| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/10/2012 | US8093719 Seal ring for preventing crack propagation in integrated circuit devices |
| 01/10/2012 | US8093718 Chip structure and stacked structure of chips |
| 01/10/2012 | US8093717 Microstrip spacer for stacked chip scale packages, methods of making same, methods of operating same, and systems containing same |
| 01/10/2012 | US8093716 Contact fuse which does not touch a metal layer |
| 01/10/2012 | US8093715 Enhancement of thermal interface conductivities with carbon nanotube arrays |
| 01/10/2012 | US8093714 Chip assembly with chip-scale packaging |
| 01/10/2012 | US8093713 Module with silicon-based layer |
| 01/10/2012 | US8093711 Semiconductor device |
| 01/10/2012 | US8093710 Non-uniform feedthrough and lead configuration for a transistor outline package |
| 01/10/2012 | US8093709 Semiconductor device and manufacturing method thereof |
| 01/10/2012 | US8093708 Semiconductor package having non-uniform contact arrangement |
| 01/10/2012 | US8093707 Leadframe packages having enhanced ground-bond reliability |
| 01/10/2012 | US8093706 Mounting structure of semiconductor device and electronic apparatus using same |
| 01/10/2012 | US8093705 Dual face package having resin insulating layer |
| 01/10/2012 | US8093704 Package on package using a bump-less build up layer (BBUL) package |
| 01/10/2012 | US8093703 Semiconductor package having buried post in encapsulant and method of manufacturing the same |
| 01/10/2012 | US8093702 Stacked microelectronic devices and methods for manufacturing stacked microelectronic devices |
| 01/10/2012 | US8093701 Semiconductor device manufacturing method and electronic equipment using same |
| 01/10/2012 | US8093700 Packaging millimeter wave modules |
| 01/10/2012 | US8093699 Circuit device with circuit board and semiconductor chip mounted thereon |
| 01/10/2012 | US8093697 Microelectronic packages and methods therefor |
| 01/10/2012 | US8093696 Semiconductor device |
| 01/10/2012 | US8093695 Direct contact leadless flip chip package for high current devices |
| 01/10/2012 | US8093694 Method of manufacturing non-leaded integrated circuit package system having etched differential height lead structures |
| 01/10/2012 | US8093693 Integrated circuit package system with encapsulation lock |
| 01/10/2012 | US8093692 Semiconductor device packaging including a power semiconductor element |
| 01/10/2012 | US8093691 System and method for RF shielding of a semiconductor package |
| 01/10/2012 | US8093690 Chip package and manufacturing method thereof |
| 01/10/2012 | US8093689 Attachment member for semiconductor sensor device |
| 01/10/2012 | US8093682 Resistance memory element |
| 01/10/2012 | US8093679 Integrated BEOL thin film resistor |
| 01/10/2012 | US8093676 Semiconductor component including an edge termination having a trench and method for producing |
| 01/10/2012 | US8093662 Semiconductor memory |
| 01/10/2012 | US8093647 Nonvolatile semiconductor memory having transistor with a diffusion blocking layer between the lower gate and fully silicided upper gate |
| 01/10/2012 | US8093643 Multi-resistive integrated circuit memory |
| 01/10/2012 | US8093629 Semiconductor chip and semiconductor device having a plurality of semiconductor chips |
| 01/10/2012 | US8093618 Multi-layer ohmic electrode, semiconductor light emitting element having multi-layer ohmic electrode, and method of forming same |
| 01/10/2012 | US8093595 Thin film array panel and manufacturing method thereof |
| 01/10/2012 | US8093512 Package of environmentally sensitive electronic device and fabricating method thereof |
| 01/10/2012 | US8093145 Methods for operating and fabricating a semiconductor device having a buried guard ring structure |
| 01/10/2012 | US8093105 Method of fabricating a capillary-flow underfill compositions |
| 01/10/2012 | US8092734 Covers for microelectronic imagers and methods for wafer-level packaging of microelectronics imagers |
| 01/10/2012 | CA2617308C Reformer fuel cell system with external burner |
| 01/10/2012 | CA2609252C Cu-mo substrate and method for producing same |
| 01/10/2012 | CA2593727C Drive for a vehicle, especially a tracked vehicle or a vehicle with wheel-based steering |
| 01/05/2012 | WO2012003280A2 Bumpless build-up layer package design with an interposer |
| 01/05/2012 | WO2012003169A1 Stacked ic comprising integrated voltage regulator with embedded passive device (s) |
| 01/05/2012 | WO2012002796A1 A heat sink and a method of enhancing heat dissipation thereof |
| 01/05/2012 | WO2012002764A2 Metal-semiconductor convergence electric circuit devices and electric circuit systems using the same |
| 01/05/2012 | WO2012002561A1 Curable organopolysiloxane composition and optical semiconductor device |
