Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2014
12/10/2014CN204011408U 引线框架及半导体封装体 Lead frame and semiconductor package
12/10/2014CN204011407U 芯片封装的新型sop结构 The new chip package structure sop
12/10/2014CN204011406U 半导体装置和搭载了半导体装置以及电子部件的应用板 Semiconductor device and semiconductor device equipped with electronic components and application board
12/10/2014CN204011405U 一种焊盘结构 One kind of pad structure
12/10/2014CN204011404U 半导体器件的导线焊接点强化结构 Conductor pads of the semiconductor device reinforcing structure
12/10/2014CN204011403U 一种复合散热片 A composite fin
12/10/2014CN204011402U 基于dbc工艺的ldmos微波功率器件外壳 Dbc based microwave power device technology ldmos shell
12/10/2014CN204011401U 高效散热器具 Efficient radiator with
12/10/2014CN204011400U 新型整流桥 The new bridge rectifier
12/10/2014CN204011399U 整流桥 Rectifier bridge
12/10/2014CN204011398U 一种芯片封装的新型sop结构 A new chip package structure sop
12/10/2014CN204011397U 电容式的指纹传感器封装结构 Capacitive fingerprint sensor package structure
12/10/2014CN204011396U 一种新型PoP堆叠封装结构 A new PoP stacked package structure
12/10/2014CN204011395U 一种双面半导体器件的qfn封装结构 Qfn package structure of a semiconductor device, double-sided
12/10/2014CN204011394U 双岛sop封装结构 Double Island sop package
12/10/2014CN204011393U 用于展示的硅塑封双向触发二极管 Silicon plastic for display diac
12/10/2014CN204011392U 汽车、igbt模块及其底板组件 Car, igbt module and backplane assemblies
12/10/2014CN204011391U 氮化铝热沉硅双极功率器件外壳 Aluminum nitride heat sink shell silicon bipolar power devices
12/10/2014CN204011390U 一种倒装安装芯片的陶瓷封装外壳 A flip chip-mounting ceramic package housing
12/10/2014CN203987627U 一种咖啡机中的可控硅散热装置 One kind of coffee machine SCR heat sink
12/10/2014CN104206043A 高频组件 High-frequency components
12/10/2014CN104206041A 冷却构造、涡流形成板成形装置及涡流生成部的成形方法 The cooling structure, the vortex forming plate forming apparatus and method of forming the vortex generating portion
12/10/2014CN104206034A 布线基板 Wiring board
12/10/2014CN104205529A 半导体组件 Semiconductor Components
12/10/2014CN104205482A 微链路高带宽的芯片到芯片总线 Micro-link high bandwidth chip-to-chip bus
12/10/2014CN104205389A 高电容密度金属-绝缘体-金属电容器 High capacitance density of the metal - insulator - metal capacitor
12/10/2014CN104205366A 密封的半导体发光器件 Sealing the semiconductor light emitting device
12/10/2014CN104205341A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
12/10/2014CN104205340A 导电薄膜、用于形成导电薄膜的涂布液、场效应晶体管、以及用于生产场效应晶体管的方法 Electroconductive thin film for forming the conductive film coating solution, the field effect transistor, and a method for producing a field effect transistor
12/10/2014CN104205329A 堆叠的集成部件装置中的多个通电元件 Integrated components of the device in a plurality of stacked power elements
12/10/2014CN104205328A 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/10/2014CN104205327A 半导体组件及其制造方法 Semiconductor component and its manufacturing method
12/10/2014CN104205326A 热交换组件及其组装方法 Heat exchange components and their assembly method
12/10/2014CN104205325A 自带散热器的功率模块用基板、自带冷却器的功率模块用基板以及功率模块 Radiator comes with a power module substrate, comes cooler power module substrate and a power module
12/10/2014CN104205324A 自带散热器的功率模块用基板及自带散热器的功率模块用基板的制造方法 The method of manufacturing a power module own radiator and the substrate carrying the heat sink of the power module substrate
12/10/2014CN104205323A 功率模块用基板、自带散热器的功率模块用基板、功率模块及功率模块用基板的制造方法 Power module substrate, a power module substrate carrying method of manufacturing the power module and the power module substrate of the heat sink
12/10/2014CN104205322A 中空成形体的制造方法、中空成形体及制造装置 The method of manufacturing a hollow molded, hollow molded and manufacturing apparatus
