| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/18/2012 | CN101519576B Method for preparing packaging adhesive used for high-transmittance high-power light emitting diode |
| 01/18/2012 | CN101449375B A device, a system and a method applied to the connection without leads in the encapsulation of an integrate circuit |
| 01/18/2012 | CN101345233B Test structure and monitoring method for CUI effect of shallow plough groove isolation technology |
| 01/18/2012 | CN101325846B 多层配线基板及其制造方法 A multilayer wiring board and its manufacturing method |
| 01/18/2012 | CN101281894B Semiconductor component bearing structure and splicing structure |
| 01/18/2012 | CN101267086B Semiconductor device and optical apparatus |
| 01/18/2012 | CN101232009B Mounting structures for integrated circuit modules |
| 01/18/2012 | CN101066004B Method for producing substrate having through hole filled with conductive material |
| 01/18/2012 | CN101034682B Semiconductor device and method of manufacturing the same |
| 01/17/2012 | USRE43112 Stackable ball grid array package |
| 01/17/2012 | US8097966 Adjustable film frame aligner |
| 01/17/2012 | US8097965 Semiconductor device and method of manufacturing the same |
| 01/17/2012 | US8097964 IC having TSV arrays with reduced TSV induced stress |
| 01/17/2012 | US8097962 Semiconductor device |
| 01/17/2012 | US8097961 Semiconductor device having a simplified stack and method for manufacturing thereof |
| 01/17/2012 | US8097960 Semiconductor mounting bonding wire |
| 01/17/2012 | US8097958 Flip chip connection structure having powder-like conductive substance and method of producing the same |
| 01/17/2012 | US8097957 Flash memory card |
| 01/17/2012 | US8097956 Flexible packaging for chip-on-chip and package-on-package technologies |
| 01/17/2012 | US8097955 Interconnect structures and methods |
| 01/17/2012 | US8097954 Adhesive layer forming a capacitor dielectric between semiconductor chips |
| 01/17/2012 | US8097953 Three-dimensional integrated circuit stacking-joint interface structure |
| 01/17/2012 | US8097952 Electronic package structure having conductive strip and method |
| 01/17/2012 | US8097951 Integrated circuit having wiring layer and a pattern in which a gap is formed and method for manufacturing same |
| 01/17/2012 | US8097950 Semiconductor device and electronic component module using the same |
| 01/17/2012 | US8097949 Control of localized air gap formation in an interconnect stack |
| 01/17/2012 | US8097948 Semiconductor device and manufacturing method of semiconductor device |
| 01/17/2012 | US8097947 Conductive systems and devices including wires coupled to anisotropic conductive film, and methods of forming the same |
| 01/17/2012 | US8097946 Device mounting board, semiconductor module, and mobile device |
| 01/17/2012 | US8097945 Bi-directional, reverse blocking battery switch |
| 01/17/2012 | US8097944 Semiconductor device |
| 01/17/2012 | US8097943 Semiconductor device and method of forming wafer level ground plane and power ring |
| 01/17/2012 | US8097942 Semiconductor device including power supply bar having jutted portion, parallel running portion and bent portion and manufacturing method therefor |
| 01/17/2012 | US8097941 Semiconductor device having projecting electrode formed by electrolytic plating, and manufacturing method thereof |
| 01/17/2012 | US8097940 Stack package |
| 01/17/2012 | US8097939 Semiconductor memory card |
| 01/17/2012 | US8097938 Conductive chip-scale package |
| 01/17/2012 | US8097937 Leadframe and housing for radiation-emitting component, radiation-emitting component, and a method for producing the component |
| 01/17/2012 | US8097936 Component, power component, apparatus, method of manufacturing a component, and method of manufacturing a power semiconductor component |
| 01/17/2012 | US8097935 Quad flat package |
| 01/17/2012 | US8097934 Delamination resistant device package having low moisture sensitivity |
| 01/17/2012 | US8097933 Flexible semiconductor package and method for fabricating the same |
| 01/17/2012 | US8097932 Ultra low κ plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality |
| 01/17/2012 | US8097931 Fuse part in semiconductor device and method for forming the same |
| 01/17/2012 | US8097929 Electronics device package and fabrication method thereof |
| 01/17/2012 | US8097920 Semiconductor integrated circuit comprising electro static discharge protection element |
| 01/17/2012 | US8097906 Semiconductor device having finger electrodes |
| 01/17/2012 | US8097895 Electronic device package with an optical device |
| 01/17/2012 | US8097818 Panel box |
