| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/11/2012 | CN102315210A Semiconductor device including semiconductor packages stacked on one another |
| 01/11/2012 | CN102315209A 功率半导体模块 Power semiconductor module |
| 01/11/2012 | CN102315205A Chip type differential geminate transistor |
| 01/11/2012 | CN102315203A Combination structure of chip and substrate |
| 01/11/2012 | CN102315201A Semiconuctor structure, method for manufacturing the same and resistor |
| 01/11/2012 | CN102315200A Chip-packaging structure, packaging method and electronic equipment |
| 01/11/2012 | CN102315199A 模块和便携式终端 Module and the portable terminal |
| 01/11/2012 | CN102315198A Structure with alignment mark and manufacture method for stacking device |
| 01/11/2012 | CN102315197A Three-dimensional (3D) integrated circuit structure and method for detecting alignment of chip structures |
| 01/11/2012 | CN102315196A Multigrain stack encapsulation structure |
| 01/11/2012 | CN102315195A Semiconductor package substrate and manufacturing method of the same |
| 01/11/2012 | CN102315194A Microstructure and microstructure production method |
| 01/11/2012 | CN102315193A Forming method for light-emitting device chip package and supporting structure |
| 01/11/2012 | CN102315192A Semiconductor packaging part |
| 01/11/2012 | CN102315191A Novel base-island prepacked plastic packaging material lead frame structure |
| 01/11/2012 | CN102315190A Electrical interconnect for an integrated circuit package and method of making same |
| 01/11/2012 | CN102315189A Bonding contact part on semiconductor substrate |
| 01/11/2012 | CN102315188A Forming method for semiconductor pipe core and conductive pillar |
| 01/11/2012 | CN102315187A Conductor package structure |
| 01/11/2012 | CN102315186A Semiconductor device packaged with printing bonding materials and manufacturing method thereof |
| 01/11/2012 | CN102315185A Electronic component module |
| 01/11/2012 | CN102315184A 半导体器件 Semiconductor devices |
| 01/11/2012 | CN102315183A Semiconductor device comprising through hole vias having a stress relaxation mechanism |
| 01/11/2012 | CN102315182A 半导体芯片及其制造方法 The method of manufacturing a semiconductor chip and |
| 01/11/2012 | CN102315181A 半导体器件 Semiconductor devices |
| 01/11/2012 | CN102315180A Electronic device with heat radiating function and heat radiating module |
| 01/11/2012 | CN102315179A Metal-coated ceramic baseplate and manufacturing method thereof |
| 01/11/2012 | CN102315178A Semiconductor apparatus |
| 01/11/2012 | CN102315177A High pressure resistant passivation protection diode chip and processing method thereof |
| 01/11/2012 | CN102315176A Electrical connector assembly |
| 01/11/2012 | CN102315175A Method of forming a semiconductor device |
| 01/11/2012 | CN102315162A Semiconductor device with side-junction and method for fabricating the same |
| 01/11/2012 | CN102315160A Semiconductor device with one-side contact and fabrication method thereof |
| 01/11/2012 | CN102315156A Method for manufacturing semiconductor device |
| 01/11/2012 | CN102315138A Method for low-temperature pressure sintering connection of two connection mating members and system manufactured using same |
| 01/11/2012 | CN102315137A Chip fanning out method and chip-on-film device |
| 01/11/2012 | CN102315136A Package structure and manufacturing method thereof |
| 01/11/2012 | CN102315135A Chip package and manufacturing process thereof |
| 01/11/2012 | CN102315119A Method for forming masking layer by using ion implantation and semiconductor device fabricated by using the same |
| 01/11/2012 | CN102314003A Liquid crystal display panel and liquid crystal display device |
| 01/11/2012 | CN102312120A Electromigration-resistant silver-indium alloy bonding wire and preparation method thereof |
| 01/11/2012 | CN102054835B Thyristor for electrostatic discharge |
| 01/11/2012 | CN102044456B 半导体结构及其制造方法 The semiconductor structure and a method of manufacturing |
| 01/11/2012 | CN101924106B Integrated circuit structure |
| 01/11/2012 | CN101887893B Film transistor array substrate and manufacturing method thereof |
| 01/11/2012 | CN101834146B Electronic element package and formation method thereof |
| 01/11/2012 | CN101826507B Electrical fuse and relevant control circuit thereof |
| 01/11/2012 | CN101826469B Coreless encapsulation substrate and manufacturing method thereof |
| 01/11/2012 | CN101800204B Semiconductor sealing structure with model lock and radiating fin thereof |
| 01/11/2012 | CN101789415B Encapsulating carrier plate and connected structure |
| 01/11/2012 | CN101785105B Redistribution structures for microfeature workpieces |
