| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/04/2012 | CN101962466B Intrinsic flame-retardant epoxy resin composition for semiconductor package |
| 01/04/2012 | CN101877956B Spray cooling heat dissipation recovery system |
| 01/04/2012 | CN101859784B Photosensitive element, driving method thereof and liquid crystal display using photosensitive element |
| 01/04/2012 | CN101859755B Power MOSFET (Metal-Oxide-Semiconductor Field Effect Transistor) package body and package method thereof |
| 01/04/2012 | CN101853834B Submerged basic island, embedded basic island lead frame structure and first-etching last-plating method thereof |
| 01/04/2012 | CN101828274B Nickel tin bonding system with barrier layer for semiconductor wafers and devices |
| 01/04/2012 | CN101789428B Embedded PMOS auxiliary trigger SCR structure |
| 01/04/2012 | CN101765341B Molding structure and method for laser-assisting base plate line |
| 01/04/2012 | CN101764127B Semiconductor package without outer pins and stacked structure thereof |
| 01/04/2012 | CN101764073B Manufacturing process for a quad flat non-leaded chip package structure |
| 01/04/2012 | CN101749682B LED recessed lamp |
| 01/04/2012 | CN101738807B Thin film transistor array substrate and liquid crystal display device thereof |
| 01/04/2012 | CN101720504B Semiconductor package having dimpled plate interconnections |
| 01/04/2012 | CN101714554B Semiconductor element and manufacture method thereof |
| 01/04/2012 | CN101695216B Printed circuit board and manufacturing method thereof |
| 01/04/2012 | CN101651106B Manufacturing method of stacked chip package structure |
| 01/04/2012 | CN101630675B High pressure and high power series thyristor self-cold and hot pipe radiator unit and method therefor |
| 01/04/2012 | CN101625985B Semiconductor structure and manufacturing method thereof |
| 01/04/2012 | CN101616573B Radiating device |
| 01/04/2012 | CN101609820B Electronic device and method of manufacturing the electronic device |
| 01/04/2012 | CN101599503B Display device, method of laying out wiring in display device, and electronic device |
| 01/04/2012 | CN101595559B Novel air gap integration scheme |
| 01/04/2012 | CN101594730B Circuit board with conductive structure |
| 01/04/2012 | CN101567370B Coupling capacitance forming circuit, integrated circuit using same and correlative method thereof |
| 01/04/2012 | CN101512759B Dfn semiconductor package structure having reduced electrical resistance |
| 01/04/2012 | CN101510526B Method of manufacturing semiconductor device, and semiconductor device |
| 01/04/2012 | CN101477954B LED chip encapsulation method and construction having high efficient lateral direction light emission effect |
| 01/04/2012 | CN101472448B Radiating module and fan thereof |
| 01/04/2012 | CN101415736B Curable resin composition |
| 01/04/2012 | CN101409229B Epitaxial substrate and manufacturing method thereof, and method for manufacturing LED device |
| 01/04/2012 | CN101322244B Laser fuse structures for high power applications and fusing method |
| 01/04/2012 | CN101315917B Wiring board and its fabricating method |
| 01/04/2012 | CN101308834B Integrated circuit construction |
| 01/04/2012 | CN101290933B Electrostatic discharge protection device |
| 01/04/2012 | CN101241899B Semiconductor device having thermally formed air gap in wiring layer and method of fabricating same |
| 01/04/2012 | CN101237758B Thermal fin and method for positioning the same |
| 01/04/2012 | CN101226976B LED device and locating structure thereof |
| 01/04/2012 | CN101220207B Thermally conductive silicone composition and thermally conductive silicone formed product |
| 01/04/2012 | CN101174611B Multi-ground shielding semiconductor package, method of fabricating the package, and method of preventing noise using multi-ground shielding |
| 01/04/2012 | CN101114640B Semiconductor device |
| 01/04/2012 | CN101090131B Display device and manufacturing method thereof |
| 01/03/2012 | US8090229 Method and device for providing electronic circuitry on a backplate |
| 01/03/2012 | US8089775 Multileveled printed circuit board unit including substrate interposed between stacked bumps |
| 01/03/2012 | US8089768 Component arragement with an optimized assembly capability |
| 01/03/2012 | US8089196 Microcavity enhanced surface acoustic wave devices |
| 01/03/2012 | US8089166 Integrated circuit package with top pad |
| 01/03/2012 | US8089165 Device comprising electrode pad |
| 01/03/2012 | US8089164 Substrate having optional circuits and structure of flip chip bonding |
