H01L 23 - Details of semiconductor or other solid state devices

Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2011
12/29/2011	WO2011160419A1 Semiconductor structure and manufacturing method thereof
12/29/2011	WO2011160332A1 Ceramic packaging base board
12/29/2011	WO2011119308A3 Method of forming a multi-chip stacked structure including a thin interposer chip having a face-to-back bonding with another chip
12/29/2011	WO2011114960A9 Film forming method and film forming apparatus
12/29/2011	US20110318885 Thermally and Electrically Enhanced Ball Grid Array Package
12/29/2011	US20110317388 Electronic device having a wiring substrate
12/29/2011	US20110317387 Integrated Voltage Regulator with Embedded Passive Device(s) for a Stacked IC
12/29/2011	US20110317385 Wafer level package (wlp) device having bump assemblies including a barrier metal
12/29/2011	US20110316572 Testing die-to-die bonding and rework
12/29/2011	US20110316174 Semiconductor integrated circuit device
12/29/2011	US20110316173 Electronic device comprising a nanotube-based interface connection layer, and manufacturing method thereof
12/29/2011	US20110316172 Semiconductor package and manufacturing method thereof
12/29/2011	US20110316171 Semiconductor Device and Method of Forming Interconnect Structure for Encapsulated Die Having Pre-Applied Protective Layer
12/29/2011	US20110316170 Wiring Substrate, Semiconductor Device, and Method for Manufacturing Wiring Substrate
12/29/2011	US20110316169 Wiring substrate and method for manufacturing the wiring substrate
12/29/2011	US20110316168 Semiconductor Device and Method of Fabricating the Same
12/29/2011	US20110316167 Electrical interconnect for an integrated circuit package and method of making same
12/29/2011	US20110316166 Integrated circuit system with via and method of manufacture thereof
12/29/2011	US20110316165 Semiconductor Device and Method of Fabricating the Same
12/29/2011	US20110316164 Corrugated die edge for stacked die semiconductor package
12/29/2011	US20110316163 Integrated circuit packaging system with molded interconnects and method of manufacture thereof
12/29/2011	US20110316162 Integrated circuit packaging system with trenches and method of manufacture thereof
12/29/2011	US20110316161 Method of producing a dual damascene multilayer interconnection and multilayer interconnection structure
12/29/2011	US20110316160 Semiconductor Arrangement, Semiconductor Module, and Method for Connecting a Semiconductor Chip to a Ceramic Substrate
12/29/2011	US20110316159 Chip stack package
12/29/2011	US20110316158 Method and system for thin multi chip stack package with film on wire and copper wire
12/29/2011	US20110316157 Semiconductor device and a method for manufacturing the same
12/29/2011	US20110316156 Semiconductor Device and Method of Forming RDL Along Sloped Side Surface of Semiconductor Die for Z-Direction Interconnect
12/29/2011	US20110316155 Semiconductor packaging system with multipart conductive pillars and method of manufacture thereof
12/29/2011	US20110316154 Semiconductor device having semiconductor substrate, and method of manufacturing the same
12/29/2011	US20110316153 Semiconductor device and package including the semiconductor device
12/29/2011	US20110316152 Manufacturing method of semiconductor packages and a semiconductor package
12/29/2011	US20110316151 Semiconductor package and method for manufacturing semiconductor package
12/29/2011	US20110316150 Semiconductor package and method for manufacturing semiconductor package
12/29/2011	US20110316149 Method of mounting electronic component and mounting substrate
12/29/2011	US20110316148 Wiring substrate
12/29/2011	US20110316147 Embedded 3D Interposer Structure
12/29/2011	US20110316146 Semiconductor Device and Method of Forming Anisotropic Conductive Film Between Semiconductor Die and Build-Up Interconnect Structure
12/29/2011	US20110316145 Nano/micro-structure and fabrication method thereof
12/29/2011	US20110316144 Flexible heat sink having ventilation ports and semiconductor package including the same
12/29/2011	US20110316143 Semiconductor module with cooling mechanism and production method thereof
12/29/2011	US20110316142 Semiconductor module with resin-molded package of heat spreader and power semiconductor chip
12/29/2011	US20110316141 Layered chip package and method of manufacturing same
12/29/2011	US20110316140 Microelectronic package and method of manufacturing same
12/29/2011	US20110316139 Package for a wireless enabled integrated circuit
12/29/2011	US20110316138 High frequency fast recovery diode
12/29/2011	US20110316137 Method for manufacturing a semiconductor integrated circuit device
12/29/2011	US20110316136 Semiconductor device with lead terminals having portions thereof extending obliquely
12/29/2011	US20110316135 Semiconductor device and method of manufacturing the same
12/29/2011	US20110316134 Semiconductor storage device and manufacturing method thereof
12/29/2011	US20110316133 Integrated circuit package system with package stand-off and method of manufacture thereof
12/29/2011	US20110316132 Semiconductor Device and Method of Forming Vertically Offset Bond on Trace Interconnect Structure on Leadframe