| 01/11/2012 | CN101779286B Stress relief of a semiconductor device |
| 01/11/2012 | CN101777550B 半导体装置 Semiconductor device |
| 01/11/2012 | CN101772290B Thermal conductive device and manufacturing method thereof |
| 01/11/2012 | CN101764125B Overspeed delay test system and method |
| 01/11/2012 | CN101764109B Thermoelectric cooler for semiconductor devices with tsv |
| 01/11/2012 | CN101752353B Packaging structure of multi-chip semiconductor |
| 01/11/2012 | CN101728359B Semiconductor device |
| 01/11/2012 | CN101714533B Circuit device and method of manufacturing the same |
| 01/11/2012 | CN101677503B Heat radiating device |
| 01/11/2012 | CN101673724B Interconnecting substrate and semiconductor device |
| 01/11/2012 | CN101661897B Interconnector structure and manufacturing method thereof |
| 01/11/2012 | CN101661894B Resin sealing type semiconductor device and method of manufacturing the same, and resin sealing type electronic device |
| 01/11/2012 | CN101656249B Multilayer interconnection structure of wafer level package, manufacturing method and application |
| 01/11/2012 | CN101656241B Packaging structure with substrate post and packaging method thereof |
| 01/11/2012 | CN101656196B Method for making a substrate structure comprising a film |
| 01/11/2012 | CN101625988B Lens support and wirebond protector |
| 01/11/2012 | CN101621070B Light emitting device and an electronic apparatus |
| 01/11/2012 | CN101533806B Flat panel display product with high leak tightness |
| 01/11/2012 | CN101527557B Robust semiconductor power devices with design to protect transistor cells with slower switching speed |
| 01/11/2012 | CN101512758B Wiring board composite body, semiconductor device, and method for manufacturing the wiring board composite body and the semiconductor device |
| 01/11/2012 | CN101505579B Heat radiation module and support member thereof |
| 01/11/2012 | CN101499478B Liquid crystal display device using thin film transistor |
| 01/11/2012 | CN101496161B SIP module with a single sided lid |
| 01/11/2012 | CN101490910B Connector for connecting electronic component |
| 01/11/2012 | CN101488465B Chip feature configuring method and chip |
| 01/11/2012 | CN101477970B Circuit substrate and application thereof |
| 01/11/2012 | CN101452834B Method of manufacturing GaN substrate, method of manufacturing epitaxialwafer, method of manufacturing semiconductor device and epitaxialwafer |
| 01/11/2012 | CN101399285B Field-effect transistor, semiconductor chip and semiconductor device |
| 01/11/2012 | CN101383369B Image sensor and method for manufacturing same |
| 01/11/2012 | CN101295585B Capacitor, circuit board containing the capacitor, and integrated circuit bearing substrate |
| 01/11/2012 | CN101248002B Microelectromechanical device packaging with an anchored cap and its manufacture |
| 01/11/2012 | CN101238574B Semiconductor device with supporting structure for isolation and passivation layers |
| 01/11/2012 | CN101221936B Wafer level package with die receiving through-hole and method of the same |
| 01/11/2012 | CN101185991B Jointing material, method for manufacturing jointing material and semiconductor device |
| 01/11/2012 | CN101183668B Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof |
| 01/11/2012 | CN101142080B Metal substrate/ carbon based metal composite material structure and method for manufacturing said structure |
| 01/11/2012 | CN101048444B Amide-substituted silicones and methods for their preparation and use |
| 01/11/2012 | CN101017797B Light emitting device and manufacturing method thereof |
| 01/10/2012 | US8094454 Immersion cooling apparatus for a power semiconductor device |
| 01/10/2012 | US8093983 Narrowbody coil isolator |
| 01/10/2012 | US8093730 Underfilled semiconductor die assemblies and methods of forming the same |
| 01/10/2012 | US8093729 Electrically conductive interconnect system and method |
| 01/10/2012 | US8093728 Connection by fitting together two soldered inserts |
| 01/10/2012 | US8093727 Integrated circuit package-in-package system with side-by-side and offset stacking and method for manufacturing thereof |
| 01/10/2012 | US8093726 Semiconductor packages having interposers, electronic products employing the same, and methods of manufacturing the same |
| 01/10/2012 | US8093723 Method of manufacturing a semiconductor integrated circuit device |
| 01/10/2012 | US8093722 System-in-package with fan-out WLCSP |
| 01/10/2012 | US8093721 Flip chip semiconductor package and fabrication method thereof |
| 01/10/2012 | US8093720 Device, method of manufacturing device, board, method of manufacturing board, mounting structure, mounting method, LED display, LED backlight and electronic device |