| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/12/2012 | US20120007241 Semiconductor device |
| 01/12/2012 | US20120007240 Metal wire for a semiconductor device formed with a metal layer without voids therein and a method for forming the same |
| 01/12/2012 | US20120007239 Methods, devices, and materials for metallization |
| 01/12/2012 | US20120007238 Method of Manufacturing a Semiconductor Device |
| 01/12/2012 | US20120007237 Chip package |
| 01/12/2012 | US20120007236 Semiconductor device and package |
| 01/12/2012 | US20120007235 Chip Fanning Out Method and Chip-on-Film Device |
| 01/12/2012 | US20120007234 Semiconductor package without chip carrier and fabrication method thereof |
| 01/12/2012 | US20120007233 Semiconductor element and fabrication method thereof |
| 01/12/2012 | US20120007232 Microelectronic packages with dual or multiple-etched flip-chip connectors |
| 01/12/2012 | US20120007231 Method of forming cu pillar capped by barrier layer |
| 01/12/2012 | US20120007230 Conductive bump for semiconductor substrate and method of manufacture |
| 01/12/2012 | US20120007229 Enhanced thermal management of 3-d stacked die packaging |
| 01/12/2012 | US20120007228 Conductive pillar for semiconductor substrate and method of manufacture |
| 01/12/2012 | US20120007226 System-in-a-package based flash memory card |
| 01/12/2012 | US20120007225 Semiconductor device |
| 01/12/2012 | US20120007224 Semiconductor device |
| 01/12/2012 | US20120007218 Semiconductor device with one-side contact and fabrication method thereof |
| 01/12/2012 | US20120007216 Multi-Chip Package Module And A Doped Polysilicon Trench For Isolation And Connection |
| 01/12/2012 | US20120007213 Semiconductor chip and method for fabricating the same |
| 01/12/2012 | US20120007209 Semiconductor device structures including damascene trenches with conductive structures and related method |
| 01/12/2012 | US20120007195 Apparatus for integrated circuit packaging |
| 01/12/2012 | US20120007159 Semiconductor device and a method of manufacturing the same |
| 01/12/2012 | US20120007154 TSV Formation Processes Using TSV-Last Approach |
| 01/12/2012 | US20120007117 Submount for Electronic Die Attach with Controlled Voids and Methods of Attaching an Electronic Die to a Submount Including Engineered Voids |
| 01/12/2012 | US20120007075 Semiconductor chip with backside conductor structure |
| 01/12/2012 | US20120007074 Thermally sensitive material embedded in the substrate |
| 01/12/2012 | US20120007073 Semiconductor Wafer Constructions, And Methods For Quality Testing Material Removal Procedures During Semiconductor Fabrication Processes |
| 01/12/2012 | US20120006469 Printed circuit board and method of manufacturing printed circuit board |
| 01/12/2012 | US20120006122 Stress detection within an integrated circuit having through silicon vias |
| 01/12/2012 | US20120005875 Method of semiconductor device protection |
| 01/12/2012 | DE112009002155T5 Hauptplatinenbaugruppe mit einem Gehäuse über einem direkt auf der Hauptplatine angebrachten Chip Motherboard assembly having a housing via a directly mounted on the motherboard chip |
| 01/12/2012 | DE102011016361A1 Wafer-Level-Chip-Scale-Package-Vorrichtung mit Kontakthöcker-Einheiten, die so konfiguriert sind, dass sie durch mechanische Spannung bedingte Ausfälle vermindern , That they reduce wafer-level chip scale package device having bumps units that are configured so by mechanical stress-related failures |
| 01/12/2012 | DE102010043446B3 Leistungshalbleitersystem Power semiconductor system |
| 01/12/2012 | DE102010030960A1 Method for manufacturing e.g. electronic stability control sensor that is installed in e.g. prefabricated injection molded base housing, involves applying attenuation mass on micro or nano-structured component |
| 01/12/2012 | DE102010026843A1 Modul-Package und Herstellungsverfahren Module package and manufacturing method |
| 01/12/2012 | DE102010026621A1 Device i.e. zero insertion force socket, for e.g. powerless insertion of image sensor in spectral sensor applications, has plate spring for creating return force and arranged between upper and center parts for affecting center part |
| 01/12/2012 | DE102006039975B4 Niederinduktives Leistungshalbleitermodul für stromeingeprägte Leistungsschaltungen Niederinduktives power semiconductor module for power-embossed power circuits |
| 01/12/2012 | DE102004057497B4 Wärmeaustauschvorrichtung und Verfahren zum Herstellen der Wärmeaustauschvorrichtung sowie Anordnung eines Bauelements und der Wärmeaustauschvorrichtung und Verfahren zum Herstellen der Anordnung The heat exchange apparatus and method for manufacturing the heat exchange device and a device and arrangement of the heat exchange device and method of manufacturing the arrangement |
| 01/11/2012 | EP2405731A2 Module and portable terminal |
| 01/11/2012 | EP2405727A1 Manufacturing method for circuit board, and circuit board |
| 01/11/2012 | EP2405480A2 Cooling element with an electric component |
| 01/11/2012 | EP2405479A1 Antifuse device |
| 01/11/2012 | EP2405473A2 Method of manufacturing glass substrate and method of manufacturing electronic components |
