| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 01/25/2012 | CN202127012U Lead frame for plastic semiconductor |
| 01/25/2012 | CN202127011U Pulse-type cooling device |
| 01/25/2012 | CN202127010U Heat pipe |
| 01/25/2012 | CN202127009U Cooling device |
| 01/25/2012 | CN202127008U Non-welding type radiator |
| 01/25/2012 | CN202127007U Lead frame with T-shaped notches between cooling fins |
| 01/25/2012 | CN202123810U Package of information memory |
| 01/25/2012 | CN1813349B Multi-layer polymer-solder hybrid thermal interface material for integrated heat spreader and method of making same |
| 01/25/2012 | CN1768900B Curable thick film compositions for use in moisture control |
| 01/25/2012 | CN1667825B Plain conductor structure and process thereof |
| 01/25/2012 | CN1527383B 半导体集成电路 The semiconductor integrated circuit |
| 01/25/2012 | CN102334185A Antifuse |
| 01/25/2012 | CN102334184A 电子电路装置 Electronic circuit means |
| 01/25/2012 | CN102333823A Thermoconductive composition, heat dissipating plate, heat dissipating substrate and circuit module using thermoconductive composition, and process for production of thermoconductive composition |
| 01/25/2012 | CN102332455A Active component array substrate and display panel |
| 01/25/2012 | CN102332449A Assembled structure for electronic elements |
| 01/25/2012 | CN102332448A System and method for providing alignment mark for high-k metal gate process |
| 01/25/2012 | CN102332447A Capacitor and forming method thereof |
| 01/25/2012 | CN102332446A COF and carrier tape thereof |
| 01/25/2012 | CN102332445A Semiconductor device and method of manufacturing the same |
| 01/25/2012 | CN102332444A Semiconductor lead frame of whole matrix surface |
| 01/25/2012 | CN102332443A Lead frame for plastic package semiconductor |
| 01/25/2012 | CN102332442A Four-row lead frame for plastic package components of light controller and sound controller |
| 01/25/2012 | CN102332441A High-alignment-packaging-type lead frame and packaging structure thereof |
| 01/25/2012 | CN102332440A Inverted lead frame and packaging structure thereof |
| 01/25/2012 | CN102332439A Copper-based bonding wire with anti-oxidation coating and processing technology thereof |
| 01/25/2012 | CN102332438A Inductive bond-wire circuit |
| 01/25/2012 | CN102332437A Heat pipe radiating device and installation method thereof |
| 01/25/2012 | CN102332436A Package of shape memory alloy core structure |
| 01/25/2012 | CN102332435A Electronic component and manufacturing method of same |
| 01/25/2012 | CN102332434A Semiconductor structure and method of forming devices |
| 01/25/2012 | CN102332410A Packaging method and structure of chip |
| 01/25/2012 | CN102332408A Chip scale package and production method thereof |
| 01/25/2012 | CN102331832A Forced air-cooled heat pipe radiating system for servo driver |
| 01/25/2012 | CN101924087B Inversed-chip lug structure and manufacturing process thereof |
| 01/25/2012 | CN101887874B Substrate having single patterned metal layer, and package applied with the substrate , and methods of manufacturing of the substrate and package |
| 01/25/2012 | CN101866917B Active element array substrate and repair method thereof |
| 01/25/2012 | CN101853829B Semiconductor structure and manufacturing method thereof |
| 01/25/2012 | CN101853825B Multi-load topology framework |
| 01/25/2012 | CN101853822B Novel heat sink and production method thereof |
| 01/25/2012 | CN101847622B Power chip with multi-stack package preformed vertical structure and manufacturing method thereof |
| 01/25/2012 | CN101819951B Base plate, semiconductor packaging piece applying same and manufacture method of base plate |
| 01/25/2012 | CN101814481B No-pad lead frame structure and production method thereof |
| 01/25/2012 | CN101809734B Heat conductive sheet, its manufacture method and power module |
| 01/25/2012 | CN101800184B Packaging base plate with cave structure and manufacture method thereof |
| 01/25/2012 | CN101783332B Circuit board and preparation process thereof |
| 01/25/2012 | CN101777576B Pixel structure and electroluminescence device |
| 01/25/2012 | CN101771023B Wafer-level test structure |
| 01/25/2012 | CN101770952B Metal oxide semiconductor field effect transistor and forming method thereof |