12/29/2011	US20110316131 Semiconductor device with heat spreader
12/29/2011	US20110316130 Thin semiconductor package and method for manufacturing same
12/29/2011	US20110316129 Multilayer structures for magnetic shielding
12/29/2011	US20110316124 Semiconductor device
12/29/2011	US20110316123 Laminated semiconductor substrate, laminated chip package and method of manufacturing the same
12/29/2011	US20110316119 Semiconductor package having de-coupling capacitor
12/29/2011	US20110316117 Die package and a method for manufacturing the die package
12/29/2011	US20110316072 Semiconductor memory devices including asymmetric word line pads
12/29/2011	US20110316055 Substrate provided with a semi-conducting area associated with two counter-electrodes and device comprising one such substrate
12/29/2011	US20110315987 Portable memory devices
12/29/2011	US20110315986 Semiconductor integrated circuit
12/29/2011	US20110315984 Semiconductor memory card and method of manufacturing the same
12/29/2011	US20110315962 Nanosensors
12/29/2011	US20110315210 Glass compositions used in conductors for photovoltaic cells
12/29/2011	US20110315182 Thermoelectric Material, Thermoelectric Element, Thermoelectric Module and Method for Manufacturing the Same
12/29/2011	US20110314862 Method and arrangement for cooling a substrate, especially a semiconductor
12/29/2011	DE10321692B4 Verbesserung einer Drahtkontaktierbarkeit in einer gehäusten Sensoranordnung Improvement of a wire bondability housed in a sensor array
12/29/2011	DE102011105554A1 Verfahren, Vorrichtung und System zum Schützen von Versorgungsknoten vor elekrostatischer Entladung Method, apparatus and system for protecting supply node before discharge elekrostatischer
12/29/2011	DE102011105354A1 Vorrichtung mit Kontakthöckereinheiten, die ein Barrieremetall umfassen. Device having bumps units which comprise a barrier metal.
12/29/2011	DE102011078204A1 Temperaturregelanordnung und temperaturregelverfahren für einenleistungsschalter Temperature control arrangement and temperature regulation method for switches
12/29/2011	DE102011001304A1 Bauelement und Verfahren zur Herstellung eines Bauelements Device and method for manufacturing a device
12/29/2011	DE102010054761A1 Abgedichtete elektronische Steuereinrichtung und Verfahren zum Herstellen derselben Sealed electronic control device and method for manufacturing the same
12/29/2011	DE102010024864A1 Optoelektronisches Halbleiterbauteil An optoelectronic semiconductor device
12/29/2011	DE102009024369B4 Leistungselektronisches System Power Electronic System
12/29/2011	DE102007052111B4 Elektronische Vorrichtung mit Stromschienenanordnung und darauf mittels Löten montiertes elektronisches Bauteil Electronic device with bus bar assembly and mounted thereon by soldering electronic component
12/29/2011	DE102006021959B4 Leistungshalbleiterbauteil und Verfahren zu dessen Herstellung Power semiconductor device and process for its preparation
12/29/2011	DE102006019372B4 Anordnung von aktiven Elementen und Verfahren für das Testen einer Anordnung von aktiven Elementen Arrangement of active elements and method for testing an array of active elements
12/28/2011	EP2400545A2 Package for a wireless enabled integrated circuit
12/28/2011	EP2400544A2 Fixture for assembling heat generating component and radiating component and heat sink assembly using the same
12/28/2011	EP2400543A2 Semiconductor device and method of producing the same, and power conversion apparatus incorporating this semiconductor device
12/28/2011	EP2400542A1 Method for producing semiconductor wafer assembly, semiconductor wafer assembly, and semiconductor device
12/28/2011	EP2400541A1 Semiconductor wafer assembly, method for producing semiconductor wafer assembly, and semiconductor device
12/28/2011	EP2400540A1 Vacuum sealed package, printed circuit board having vacuum sealed package, electronic device, and method for manufacturing vacuum sealed package
12/28/2011	EP2400538A1 A silicon on insulator structure
12/28/2011	EP2400534A1 Packaged semiconductor device having improved locking properties
12/28/2011	EP2400527A1 Silicon carbide substrate and method for production thereof
12/28/2011	EP2400252A1 Heat-exchange device, in particular for a car
12/28/2011	EP2400248A1 Ebullient cooling apparatus
12/28/2011	EP2399970A2 Nanocomposites
12/28/2011	EP2399961A1 Cycloalkyl group-containing silicone resin composition and a method of using the same
12/28/2011	EP2399291A1 Electrical apparatus with electrostatic shield
12/28/2011	EP2399290A1 Physical structure for use in a physical unclonable function
12/28/2011	EP2399289A1 Thermal pad and method of forming the same
12/28/2011	EP2399288A2 Integrated circuit micro-module
12/28/2011	EP2399284A2 Semiconductor chip with reinforcement layer
12/28/2011	EP1704179B1 Thermally conductive thermoplastic resin compositions
12/28/2011	EP1470580B1 Method for bilayer HDP CVD / PE CVD cap in advanced BEOL interconnect structures
12/28/2011	CN202095230U 一种电子产品散热器及数字电视接收终端 An electronic products and digital TV receiver terminal radiator

1 ... 420 421 422 423 424 425 426 427 428 429 430 431 432 433 434 435 436 437 438 439 440 ... 2262