| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/05/2012 | US20120001321 Semiconductor device and method for manufacturing of same |
| 01/05/2012 | US20120001320 Substrate processing including a masking layer |
| 01/05/2012 | US20120001319 Fluid cooled encapsulated microelectronic package |
| 01/05/2012 | US20120001318 Semiconductor device |
| 01/05/2012 | US20120001317 Power semiconductor module having layered insulating side walls |
| 01/05/2012 | US20120001316 Package for High Power Devices |
| 01/05/2012 | US20120001315 Semiconductor device |
| 01/05/2012 | US20120001314 Multi-chip package with thermal frame and method of assembling |
| 01/05/2012 | US20120001313 Semiconductor package with an embedded printed circuit board and stacked die |
| 01/05/2012 | US20120001312 Package for semiconductor device, method of manufacturing the same and semiconductor device |
| 01/05/2012 | US20120001311 Package for semiconductor device, and method of manufacturing the same and semiconductor device |
| 01/05/2012 | US20120001310 Package for semiconductor device, and method of manufacturing the same and semiconductor device |
| 01/05/2012 | US20120001309 Semiconductor apparatus |
| 01/05/2012 | US20120001308 Semiconductor module and method of manufacturing the same |
| 01/05/2012 | US20120001307 Lead Frame and Method For Manufacturing the Same |
| 01/05/2012 | US20120001306 Semiconductor packages and methods of packaging semiconductor devices |
| 01/05/2012 | US20120001304 Semiconductor device and semiconductor device manufacturing method |
| 01/05/2012 | US20120001296 P-i-n diode crystallized adjacent to a silicide in series with a dielectric material |
| 01/05/2012 | US20120001295 Semiconductor Device Comprising High-K Metal Gate Electrode Structures and Precision eFuses Formed in the Active Semiconductor Material |
| 01/05/2012 | US20120001294 Semiconductor device |
| 01/05/2012 | US20120001261 System and method for input pin esd protection with floating and/or biased polysilicon regions |
| 01/05/2012 | US20120001233 Novel embedded NOR flash memory process with NAND cell and true logic compatible low voltage device |
| 01/05/2012 | US20120001231 Electrical Fuse |
| 01/05/2012 | US20120001200 Semiconductor device and manufacturing method thereof |
| 01/05/2012 | US20120001177 Semiconductor device |
| 01/05/2012 | US20120001176 Etch depth determination structure |
| 01/05/2012 | US20120001175 Semiconductor device capable of suppressing a coupling effect of a test-disable transmission line |
| 01/05/2012 | US20120001174 Test Structure for Controlling the Incorporation of Semiconductor Alloys in Transistors Comprising High-K Metal Gate Electrode Structures |
| 01/05/2012 | US20120001046 Adapter for support profiles |
| 01/05/2012 | US20120000068 Printed circuit board manufacturing method |
| 01/05/2012 | DE102011107349A1 Bond pad for use on semiconductor substrate, has metal layer formed in bonding surface, amplification structure seen from above bonding surface, and dielectric islands arranged in reinforcing structure |
| 01/05/2012 | DE102011051432A1 ESD-Schutzeinrichtungen und ESD-Schutzverfahren ESD protection devices and ESD protection method |
| 01/05/2012 | DE102010042543A1 Metallization useful for ceramic to apply a structural element via die- or wire-bonding process, and housing, comprises a base layer exhibiting metal, adhesive layer comprising palladium, and solderable layer of non-ferromagnetic material |
| 01/05/2012 | DE102010030956A1 Bondbändchen mit Isolierschicht Bond with insulating tapes |
| 01/05/2012 | DE102010030838A1 Halbleiterbauteil mit verbesserter Wärmeabfuhr Semiconductor device having improved heat dissipation |
| 01/05/2012 | DE102010030766A1 Teststruktur zum Steuern des Einbaus von Halbleiterlegierungen in Transistoren, die Metallgateelektrodenstrukturen mit großem Σ aufweisen Have test structure for controlling the incorporation of semiconductor alloys in transistors, the metal gate electrode structures with large Σ |
| 01/05/2012 | DE102010030765A1 Halbleiterbaulelement mit Metallgateelektrodenstrukturen mit großem ξ und Präzisions-eSicherungen, die in dem aktiven Halbleitermaterial hergestellt sind Halbleiterbaulelement with metal gate electrode structures with large ξ and precision eSicherungen made in the active semiconductor material |
| 01/05/2012 | DE102010030760A1 Halbleiterbauelement mit Durchgangskontaktierungen mit einem Verspannungsrelaxationsmechanismus Semiconductor component with vias with a Verspannungsrelaxationsmechanismus |
| 01/05/2012 | DE102010030759A1 Halbleiterbauelement mit Metallisierungsstapel mit sehr kleinem ε (ULK) mit reduzierter Wechselwirkung zwischen Chip und Gehäuse Semiconductor component with metallization stack with a very small ε (ULK) reduced interaction between chip and package |
| 01/05/2012 | DE102010030757A1 Komplexe Metallisierungssysteme in Halbleitern, die durch Entfernung geschädigter dielektrischer Oberflächenschichten nach der Metallstrukturelemente gebildet sind Complex metallization systems in semiconductors, which are formed by removal of damaged dielectric surface layers after the metal structural elements |
| 01/05/2012 | DE102010025969A1 Locherzeugung mit Mehrfach-Elektroden Hole generation with multiple electrode |
| 01/05/2012 | DE102010025968A1 Erzeugung von Mikrolöchern Generation of micro holes |