12/10/2014CN104205313A 半导体组件及其制造方法 Semiconductor component and its manufacturing method
12/10/2014CN104205268A 三维无源多器件结构 Passive multi-dimensional device structures
12/10/2014CN104204914A 用于眼科装置的堆叠式集成部件介质插入物 Stacked integrated component for ophthalmic apparatus Media Insert
12/10/2014CN104204913A 包括堆叠式集成元件的通电眼科镜片 Energized ophthalmic lens including a stacked integrated element
12/10/2014CN104204833A 具有拼合式引线框的集成电路封装 Has split leadframe IC package
12/10/2014CN104204100A 可固化的有机硅组合物、其固化产物以及光学半导体器件 Curable silicone composition, which cured product and an optical semiconductor device
12/10/2014CN104204084A 固化性树脂组合物及其制造方法、高导热性树脂组合物及高导热性层叠基板 The curable resin composition and a method for producing a high thermally conductive resin composition and a laminated substrate of high thermal conductivity
12/10/2014CN104204031A 活性酯树脂、热固性树脂组合物、其固化物、半导体密封材料、预浸料、电路基板、和积层薄膜 An active ester resin, thermosetting resin composition, a cured product thereof, a semiconductor sealing material, a prepreg, a circuit board, and a laminated film
12/10/2014CN104204022A 固化性环氧树脂组合物 Curable epoxy resin composition
12/10/2014CN104203817A 石墨片的制造方法 Method of manufacturing a graphite sheet
12/10/2014CN104201275A 一种散热层、具其的电子器件及电子器件的制作方法 A heat sink layer, with which the electronic device and an electronic device fabrication method
12/10/2014CN104201172A 监测介质层薄膜质量及填孔能力的测试结构 Test structures to monitor dielectric layer film quality and the ability to fill holes
12/10/2014CN104201171A 一种检测缺陷残留的测试结构 A method of detecting residual defect test structure
12/10/2014CN104201170A 一种立体包裹式金属-氧化层-金属电容 A stereoscopic wrapped metal - oxide - metal capacitor
12/10/2014CN104201169A 一种存储器模块和处理模块 A memory module and processing module
12/10/2014CN104201168A 一种芯片倾斜堆叠的圆片级封装单元及封装方法 A chip tilt unit stacked wafer level packaging and packaging methods
12/10/2014CN104201167A 一种焊垫结构及显示装置 One kind pad configuration and display device
12/10/2014CN104201166A 低成本tsv转接板及其制造工艺 Adapter board and its low cost manufacturing processes tsv
12/10/2014CN104201165A 一种双环硅通孔结构及其制造方法 A Double Loop silicon vias structure and manufacturing method
12/10/2014CN104201164A 一种三维集成电路组件及其制备方法 A three-dimensional integrated circuit component and its preparation method
12/10/2014CN104201163A 一种基于铝阳极氧化技术的高密度转接板及其制造方法 A high-density patch panel and method of manufacturing technologies based on anodized aluminum
12/10/2014CN104201162A 半导体器件及其制造方法、毫米波电介质内传输装置及其制造方法、以及毫米波电介质内传输系统 Semiconductor device and manufacturing method, the millimeter-wave dielectric transmission device and its manufacturing method, and a millimeter-wave dielectric transmission system within the electrical
12/10/2014CN104201161A 一种换流阀组件冷却系统 One kind of commutation valve assembly cooling system
12/10/2014CN104201160A 一种带有多孔泡沫金属的强化沸腾换热结构 A strengthening of the porous metal foam structure with boiling heat
12/10/2014CN104201159A 提高键合晶圆散热效果的方法 To improve the cooling effect of the wafer bonding method
12/10/2014CN104201158A 一种硅基微通道散热器集成冷却装置 A silicon-based micro-channel heat sink integrated cooling system
12/10/2014CN104201157A 混合键合工艺中的半导体散热结构和方法 Hybrid bonding process of a semiconductor structure and method of cooling
12/10/2014CN104201156A 基于基板的凸点倒装芯片csp封装件、基板及制造方法 Based csp bump flip chip package, the substrate and substrate manufacturing method
12/10/2014CN104201149A 一种含氟的多孔低介电常数复合薄膜及其制备方法 Porous low dielectric constant composite film and method for preparing fluorinated
12/10/2014CN104201116A 指纹识别芯片封装方法和封装结构 Fingerprint identification chip encapsulation method and package structure