| 01/03/2012 | US8089163 Semiconductor device production method and semiconductor device |
| 01/03/2012 | US8089162 Semiconductor device and method for manufacturing the same |
| 01/03/2012 | US8089160 IC interconnect for high current |
| 01/03/2012 | US8089159 Semiconductor package with increased I/O density and method of making the same |
| 01/03/2012 | US8089158 Liquid crystal display device and manufacturing method therefor |
| 01/03/2012 | US8089157 Contact metallurgy structure |
| 01/03/2012 | US8089156 Electrode structure for semiconductor chip with crack suppressing dummy metal patterns |
| 01/03/2012 | US8089155 High performance system-on-chip discrete components using post passivation process |
| 01/03/2012 | US8089154 Electronic component formed with barrier-seed layer on base material |
| 01/03/2012 | US8089153 Method for eliminating loading effect using a via plug |
| 01/03/2012 | US8089152 Continuously variable graded artificial dielectrics using nanostructures |
| 01/03/2012 | US8089151 Conductive particles for anisotropic conductive interconnection |
| 01/03/2012 | US8089150 Structurally robust power switching assembly |
| 01/03/2012 | US8089148 Circuit board and semiconductor device having the same |
| 01/03/2012 | US8089147 IMS formed as can for semiconductor housing |
| 01/03/2012 | US8089146 Semiconductor device and heat radiation member |
| 01/03/2012 | US8089145 Semiconductor device including increased capacity leadframe |
| 01/03/2012 | US8089144 Semiconductor device and method for manufacturing the same |
| 01/03/2012 | US8089143 Integrated circuit package system using interposer |
| 01/03/2012 | US8089142 Methods and apparatus for a stacked-die interposer |
| 01/03/2012 | US8089141 Semiconductor package having leadframe with exposed anchor pads |
| 01/03/2012 | US8089140 Lead frame assembly, lead frame and insulating housing combination, and led module having the same |
| 01/03/2012 | US8089139 Small outline package in which MOSFET and Schottky diode being co-packaged |
| 01/03/2012 | US8089136 Semiconductor device |
| 01/03/2012 | US8089133 Optical assemblies for transmitting and manipulating optical beams |
| 01/03/2012 | US8089131 Micro movable device |
| 01/03/2012 | US8089127 Dual triggered silicon controlled rectifier |
| 01/03/2012 | US8089095 Two terminal multi-channel ESD device and method therefor |
| 01/03/2012 | US8089085 Heat sink base for LEDS |
| 01/03/2012 | US8088633 Optical alignment methods for forming LEDs having a rough surface |
| 01/03/2012 | US8088308 Resin composition and semiconductor device produced by using the same |
| 01/03/2012 | US8088243 Method of forming a card with embedded IC and electrochemical cell |
| 01/03/2012 | CA2628566C In-mold chip attach |
| 01/03/2012 | CA2595518C Semiconductor device |
| 12/29/2011 | WO2011163599A2 Metal coating for indium bump bonding |
| 12/29/2011 | WO2011163344A2 Low voltage pnpn protection device |
| 12/29/2011 | WO2011162953A2 Planar cavity mems and related structures, methods of manufacture and design structures |
| 12/29/2011 | WO2011162504A2 Stacked semiconductor package |
| 12/29/2011 | WO2011162488A2 Layered semiconductor package |
| 12/29/2011 | WO2011162487A2 Cooling device for a heat-emitting element |
| 12/29/2011 | WO2011162470A2 Diode package having improved lead wire and manufacturing method therefor |
| 12/29/2011 | WO2011162294A1 Encapsulant for optical semiconductor device and optical semiconductor device using same |
| 12/29/2011 | WO2011162242A1 Semiconductor device and process for production thereof |
| 12/29/2011 | WO2011162055A1 Epoxy resin composition and semiconductor device |
| 12/29/2011 | WO2011162018A1 Semiconductor device and method for manufacturing same |
| 12/29/2011 | WO2011162005A1 Printed circuit board |
| 12/29/2011 | WO2011161875A1 Substrate for display device and process for production thereof, and display device |
| 12/29/2011 | WO2011161797A1 Method for forming wiring structure, method for manufacturing semiconductor device, and substrate processing apparatus |
| 12/29/2011 | WO2011161167A1 Thermogenerator comprising phase-change materials |
| 12/29/2011 | WO2011160520A1 Ceramic radiation heat dissipation structure |
| 12/29/2011 | WO2011160466A1 Interlayer dielectric layer and manufacturing method thereof, semiconductor device having the interlayer dielectric layer |
| 12/29/2011 | WO2011160423A1 Method for manufacturing contact of semiconductor device and semiconductor device with contact |