| 01/11/2012 | EP2405472A2 Method of Manufacturing Glass Substrate and Method of Manufacturing Electronic Components |
| 01/11/2012 | EP2405471A2 Method of Manufacturing through Electrode-Attached Glass Substrate and Method of Manufacturing Electronic Component |
| 01/11/2012 | EP2405470A2 Method of manufacturing through electrode-attached glass substrate and method of manufacturing electronic component |
| 01/11/2012 | EP2405469A1 Method to form solder alloy deposits on substrates |
| 01/11/2012 | EP2405468A1 Method to form solder deposits on substrates |
| 01/11/2012 | EP2405449A1 Electrically conductive paste composition and electrically conductive film formed by using the same |
| 01/11/2012 | EP2405385A2 Portable connectable device with microcircuit(s), with integrated countermeasure against EMA or fault attacks |
| 01/11/2012 | EP2404320A2 Hermetic packaging of integrated circuit components |
| 01/11/2012 | EP2404319A1 Hermetic seal for an electronic device comprising an active organic material |
| 01/11/2012 | EP2404302A1 Magnetic film enhanced inductor |
| 01/11/2012 | EP2027600B1 Method for embedding at least one component in a printed circuit board element |
| 01/11/2012 | EP1754256B1 Chip having two groups of chip contacts |
| 01/11/2012 | EP1088470B1 Ic stack utilizing flexible circuits with bga contacts |
| 01/11/2012 | CN202111984U Novel heat sink |
| 01/11/2012 | CN202111975U Vapor chamber possessing supporting structures |
| 01/11/2012 | CN202111973U Magnalium heat radiation structure |
| 01/11/2012 | CN202111097U Field limiting ring structure |
| 01/11/2012 | CN202111094U Cmos图像传感器 Cmos image sensor |
| 01/11/2012 | CN202111086U Small-scale jumper-type double-row bridge rectifier |
| 01/11/2012 | CN202111085U Static discharge protecting device structure |
| 01/11/2012 | CN202111084U Electronic component mounting structure and frequency conversion equipment possessing the mounting structure |
| 01/11/2012 | CN202111083U Lead frame structure for integrated circuit |
| 01/11/2012 | CN202111082U Multi-loop arrangement integrated circuit (IC) chip package element |
| 01/11/2012 | CN202111081U Lead frame |
| 01/11/2012 | CN202111080U Lead frame used for packaging power IC and packaging structure comprising lead frame thereof |
| 01/11/2012 | CN202111079U Improved structure of chip |
| 01/11/2012 | CN202111078U Packaging structure of integrated circuit |
| 01/11/2012 | CN202111077U Power tube mounting structure of circuit board |
| 01/11/2012 | CN202111076U High-heat-conduction semi-conductor sealing element |
| 01/11/2012 | CN202111075U Chip |
| 01/11/2012 | CN202111074U Welding wire point structure of integrated circuit |
| 01/11/2012 | CN202111073U High-low bonding wire structure of integrated circuit |
| 01/11/2012 | CN202111072U Protective device for switch element MOSFET of electric vehicle |
| 01/11/2012 | CN202110332U Assembly structure for space optical modulator |
| 01/11/2012 | CN202109580U Novel heating device |
| 01/11/2012 | CN202109282U Semiconductor high-power LED lamp |
| 01/11/2012 | CN1938844B A semiconductor apparatus |
| 01/11/2012 | CN102318458A Radiator, electronic apparatus and installation method thereof |
| 01/11/2012 | CN102318060A Vacuum sealed package, printed circuit board having vacuum sealed package, electronic device, and method for manufacturing vacuum sealed package |
| 01/11/2012 | CN102318059A Semiconductor protection film-forming film with dicing sheet, method for manufacturing semiconductor device using same,and semiconductor device |
| 01/11/2012 | CN102318051A Semiconductor chip with reinforcement layer |
| 01/11/2012 | CN102317499A Method for forming cu film and storage medium |
| 01/11/2012 | CN102317342A Fire-resistant phosphorus-containing epoxy resin composition and hardened substance obtained thereby |
| 01/11/2012 | CN102317236A Substrate comprising aluminum/graphite composite, heat dissipation part comprising same, and LED luminescent member |
| 01/11/2012 | CN102317199A Display device with desiccant |
| 01/11/2012 | CN102317027A Manufacturing method of liquid-cooled jacket |
| 01/11/2012 | CN102316706A Heat sink with C-shaped manifolds and millichannel cooling |
| 01/11/2012 | CN102316671A Multilayer ceramic substrate |
| 01/11/2012 | CN102316669A Fixing structure and fixing method of circuit board with embedded electronic parts to cooler |
| 01/11/2012 | CN102316668A Substrate with fine metal pattern, print circuit board and semiconductor device, and production method of substrate with fine metal pattern, print circuit board and semiconductor device |
| 01/11/2012 | CN102315845A 半导体集成电路 The semiconductor integrated circuit |
| 01/11/2012 | CN102315506A Integrated cooling system of high-power amplifier using waveguide space synthesis method |
| 01/11/2012 | CN102315225A Semiconductor storage device and manufacturing method thereof |
| 01/11/2012 | CN102315218A Four transistor circuit layout, integrated circuit field effect, and semiconductor device |
| 01/11/2012 | CN102315213A Layout for multiple-fin SRAM cell |
| 01/11/2012 | CN102315211A Film transistor array panel |