| 01/17/2012 | US8097816 Electronic device and method of producing the same |
| 01/17/2012 | US8097496 Method of forming quad flat package |
| 01/17/2012 | US8097475 Method of production of a contact structure |
| 01/13/2012 | DE202011106207U1 Bildsensor mit großer Chipfläche Image sensor with a large chip area |
| 01/12/2012 | WO2012006403A1 Microelectronic package with dual or multiple - etched flip -chip connectors and corresponding manufacturing method |
| 01/12/2012 | WO2012006167A2 Method and system for thin multi chip stack package with film on wire and copper wire |
| 01/12/2012 | WO2012006063A2 Microelectronic package and method of manufacturing same |
| 01/12/2012 | WO2012006049A1 Three dimensional wire bond inductor and transformer |
| 01/12/2012 | WO2012006002A2 Enhanced thermal management of 3-d stacked die packaging |
| 01/12/2012 | WO2012005706A1 Cmos compatible microchannel heat sink for electronic cooling and its fabrication |
| 01/12/2012 | WO2012005435A1 Manufacturing method of chip package and chip package manufactured using the same |
| 01/12/2012 | WO2012005352A1 Semiconductor device |
| 01/12/2012 | WO2012005237A1 Silicon carbide substrate, semiconductor device, and soi wafer |
| 01/12/2012 | WO2012005075A1 Imaging device, and method for manufacturing imaging device |
| 01/12/2012 | WO2012005073A1 Semiconductor device, semiconductor package, and method for producing each |
| 01/12/2012 | WO2012005024A1 Surface-mounted electronic component |
| 01/12/2012 | WO2012004493A1 Device for cooling at least one element comprising at least one electronic component |
| 01/12/2012 | WO2012004267A1 Microelectronic device having metal interconnection levels connected by programmable vias |
| 01/12/2012 | WO2012004249A1 Electronic component provided in a ceramic housing |
| 01/12/2012 | WO2012004177A1 Connecting contact |
| 01/12/2012 | WO2012004137A2 Method to form solder deposits on substrates |
| 01/12/2012 | WO2012004136A2 Method to form solder alloy deposits on substrates |
| 01/12/2012 | WO2012004106A1 Electrically conductive connection between two contact surfaces |
| 01/12/2012 | WO2012004104A1 Bond strips |
| 01/12/2012 | WO2012004068A1 A method to fabricate high performance carbon nanotube transistor integrated circuits by three-dimensional integration technology |
| 01/12/2012 | WO2012003705A1 Three dimensional integrated circuit structure and method for detecting chip structure alignment |
| 01/12/2012 | WO2012003700A1 Manufacturing method of led integrated structure |
| 01/12/2012 | WO2012003568A1 Multi-chip package with thermal frame and method of assembling |
| 01/12/2012 | WO2012003530A1 Optical bus in 3d integrated circuit stack |
| 01/12/2012 | WO2011127568A4 High density gallium nitride devices using island topology |
| 01/12/2012 | WO2011116106A3 System-in-package using embedded-die coreless substrates, and processes of forming same |
| 01/12/2012 | WO2011112728A3 Package having spaced apart heat sink |
| 01/12/2012 | WO2011105800A3 Heat sink including a heat-dissipation fin capable of vibrating |
| 01/12/2012 | US20120009717 Packaged microelectronic imagers and methods of packaging microelectronic imagers |
| 01/12/2012 | US20120007259 Latent hardener with improved barrier properties and compatibility |
| 01/12/2012 | US20120007258 Semiconductor device with side-junction and method for fabricating the same |
| 01/12/2012 | US20120007257 Semiconductor device and manufacturing method thereof |
| 01/12/2012 | US20120007256 Redistribution layers for microfeature workpieces, and associated systems and methods |
| 01/12/2012 | US20120007255 Semiconductor device |
| 01/12/2012 | US20120007254 Multi-layer via structure |
| 01/12/2012 | US20120007253 Semiconductor chip and stack package having the same |
| 01/12/2012 | US20120007252 Semiconductor package structure and fabricating method of semiconductor package structure |
| 01/12/2012 | US20120007251 Stacked multi-chip |
| 01/12/2012 | US20120007250 Semiconductor integrated circuit |
| 01/12/2012 | US20120007249 Silicon based substrate and manufacturing method thereof |
| 01/12/2012 | US20120007248 Multi-chip package including chip address circuit |
| 01/12/2012 | US20120007247 Resin-Encapsulated Semiconductor Device |
| 01/12/2012 | US20120007245 Via and Method of Forming the Via with a Substantially Planar Top Surface that is Suitable for Carbon Nanotube Applications |
| 01/12/2012 | US20120007244 Backside Processing of Semiconductor Devices |
| 01/12/2012 | US20120007243 Method of making connections in a back-lit circuit |
| 01/12/2012 | US20120007242 Interconnects having sealing structures to enable selective metal capping layers |