| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/24/2012 | US8102036 Semiconductor device in which a semiconductor chip is sealed |
| 01/24/2012 | US8102035 Method of manufacturing a semiconductor device |
| 01/24/2012 | US8102034 Semiconductor device and manufacturing method of the same |
| 01/24/2012 | US8102033 Reduced soft error rate through metal fill and placement |
| 01/24/2012 | US8102028 Semiconductor component with marginal region |
| 01/24/2012 | US8102027 IC package sacrificial structures for crack propagation confinement |
| 01/24/2012 | US8102019 Electrically programmable diffusion fuse |
| 01/24/2012 | US8102002 System and method for isolated NMOS-based ESD clamp cell |
| 01/24/2012 | US8102001 Initial-on SCR device for on-chip ESD protection |
| 01/24/2012 | US8101987 Semiconductor device and method of fabricating the same |
| 01/24/2012 | US8101976 Device selection circuitry constructed with nanotube ribbon technology |
| 01/24/2012 | US8101974 Semiconductor device and manufacturing method thereof |
| 01/24/2012 | US8101938 Method of forming a chalcogenide memory cell having an ultrasmall cross-sectional area and a chalcogenide memory cell produced by the method |
| 01/24/2012 | US8101873 Protective structure for a circuit board and method for fabricating the same |
| 01/24/2012 | US8101505 Programmable electrical fuse |
| 01/24/2012 | US8101496 Method of manufacturing ball grid array type semiconductor device |
| 01/24/2012 | US8101470 Foil based semiconductor package |
| 01/24/2012 | US8101460 Semiconductor device and method of shielding semiconductor die from inter-device interference |
| 01/24/2012 | US8101459 Methods for assembling semiconductor devices in stacked arrangements by positioning spacers therebetween |
| 01/24/2012 | US8100169 Spray nozzle apparatus and method of use |
| 01/24/2012 | CA2485230C Thermally or electrically conductive gap filler |
| 01/19/2012 | WO2012009588A2 Integrated shielding for a package-on-package system |
| 01/19/2012 | WO2012009174A2 Air jet active heat sink apparatus |
| 01/19/2012 | WO2012009132A1 Apparatus for integrated circuit packaging |
| 01/19/2012 | WO2012008569A1 Heat sink, and electronic device |
| 01/19/2012 | WO2012008398A1 Electronic apparatus and display unit |
| 01/19/2012 | WO2012008233A1 Surface mount light-emitting device, and display unit |
| 01/19/2012 | WO2012008205A1 Electronic device and display device |
| 01/19/2012 | WO2012008192A1 Circuit board, display device, and process for production of circuit board |
| 01/19/2012 | WO2012008121A1 Semiconductor device |
| 01/19/2012 | WO2012008075A1 Nitride semiconductor device |
| 01/19/2012 | WO2012008018A1 Semiconductor device and method for manufacturing same |
| 01/19/2012 | WO2012007722A2 Apparatus and method for thermal interfacing |
| 01/19/2012 | WO2012007634A1 Radiation detector, pitch adapter, and method for producing a pitch adapter |
| 01/19/2012 | WO2012007252A1 Module package and production method |
| 01/19/2012 | WO2012007241A2 Semifinished product and method for producing a light-emitting diode |
| 01/19/2012 | WO2012006991A2 Semiconductor element and method for producing the same |
| 01/19/2012 | WO2012006766A1 Semiconductor structure and manufacturing method thereof |
| 01/19/2012 | WO2011153054A3 Contact holder |
| 01/19/2012 | WO2011126973A3 Forming metal filled die back-side film for electromagnetic interference shielding with coreless packages |
| 01/19/2012 | US20120016261 Hollow microtube structure, production method thereof and biopsy device |
| 01/19/2012 | US20120015687 Semiconductor package and mobile device using the same |
| 01/19/2012 | US20120015514 Semiconductor device and manufacturing method thereof |
| 01/19/2012 | US20120014066 Heat exchanger, semiconductor device, method for manufacturing the heat exchanger, and method for manufacturing the semiconductor device |
| 01/19/2012 | US20120013368 Method and system for electrically coupling a chip to chip package |
| 01/19/2012 | US20120013029 Method for manufacturing semiconductor devices having a metallisation layer |
| 01/19/2012 | US20120013027 Semiconductor and a method of manufacturing the same |
| 01/19/2012 | US20120013026 Stacked semiconductor package and method of fabricating the same |
| 01/19/2012 | US20120013025 Layered Chip Package and Method of Manufacturing Same |
| 01/19/2012 | US20120013024 Layered Chip Package and Method of Manufacturing Same |
| 01/19/2012 | US20120013023 Semiconductor device |
| 01/19/2012 | US20120013022 Method for forming 3d-interconnect structures with airgaps |
| 01/19/2012 | US20120013021 Semiconductor device and method for manufacturing semicondcutor device |
| 01/19/2012 | US20120013020 MEMS Device Comprising a Hermetically Sealed Cavity and Devices Obtained Thereof |
| 01/19/2012 | US20120013019 Semiconductor device |
| 01/19/2012 | US20120013018 Die package structure and related die package structure manufacturing method |