| 01/05/2012 | DE102010025966A1 Interposer und Verfahren zum Herstellen von Löchern in einem Interposer Interposer and method for making holes in an interposer |
| 01/05/2012 | DE102004041831B4 Integriertes Schaltkreisbauelement mit E/A-ESD-Schutzzelle Integrated circuit device with I / O ESD protection cell |
| 01/04/2012 | EP2402992A2 Electrical interconnect for an integrated circuit package and method of making same |
| 01/04/2012 | EP2402991A2 Semiconductor component with improved heat dispersion |
| 01/04/2012 | EP2402990A2 Method and system for composite bond wires |
| 01/04/2012 | EP2402989A2 Heat sinks with millichannel cooling |
| 01/04/2012 | EP2402988A2 Heat sinks with c-shaped manifolds and millichannel cooling |
| 01/04/2012 | EP2401767A2 Systems and methods for improved photovoltaic module structure and encapsulation |
| 01/04/2012 | EP2401762A1 Integrated circuit inductors with reduced magnetic coupling |
| 01/04/2012 | EP2086297B1 Printed circuit board and method of manufacturing the same |
| 01/04/2012 | EP1953818B1 Electronic component mounting board |
| 01/04/2012 | EP1658636B1 Chip support of a lead frame for an integrated circuit package |
| 01/04/2012 | EP1350270B1 Stacked die package |
| 01/04/2012 | CN202103993U Radiating fin component and radiating component thereof |
| 01/04/2012 | CN202103943U Printed circuit board with metal micro-radiator |
| 01/04/2012 | CN202103585U Rectifier bridge with temperature sensor |
| 01/04/2012 | CN202103516U Voltage regulator brush holder assembly with multilayer line connection |
| 01/04/2012 | CN202103172U Post fastening mechanism for fastening diode |
| 01/04/2012 | CN202103098U Heat conduction structure |
| 01/04/2012 | CN202103057U Large-power chip-type diode |
| 01/04/2012 | CN202103051U Organic light-emitting diode display |
| 01/04/2012 | CN202103050U High-pixel camera module COF (Chip On Flex) package substrate |
| 01/04/2012 | CN202103044U Small double-row bridge rectifier |
| 01/04/2012 | CN202103042U Stackable digital and radio frequency system on chip with integral isolation layer |
| 01/04/2012 | CN202103041U Intelligent card carrier tape having coil |
| 01/04/2012 | CN202103040U Circulation heat radiation device and assembly thereof |
| 01/04/2012 | CN202103039U Self-heat radiation circuit board |
| 01/04/2012 | CN202103038U Semiconductor assembly |
| 01/04/2012 | CN202103037U Semiconductor chip back face metallization structure applicable to eutectic package |
| 01/04/2012 | CN202103036U Sealing structure provided with locking hole for straight-plug-type integrated circuit or discrete device |
| 01/04/2012 | CN202102466U Smart card module with coil |
| 01/04/2012 | CN202102196U Upper chip structure of soft plate for liquid crystal display panel |
| 01/04/2012 | CN1983602B Semiconductor memory device and method for manufacturing the same |
| 01/04/2012 | CN1971896B Macromolecule conductive film structure and its semiconductor assembly encapsulation structure |
| 01/04/2012 | CN1947480B Packaging method of electronic component |
| 01/04/2012 | CN1943286B Preferential asymmetric through-hole positoning for printed circuit boards |
| 01/04/2012 | CN102308435A High-frequency module |
| 01/04/2012 | CN102308383A Semiconductor die package and method for making the same |
| 01/04/2012 | CN102308283A Compensation of degradation of performance of semiconductor devices by clock duty cycle adaptation compensation of degradation of performance of semiconductor devices by clock duty cycle adaptation |
| 01/04/2012 | CN102308205A Contruction unit, comprising a light detector, and a process to assemble such construction unit to a carrier, such as printed circuit card |
| 01/04/2012 | CN102308020A Insulating film material, and film formation method utilizing the material, and insulating film |
| 01/04/2012 | CN102307939A Acrylic thermal conductive sheet and method for producing the same |
| 01/04/2012 | CN102306648A Optical coupler |
| 01/04/2012 | CN102306646A Electronic component and signal transmission method using the electronic component |
| 01/04/2012 | CN102306645A Semiconductor packaging part possessing electromagnetic interference shielding membrane and manufacture method thereof |
| 01/04/2012 | CN102306644A Test structure for silicon on insulator (SOI) type metal oxide semiconductor (MOS) transistor and formation method of test structure |
| 01/04/2012 | CN102306643A Anti-fuse and method for forming the same, unit cell of nonvolatile memory device with the same |
| 01/04/2012 | CN102306642A On-chip integrated inductor with adjustable inductance value |
| 01/04/2012 | CN102306641A Storage module and packaging method |
| 01/04/2012 | CN102306640A Radiating fin provided with auxiliary fixed parts |
| 01/04/2012 | CN102306639A Squirrel-cage air cooling heat radiator for electronic component |
| 01/04/2012 | CN102306638A Assembled radiating fin with transistor |
| 01/04/2012 | CN102306637A Assembled radiating fin with triode |
| 01/04/2012 | CN102306636A Bidirectional ladder-shaped heat radiation fin |
| 01/04/2012 | CN102306635A Semiconductor apparatus and manufacturing method thereof |
| 01/04/2012 | CN102306632A Planarization method suitable for photoetching technology |
| 01/04/2012 | CN102306631A Method for improving Sn-Ag solder performance based on galvanization technology |
| 01/04/2012 | CN101964341B Light-emitting structure with a plurality of backup welding pads for improving lead welding success rate and manufacture method thereof |