12/10/2014CN104201115A 晶圆级指纹识别芯片封装结构及封装方法 Wafer-level fingerprint identification chip packaging structure and packaging method
12/10/2014CN104201114A 一种侧壁绝缘保护的芯片封装方法及其封装结构 One kind of sidewall insulation method of chip packaging and packaging structure
12/10/2014CN104201113A 系统级封装的气密性密封结构及其制造方法 Hermetically sealed structure and manufacturing method of the system-in-package
12/10/2014CN104194350A 一种大功率二极管芯片保护封装胶及其制备方法 To a diode chip protection plastic packaging and preparation method of high-power
12/10/2014CN104194276A 提高了黑色度的密封用环氧树脂成形材料的制造方法 Improved method for producing a degree of black epoxy resin sealing material to be shaped
12/10/2014CN104188531A 一种咖啡机中的可控硅散热装置 One kind of coffee machine SCR heat sink
12/10/2014CN103135354B 正型光敏树脂组合物、由其制造的光敏树脂膜及含有该光敏树脂膜的半导体装置 Positive type photosensitive resin composition, a photosensitive resin film fabricated by a semiconductor device comprising the photosensitive resin film,
12/10/2014CN103094259B 电子零件内置基板 Built-board electronic components
12/10/2014CN103013370B 一种各向异性导电胶膜及电子装置 An anisotropic conductive film and electronic devices
12/10/2014CN102978432B 一种用于半导体器件的引线支架 A semiconductor device lead frame
12/10/2014CN102978429B 一种制造支架的铜合金 A copper alloy stent manufacturing
12/10/2014CN102876277B 粘接剂组合物和使用该组合物的电路连接膜，以及电路部件的连接方法和电路连接体 The adhesive composition and the circuit-connecting film using the composition, and a circuit member connection method and the circuit-connected body
12/10/2014CN102843858B 用于固设一半导体芯片的线路基板及其制造方法 Circuit substrate is fixedly arranged and a semiconductor chip manufacturing method for
12/10/2014CN102790051B 阵列基板及其制备方法、显示装置 Array substrate and its preparation method, the display device
12/10/2014CN102738115B 集成电路器件及其制造方法 Integrated circuit device and manufacturing method thereof
12/10/2014CN102738111B 晶片封装结构 Chip package structure
12/10/2014CN102693959B Mos晶体管栅极电阻测试结构 Mos transistor gate resistance test structure
12/10/2014CN102683311B 晶片封装体及其形成方法 Chip package and method of forming
12/10/2014CN102683305B 一种多孔微柱变曲率型面的芯片强化沸腾换热结构 Chip strengthen a porous micro-column type surface curvature becomes boiling heat transfer structure
12/10/2014CN102683303B 半导体装置 Semiconductor device
12/10/2014CN102655144B 一种tft阵列基板及其制造方法和液晶显示器 One kind tft array substrate and manufacturing method and a liquid crystal display
12/10/2014CN102651361B 集成电路 IC
12/10/2014CN102651334B 半导体装置及用于制造半导体装置的方法 The method of manufacturing a semiconductor device and a semiconductor device for
12/10/2014CN102638944B 电路连接用粘接薄膜、连接结构体以及其制造方法 Circuit-connecting adhesive film, the connection structure and a manufacturing method
12/10/2014CN102629601B 粘接的晶圆片堆叠和电镀粘接的晶圆片堆叠的方法 Wafers stacked wafer bonding method stacking and bonding plating
12/10/2014CN102576740B 电涌保护器件 Surge protection devices
12/10/2014CN102548361B 利用潜热型功能流体的散热装置及其散热方法 Functional use of latent heat and thermal fluid heat sink method
12/10/2014CN102543968B 三维立体堆叠芯片封装结构 Three-dimensional stacked chip package structure
12/10/2014CN102543927B 嵌埋穿孔中介层的封装基板及其制造方法 Embedded perforated package substrate and a manufacturing method of the interposer
12/10/2014CN102543765B 一种贴片元器件焊盘设计方法、焊盘结构及印刷电路板 A patch components pad design methods, and printed circuit board pad structure
12/10/2014CN102522393B 封装器件及封装多个集成电路的组件 Packaged device assembly and packaging a plurality of integrated circuits
12/10/2014CN102473829B Led芯片接合体、led封装体、及led封装体的制造方法 Manufacturing method Led chip assembly, led package body, the package body and led
12/10/2014CN102324422B 发光二极管模块与采用此发光二极管模块的显示器 This module uses light-emitting diodes and light-emitting diode display module
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