| 01/05/2012 | WO2012002560A1 Curable organopolysiloxane composition and optical semiconductor device |
| 01/05/2012 | WO2012002454A1 Power module and power converter using same |
| 01/05/2012 | WO2012002294A1 Stacked semiconductor device with heat dissipating member |
| 01/05/2012 | WO2012002282A1 Film forming method and processing system |
| 01/05/2012 | WO2012002236A1 Wiring board, semiconductor device, and manufacturing methods thereof |
| 01/05/2012 | WO2012002174A1 Lead-free glass for sealing semiconductor |
| 01/05/2012 | WO2012002104A1 Semiconductor device and manufacturing method thereof |
| 01/05/2012 | WO2012001848A1 Method for manufacturing semiconductor device |
| 01/05/2012 | WO2012001767A1 Process for producing radiating substrate for semiconductor mounting |
| 01/05/2012 | WO2012001477A1 Chip-type light emitting device having precisely coated wavelength-converting layer and packaged structure thereof |
| 01/05/2012 | WO2012000685A2 Interposer and method for producing holes in an interposer |
| 01/05/2012 | WO2012000370A1 Method for enhancingchip spot weld reliability, printed circuit board and electron device |
| 01/05/2012 | WO2012000114A1 Electronic devices with yielding substrates |
| 01/05/2012 | WO2011139417A3 Structure and method for manufacturing interconnect structures having self-aligned dielectric caps |
| 01/05/2012 | WO2011123220A3 Packaging process to create wettable lead flank during board assembly |
| 01/05/2012 | WO2011119891A3 High performance low cost open air cavity ceramic power packages for high temperature die attach processes |
| 01/05/2012 | WO2011111989A3 Metal-bonded ceramic substrate |
| 01/05/2012 | WO2011090362A3 Silicone resin |
| 01/05/2012 | WO2011032538A3 Diode array and method for producing a diode array |
| 01/05/2012 | US20120002456 Method of arranging pads in semiconductor device, semiconductor memory device using the method, and processing system having mounted therein the semiconductor memory device |
| 01/05/2012 | US20120001646 Methods and apparatus for testing isfet arrays |
| 01/05/2012 | US20120001350 Resin composition for encapsulating semiconductor and semiconductor device |
| 01/05/2012 | US20120001349 Method of manufacturing semiconductor modules and semiconductor module |
| 01/05/2012 | US20120001348 Wafer stacked package waving bertical heat emission path and method of fabricating the same |
| 01/05/2012 | US20120001347 Semiconductor package having a stacked structure |
| 01/05/2012 | US20120001346 Semiconductor device and method for fabricating the same |
| 01/05/2012 | US20120001345 Three dimensional semiconductor memory device and method of manufacturing the same |
| 01/05/2012 | US20120001344 Semiconductor device manufacture method and semiconductor device |
| 01/05/2012 | US20120001343 Sophisticated Metallization Systems in Semiconductors Formed by Removing Damaged Dielectric Surface Layers After Forming the Metal Features |
| 01/05/2012 | US20120001342 Semiconductor device |
| 01/05/2012 | US20120001341 Semiconductor device |
| 01/05/2012 | US20120001340 Method and system for alignment of integrated circuits |
| 01/05/2012 | US20120001339 Bumpless build-up layer package design with an interposer |
| 01/05/2012 | US20120001338 Opening structure |
| 01/05/2012 | US20120001337 Alignment Mark and Method of Formation |
| 01/05/2012 | US20120001336 Corrosion-resistant copper-to-aluminum bonds |
| 01/05/2012 | US20120001335 Semiconductor Device and Manufacturing Method Thereof |
| 01/05/2012 | US20120001334 Structure and Process for the Formation of TSVs |
| 01/05/2012 | US20120001333 Semiconductor device and method of fabricating the same |
| 01/05/2012 | US20120001332 Semiconductor Device and Manufacturing Method Thereof |
| 01/05/2012 | US20120001331 Semiconductor device and method for manufacturing same |
| 01/05/2012 | US20120001330 Semiconductor Device Comprising Through Hole Vias Having a Stress Relaxation Mechanism |
| 01/05/2012 | US20120001329 Semiconductor package and method of fabricating the same |
| 01/05/2012 | US20120001328 Chip-sized package and fabrication method thereof |
| 01/05/2012 | US20120001327 Ball Grid Array with Improved Single-Ended and Differential Signal Performance |
| 01/05/2012 | US20120001326 Semiconductor Package and Method of Forming Similar Structure for Top and Bottom Bonding Pads |
| 01/05/2012 | US20120001325 Semiconductor Device and Method of Forming Compliant Stress Relief Buffer Around Large Array WLCSP |
| 01/05/2012 | US20120001324 Semiconductor device and method for manufacturing the same |
| 01/05/2012 | US20120001323 Semiconductor Device Including Ultra Low-K (ULK) Metallization Stacks with Reduced Chip-Package Interaction |
| 01/05/2012 | US20120001322 Double molded chip scale package |