/2011	CN102299121A 一种光电子器件的封装方法 An encapsulation method for optoelectronic devices
12/28/2011	CN102299120A 一种光电子器件的封装方法 An encapsulation method for optoelectronic devices
12/28/2011	CN102299119A 一种光电子器件的封装方法 An encapsulation method for optoelectronic devices
12/28/2011	CN102299118A 一种光电子器件的封装方法 An encapsulation method for optoelectronic devices
12/28/2011	CN102299117A 具有冷却机制的半导体模块及其生产方法 Semiconductor module and production method having a cooling mechanism
12/28/2011	CN102299116A 气密性金属封装外壳壳体 Airtight metal packaging shell casing
12/28/2011	CN102299115A 具有包含势垒金属的凸块组合件的晶片级封装(wlp)装置 Having a barrier metal comprising a bump wafer-level package assembly (wlp) means
12/28/2011	CN102299108A 重叠沟槽式栅极半导体组件及其制作方法 Overlapping trench-gate semiconductor components and production methods
12/28/2011	CN102299100A 接触孔的制作方法 The method of making a contact hole
12/28/2011	CN102299099A 半导体结构的形成方法及半导体结构 The method of forming a semiconductor structure and semiconductor structure
12/28/2011	CN102299096A 半导体器件的接触的制造方法及具有该接触的半导体器件 The method of manufacturing a semiconductor device of the contact and the contact of a semiconductor device having
12/28/2011	CN102299095A 层间介质层、具有该介质层的半导体器件及制造方法 An interlayer dielectric layer, a semiconductor device and manufacturing method of the dielectric layer
12/28/2011	CN102299094A 熔丝结构的制作方法 The method of making fuse structure
12/28/2011	CN102299086A 半导体封装件及其制造方法和系统 Semiconductor package and its manufacturing method and system
12/28/2011	CN102299085A Packaged semiconductor device having improved locking properties
12/28/2011	CN102299082A 半导体承载元件的制造方法及应用其的封装件的制造方法 Semiconductor device and manufacturing method of carrying application method of producing a package of its
12/28/2011	CN102299081A 一种封装基板制造方法及封装基板 A package board manufacturing method and package substrate
12/28/2011	CN102299080A 一种基板及其加工方法 A substrate processing method and
12/28/2011	CN102299053A 一种半导体器件及其制造方法 A semiconductor device and manufacturing method thereof
12/28/2011	CN102298265A 共聚物组合物、光刻介电组合物及电气或电子器件 Copolymer composition lithography dielectric compositions and electrical or electronic components
12/28/2011	CN102297612A 热交换器 Heat exchanger
12/28/2011	CN102295895A 具有优异的粘合性能和耐热性的热固性双面粘合膜 Having excellent adhesion properties and heat resistance of a thermosetting double-sided adhesive film
12/28/2011	CN102295894A 电路连接用粘接膜及用途、结构体及制造方法和连接方法 Circuit-connecting adhesive film use, structure and method of manufacture and the connection method
12/28/2011	CN102295893A 电路连接用粘接膜及用途、结构体及制造方法和连接方法 Circuit-connecting adhesive film use, structure and method of manufacture and the connection method
12/28/2011	CN102295892A 电路连接用粘接膜及用途、结构体及制造方法和连接方法 Circuit-connecting adhesive film use, structure and method of manufacture and the connection method
12/28/2011	CN101908516B 倒装芯片锡银凸块结构及其制造方法 Silver tin bump flip chip structure and manufacturing method
12/28/2011	CN101847641B 阵列基板及其制造方法和宽视角液晶显示器 Array substrate and manufacturing method thereof, and a wide viewing angle liquid crystal display
12/28/2011	CN101847640B 阵列基板及其制造方法和液晶面板 The method of manufacturing the array substrate and the liquid crystal panel,
12/28/2011	CN101819986B 电光学装置以及电子机器 Electro-optical device and electronic apparatus
12/28/2011	CN101814471B 互连结构 Interconnect structure
12/28/2011	CN101807587B Tft-lcd阵列基板及其制造方法和液晶显示器 Tft-lcd array substrate and manufacturing method and a liquid crystal display
12/28/2011	CN101794775B 在半导体衬底中形成的螺旋电感以及形成该电感的方法 Formed in the semiconductor substrate and the inductance of spiral inductor forming method
12/28/2011	CN101789418B 一种多孔超低介电常数材料薄膜及其制备方法 A porous ultra low-k film material and its preparation method
12/28/2011	CN101785103B 低阻抗晶圆穿孔 Low impedance wafer perforation
12/28/2011	CN101785101B 微电子封装元件及其制备方法 Microelectronic packaging components and preparation method
12/28/2011	CN101777552B 扼流电感 Choke
12/28/2011	CN101762917B 像素阵列以及显示面板 Pixel array and a display panel
12/28/2011	CN101761795B 发光二极管照明装置及其封装方法 LED illumination apparatus and method for packaging
12/28/2011	CN101752332B 光电半导体装置 Optoelectronic semiconductor devices
12/28/2011	CN101740528B 增进散热的无外引脚式半导体封装构造及其组合 Enhance heat dissipation without external pin type semiconductor package and combinations
12/28/2011	CN101728399B 薄膜晶体管数组基板及其制造方法 The thin film transistor array substrate and manufacturing method
12/28/2011	CN101728341B 电子封装装置 Electronic packaging devices
12/28/2011	CN101718929B 一种阵列基板的扇出线路 A fan-out circuit array substrate
12/28/2011	CN101692425B 一种esd保护的设计方法 A protective design method esd
12/28/2011	CN101691910B Led封装模块及其制备方法 Led package module and its preparation method

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