| 01/19/2012 | US20120013017 Integrated structures of high performance active devices and passive devices |
| 01/19/2012 | US20120013016 Flexible semiconductor package apparatus having a responsive bendable conductive wire member and a manufacturing the same |
| 01/19/2012 | US20120013015 Interconnection architecture for semiconductor device |
| 01/19/2012 | US20120013014 Semiconductor device and method for forming the same |
| 01/19/2012 | US20120013013 Temporary semiconductor structure bonding methods and related bonded semiconductor structures |
| 01/19/2012 | US20120013012 Methods of forming bonded semiconductor structures, and semiconductor structures formed by such methods |
| 01/19/2012 | US20120013011 Conductive Lines and Pads and Method of Manufacturing Thereof |
| 01/19/2012 | US20120013010 Bonding pad for anti-peeling property and method for fabricating the same |
| 01/19/2012 | US20120013009 Semiconductor structure and method of manufacturing the same |
| 01/19/2012 | US20120013008 Metallization processes, mixtures, and electronic devices |
| 01/19/2012 | US20120013007 Package-on-package semiconductor package having spacers disposed between two package substrates |
| 01/19/2012 | US20120013006 Chip scale package and fabrication method thereof |
| 01/19/2012 | US20120013005 Packaging Structure and Method |
| 01/19/2012 | US20120013004 Semiconductor Device Having an Interconnect Structure with TSV Using Encapsulant for Structural Support |
| 01/19/2012 | US20120013003 Bga package with traces for plating pads under the chip |
| 01/19/2012 | US20120013002 Package structure |
| 01/19/2012 | US20120013001 Stackable molded microelectronic packages with area array unit connectors |
| 01/19/2012 | US20120013000 Stackable molded microelectronic packages |
| 01/19/2012 | US20120012999 Semiconductor-encapsulating adhesive, semiconductor-encapsulating film-form adhesive, method for producing semiconductor device, and semiconductor device |
| 01/19/2012 | US20120012998 Conductive Sidewall for Microbumps |
| 01/19/2012 | US20120012997 Recessed Pillar Structure |
| 01/19/2012 | US20120012996 Semiconductor device |
| 01/19/2012 | US20120012995 Semiconductor device |
| 01/19/2012 | US20120012994 Method for manufacturing semiconductor devices having a glass substrate |
| 01/19/2012 | US20120012993 Die package including substrate with molded device |
| 01/19/2012 | US20120012992 Semiconductor device |
| 01/19/2012 | US20120012991 Integrated shielding for a package-on-package system |
| 01/19/2012 | US20120012990 Semiconductor Device and Method of Forming Protective Layer Over Exposed Surfaces of Semiconductor Die |
| 01/19/2012 | US20120012988 Chip package and method for forming the same |
| 01/19/2012 | US20120012978 Semiconductor device |
| 01/19/2012 | US20120012977 Secure anti-fuse with low voltage programming through localized diffusion heating |
| 01/19/2012 | US20120012897 Vertically Fabricated BEOL Non-Volatile Two-Terminal Cross-Trench Memory Array with Two-Terminal Memory Elements and Method of Fabricating the Same |
| 01/19/2012 | US20120012879 Leadframe-based packages for solid state light emitting devices and methods of forming leadframe-based packages for solid state light emitting devices |
| 01/19/2012 | US20120012857 Wide-gap semiconductor substrate and method to fabricate wide-gap semiconductor device using the same |
| 01/19/2012 | US20120012844 Semiconductor memory apparatus for controlling pads and multi-chip package having the same |
| 01/19/2012 | US20120012843 Semiconductor device, method of manufacturing the same, and method of designing the same |
| 01/19/2012 | US20120012842 Semiconductor device having function of transmitting/receiving |
| 01/19/2012 | US20120012841 Through-silicon via testing structure |
| 01/19/2012 | US20120012642 Interconnections for flip-chip using lead-free solders and having reaction barrier layers |
| 01/19/2012 | DE112009002625T5 Beschichtungsmittel, Substrat zum Montieren eines optischen Halbleiterelements unter Verwendung desselben und optische Halbleitervorrichtung Coating agent, the substrate for mounting an optical semiconductor element using the same, and optical semiconductor device |
| 01/19/2012 | DE102011102850A1 Thermodiffusor und Kühlvorrichtung zum Kühlen einer Wärmequelle unter dessen Verwendung Thermal diffuser and cooling apparatus for cooling a heat source in its use |
| 01/19/2012 | DE102011001844A1 Verfahren zum Herstellen eines Halbleiterchip-Package und Halbleiterchip-Package A method for producing a semiconductor chip package and semiconductor chip package |
| 01/19/2012 | DE102010027551A1 Cooling device for electronic component, has heat receiving surface connected with heat delivering surface, and heat receiving end accommodated in groove, where delivering surface lies on closed side |
| 01/19/2012 | DE102010027533A1 Kühlvorrichtung für zylinderförmige, koppelbare LED-Module Cooling device for cylindrical, linkable LED modules |