| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/19/2012 | DE102010027313A1 Trägervorrichtung für einen Halbleiterchip, elektronisches Bauelement mit einer Trägervorrichtung und optoelektronisches Bauelement mit einer Trägervorrichtung A support device for a semiconductor chip, an electronic device having a carrier device and an optoelectronic component with a support device |
| 01/19/2012 | DE102010027128A1 Halbleiterbauelement, insbesondere Strahlungsdetektor, mit einem integrierten Überspannungsschutz Semiconductor component, in particular radiation detector, with a integrated overvoltage protection |
| 01/19/2012 | DE102009022659B4 Kontakteinrichtung für ein Leistungshalbleitermodul Contact device for a power semiconductor module |
| 01/19/2012 | DE102005038895B4 Schaltung mit kapazitiven Elementen Circuit with capacitive elements |
| 01/19/2012 | CA2805695A1 Apparatus and method for thermal interfacing |
| 01/19/2012 | CA2805348A1 Semifinished product and method for producing a light-emitting diode |
| 01/18/2012 | EP2408106A2 Method of manufacturing packages, package, piezoelectric vibrator, and oscillator |
| 01/18/2012 | EP2408031A2 Light emitting diode package and frame shaping method of the same |
| 01/18/2012 | EP2408009A2 Semiconductor component, in particular radiation detector with integrated overvoltage protection |
| 01/18/2012 | EP2408008A1 Film for spacer formation, semiconductor wafer, and semiconductor device |
| 01/18/2012 | EP2408006A2 Method for forming 3D-interconnect structures with airgaps |
| 01/18/2012 | EP2407980A1 Method for producing conductive material, conductive material obtained by the same method, electronic device containing the conductive material, and light-emitting device |
| 01/18/2012 | EP2407015A1 Power semiconductor module having layered insulating side walls |
| 01/18/2012 | EP2406826A1 Method for manufacturing semiconductor device |
| 01/18/2012 | EP2406824A1 A voltage suppressor component |
| 01/18/2012 | EP2406823A2 Microelectronic assembly with impedance controlled wirebond and conductive reference element |
| 01/18/2012 | EP2406822A2 Microelectronic assembly wherein a wirebond is impedance controlled by using an additional wirebond connected to a reference potential |
| 01/18/2012 | EP2406816A1 Method for fabricating semiconductor components using maskless back side alignment to conductive vias |
| 01/18/2012 | EP2406555A1 Radiator, in particular for room heating |
| 01/18/2012 | EP2324499B1 Circuit for the parallel supplying of power during testing of a plurality of electronic devices integrated on a semiconductor wafer |
| 01/18/2012 | EP1750298B1 RF power transistor with impedance matched output electrode |
| 01/18/2012 | EP1340126B1 Method of aligning a photolithographic mask to a crystal plane |
| 01/18/2012 | CN202120978U Co-firing ceramic substrate having built-in heat radiation portion and light emitting diode comprising same |
| 01/18/2012 | CN202120923U Improved press mounting type diode shell structure |
| 01/18/2012 | CN202120919U Large power thyristor chip |
| 01/18/2012 | CN202120918U Crimp-connection IGBT (Insulated Gate Bipolar Transistor) device |
| 01/18/2012 | CN202120917U Large power IGBT flat crimping type packaging structure |
| 01/18/2012 | CN202120913U Thin-type image capturing module |
| 01/18/2012 | CN202120911U Frequency conversion interference resisting infrared ray receiving module |
| 01/18/2012 | CN202120910U Oil immersed self-cooling device of high-voltage tandem silicon controlled combined valve used in high-voltage solid soft-starting equipment |
| 01/18/2012 | CN202120904U Low capacitance value surge protector |
| 01/18/2012 | CN202120903U Half-bridge power module |
| 01/18/2012 | CN202120902U Electrostatic protection device |
| 01/18/2012 | CN202120901U Impermeable anticracking direct inserting type triode lead framework board |
| 01/18/2012 | CN202120900U Multifunctional lead frame packaging substrate |
| 01/18/2012 | CN202120899U Triode lead frame plate of staggered arrangement |
| 01/18/2012 | CN202120898U 半导体封装结构 The semiconductor package structure |
| 01/18/2012 | CN202120897U High power chip packaging structure and lead frame thereof |
| 01/18/2012 | CN202120896U Welding line point structure of chip packaging |
| 01/18/2012 | CN202120895U Packaging member with backside of substrate electroplated with protruding points |
| 01/18/2012 | CN202120894U Double heat exchange device |
| 01/18/2012 | CN202120893U A cooling system of a valve tower of a modularized and multi-level voltage-source converter |
| 01/18/2012 | CN202120892U Combined radiator for explosive atmosphere |
| 01/18/2012 | CN202120891U Power transistor heat radiation apparatus |
| 01/18/2012 | CN202120890U Heat radiation fin structure and heat radiation module |
| 01/18/2012 | CN202120889U Heat radiation module |
| 01/18/2012 | CN202120888U Ultra-wide band multifunctional frequency conversion chip |
| 01/18/2012 | CN202120887U Novel SMD ceramic paster |
| 01/18/2012 | CN202120886U Packaging structure |
| 01/18/2012 | CN202120882U Semiconductor packaging mold construction having no pins all around |