| 01/25/2012 | CN101752402B Top emission type organic electro luminescent device and methode of fabricating the same |
| 01/25/2012 | CN101752333B Power semiconductor module |
| 01/25/2012 | CN101734607B Packaging structure of micro-electromechanical system |
| 01/25/2012 | CN101689541B Integrated circuits on a wafer and methods for manufacturing integrated circuits |
| 01/25/2012 | CN101625079B Hollow liquid-cooling LED lamp |
| 01/25/2012 | CN101604673B Welding pad structure |
| 01/25/2012 | CN101577266B Monitoring and testing structure for plasma damage and evaluation method |
| 01/25/2012 | CN101533792B Wafer level ic assembly method |
| 01/25/2012 | CN101496162B Wafer level package including a device wafer integrated with a passive component |
| 01/25/2012 | CN101472443B Radiating device |
| 01/25/2012 | CN101466241B Radiating device |
| 01/25/2012 | CN101459146B Semiconductor packages and method for manufacturing same |
| 01/25/2012 | CN101442034B Bonding pad and method for forming the same |
| 01/25/2012 | CN101359678B Image display system and preparation thereof |
| 01/25/2012 | CN101322450B IC packages with internal heat dissipation structures |
| 01/25/2012 | CN101300913B Spaced, bumped component structure |
| 01/25/2012 | CN101252122B mems package for system of air-tight device and wafer-class detection |
| 01/25/2012 | CN101211970B Semiconductor device and producing method thereof |
| 01/25/2012 | CN101188219B Liquid crystal display device drive circuit and manufacture method and display device possessing same |
| 01/25/2012 | CN101154629B Semiconductor device and method of fabricating the same |
| 01/24/2012 | US8103976 Photo mask set for forming multi-layered interconnection lines and semiconductor device fabricated using the same |
| 01/24/2012 | US8103881 System, method and apparatus for electronic ticketing |
| 01/24/2012 | US8103025 Surface mountable transducer system |
| 01/24/2012 | US8102666 Integrated circuit package system |
| 01/24/2012 | US8102652 Base for power module |
| 01/24/2012 | US8102486 Display panel and display device |
| 01/24/2012 | US8102456 CCD array with integrated high voltage protection circuit |
| 01/24/2012 | US8102064 Electrical alignment mark set and method for aligning wafer stack |
| 01/24/2012 | US8102063 Pad structure with a nano-structured coating film |
| 01/24/2012 | US8102062 Optionally bonding either two sides or more sides of integrated circuits |
| 01/24/2012 | US8102060 Electrically conducting connection with insulating connection medium |
| 01/24/2012 | US8102059 Interconnect structure for high frequency signal transmissions |
| 01/24/2012 | US8102058 Chip package structure and method for fabricating the same |
| 01/24/2012 | US8102056 Semiconductor device having pads and which minimizes defects due to bonding and probing processes |
| 01/24/2012 | US8102055 Semiconductor device |
| 01/24/2012 | US8102054 Reliable interconnects |
| 01/24/2012 | US8102052 Process for the simultaneous deposition of crystalline and amorphous layers with doping |
| 01/24/2012 | US8102051 Semiconductor device having an electrode and method for manufacturing the same |
| 01/24/2012 | US8102050 Semiconductor device and the method of manufacturing the same |
| 01/24/2012 | US8102049 Semiconductor device including through electrode and method of manufacturing the same |
| 01/24/2012 | US8102048 Electronic device manufacturing method and electronic device |
| 01/24/2012 | US8102047 Load driving device |
| 01/24/2012 | US8102046 Semiconductor device and method of manufacturing the same |
| 01/24/2012 | US8102045 Integrated circuit with galvanically bonded heat sink |
| 01/24/2012 | US8102044 Bonded wafer structure and method of fabrication |
| 01/24/2012 | US8102042 Reducing plating stub reflections in a chip package using resistive coupling |
| 01/24/2012 | US8102041 Integrated circuit package |
| 01/24/2012 | US8102040 Integrated circuit package system with die and package combination |
| 01/24/2012 | US8102039 Semiconductor device and manufacturing method thereof |
| 01/24/2012 | US8102038 Semiconductor chip attach configuration having improved thermal characteristics |
| 01/24/2012 | US8102037 Leadframe for semiconductor package |