| 01/18/2012 | CN202116291U Mems device |
| 01/18/2012 | CN1801486B High surface area aluminum bond pad for through-wafer connections to an electronic package |
| 01/18/2012 | CN102326252A Electrical apparatus with electrostatic shield |
| 01/18/2012 | CN102326251A Method for bonding high heat conductive insulating resin |
| 01/18/2012 | CN102326250A Method for producing semiconductor wafer assembly, semiconductor wafer assembly, and semiconductor device |
| 01/18/2012 | CN102326249A Semiconductor wafer assembly, method for producing semiconductor wafer assembly, and semiconductor device |
| 01/18/2012 | CN102326247A Face-to-face (F2F) hybrid structure for an integrated circuit |
| 01/18/2012 | CN102326238A Transistor and transistor control system |
| 01/18/2012 | CN102326047A Ebullient cooling apparatus |
| 01/18/2012 | CN102325724A Powder, method for producing same, and resin composition containing same |
| 01/18/2012 | CN102324437A Composite wafer for prolonging service life of energy-saving lamp as well as preparation method and application thereof |
| 01/18/2012 | CN102324422A Light-emitting diode module and display employing the light-emitting diode module |
| 01/18/2012 | CN102324421A ESD (Electro Spark Discharge) protection structure employing point discharge in chip |
| 01/18/2012 | CN102324420A Semiconductor device |
| 01/18/2012 | CN102324419A Semiconductor device and manufacturing method thereof |
| 01/18/2012 | CN102324418A Semiconductor element packaging structure and manufacturing method thereof |
| 01/18/2012 | CN102324417A Substrate for a semiconductor package, semiconductor package and manufacturing methods thereof |
| 01/18/2012 | CN102324416A Integrated shielding film and semiconductor packaging member of antenna |
| 01/18/2012 | CN102324415A Sequentially etched and plated lead frame structure without island prepacked plastic sealed material and producing method thereof |
| 01/18/2012 | CN102324414A Sequentially etched and plated lead frame structure with island prepacked plastic sealed material and producing method thereof |
| 01/18/2012 | CN102324413A Sequentially etched and plated lead frame structure with island prepacked plastic sealed material and producing method thereof |
| 01/18/2012 | CN102324412A Island-free lead frame structure prefilled with plastic encapsulating material, plated firstly and etched later and production method thereof |
| 01/18/2012 | CN102324411A Novel island-free lead frame structure prefilled with plastic encapsulating material |
| 01/18/2012 | CN102324410A Electronic component and heat radiation system |
| 01/18/2012 | CN102324409A Semiconductor package with heat dispersion structure and manufacturing method for semiconductor package |
| 01/18/2012 | CN102324408A Folded fin type heat radiator |
| 01/18/2012 | CN102324407A Semiconductor packaging piece and manufacturing method thereof |
| 01/18/2012 | CN102324406A Epitaxial wafer substrate capable of reducing auto-doping during epitaxy, epitaxial wafer and semiconductor device |
| 01/18/2012 | CN102324405A Manufacturing method of semiconductor device |
| 01/18/2012 | CN102324404A Semiconductor device and method for production of semiconductor device |
| 01/18/2012 | CN102324399A Semiconductor device and manufacturing method thereof |
| 01/18/2012 | CN102324392A Preparation process for anti-oxidation copper-based bonding wires |
| 01/18/2012 | CN102324262A Photosensitive conductive paste, manufacturing method of laminated electronic component using the photosensitive conductive paste and laminated electronic component |
| 01/18/2012 | CN102323845A Trimming control circuit |
| 01/18/2012 | CN102323682A Liquid crystal panel and wound tape base plate with chip-on-flex (COF) structure |
| 01/18/2012 | CN101969054B Semiconductor chip and preparation method thereof |
| 01/18/2012 | CN101882610B Semiconductor structure and manufacturing method thereof |
| 01/18/2012 | CN101846828B Active component array substrate and liquid crystal display panel |
| 01/18/2012 | CN101835369B Thermoelectric refrigeration liquid cooling device |
| 01/18/2012 | CN101789416B Semiconductor package body structure with guard bars |
| 01/18/2012 | CN101783362B Upper cover structure, packaging structure of luminous element and packaging method for luminous element |
| 01/18/2012 | CN101752342B Integrated circuit structure |
| 01/18/2012 | CN101719497B New type integrated circuit for resisting full-scale irradiation of NMOS component |
| 01/18/2012 | CN101676658B Cooling apparatus for electronic device |
| 01/18/2012 | CN101667588B High density resistance based semiconductor device and manufacturing method thereof |
| 01/18/2012 | CN101645432B Semiconductor apparatus |
| 01/18/2012 | CN101584033B Microelectronic assemblies having compliancy and methods therefor |
| 01/18/2012 | CN101562188B Resistance structure for improving silicon-on-insulator (SOI) circuit ESD protection network |
| 01/18/2012 | CN101553923B Edge connect wafer level stacking and manufacturing method thereof |
| 01/18/2012 | CN101531333B Sensor self-powered circuit based on MEMS, and manufacturing process thereof |