| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 12/16/2014 | US8912451 Multilayered printed circuit board and method for manufacturing the same |
| 12/16/2014 | US8912450 Method for attaching a metal surface to a carrier, a method for attaching a chip to a chip carrier, a chip-packaging module and a packaging module |
| 12/16/2014 | US8912449 Thermal warp compensation IC package |
| 12/16/2014 | US8912279 Resin composition |
| 12/16/2014 | US8912100 Manufacturing method of complementary metal oxide semiconductor |
| 12/16/2014 | US8912091 Backside metal ground plane with improved metal adhesion and design structures |
| 12/16/2014 | US8912088 Transfer substrate for forming metal wiring and method for forming metal wiring using said transfer substrate |
| 12/16/2014 | US8912087 Method of fabricating a chip package |
| 12/16/2014 | US8912076 Crack deflector structure for improving semiconductor device robustness against saw-induced damage |
| 12/16/2014 | US8912052 Semiconductor device and structure |
| 12/16/2014 | US8912051 Method for controlling molding compound geometry around a semiconductor die |
| 12/16/2014 | US8912050 Capping coating for 3D integration applications |
| 12/16/2014 | US8912047 Method for producing a metal layer on a substrate and device |
| 12/16/2014 | US8912046 Integrated circuit packaging system with lead frame and method of manufacture thereof |
| 12/16/2014 | US8912044 Method for bonding semiconductor substrates and devices obtained thereof |
| 12/16/2014 | US8912043 Dual-side interconnected CMOS for stacked integrated circuits |
| 12/16/2014 | US8912041 Method for forming recess-free interconnect structure |
| 12/16/2014 | US8912024 Front facing piggyback wafer assembly |
| 12/16/2014 | US8912018 Manufacturing flexible organic electronic devices |
| 12/16/2014 | US8912015 Operating method of hardwired switch |
| 12/16/2014 | US8911862 Getter systems comprising one or more deposits of getter material and a layer of material for the transport of water |
| 12/16/2014 | US8911266 Contact holder |
| 12/16/2014 | US8910853 Additives for grain fragmentation in Pb-free Sn-based solder |
| 12/16/2014 | US8910706 Heat sink apparatus with extendable pin fins |
| 12/16/2014 | US8910375 Mounting apparatus |
| 12/16/2014 | DE202013012008U1 Kühlsystem für elektronische Baueinheiten Cooling system for electronic assemblies |
| 12/15/2014 | DE202012013138U1 Anzeigevorrichtung mit Temperatursicherung Display device with thermal fuse |
| 12/11/2014 | US20140363974 Semiconductor device and method of manufacturing the same |
| 12/11/2014 | US20140363966 Pillar Bumps and Process for Making Same |
| 12/11/2014 | US20140363965 Double solder bumps on substrates for low temperature flip chip bonding |
| 12/11/2014 | US20140363961 Thin film transistor array panel and manufacturing method thereof |
| 12/11/2014 | US20140363929 Bumpless build-up layer package warpage reduction |
| 12/11/2014 | US20140363928 Micro device stabilization post |
| 12/11/2014 | US20140363927 Novel Terminations and Couplings Between Chips and Substrates |
| 12/11/2014 | US20140363926 Semiconductor device and method for manufacturing the same |
| 12/11/2014 | US20140363925 Method for Producing a Semiconductor Module by Using an Adhesion Carrier |
| 12/11/2014 | US20140363924 Stacked multi-die packages with impedance control |
| 12/11/2014 | US20140363153 Optical Die Test Interface |
| 12/11/2014 | US20140362550 Selective wetting process to increase solder joint standoff |
| 12/11/2014 | US20140362540 Semiconductor device |
| 12/11/2014 | US20140362537 Power Modules and Power Module Arrays Having A Modular Design |
| 12/11/2014 | US20140362536 Group iii nitride based flip-chip integrated circuit and method for fabricating |
| 12/11/2014 | US20140362457 Slotted configuration for optimized placement of micro-components using adhesive bonding |
| 12/11/2014 | US20140362267 Semiconductor device, fabrication method for a semiconductor device and electronic apparatus |
| 12/11/2014 | US20140361446 Resin-sealed semiconductor device and method of manufacturing the same |
| 12/11/2014 | US20140361445 Semiconductor device and method for manufacturing same |
| 12/11/2014 | US20140361444 Semiconductor device with overlapped lead terminals |
| 12/11/2014 | US20140361443 Method of manufacturing flip-chip type semiconductor device |
| 12/11/2014 | US20140361442 Semiconductor package and method of manufacturing the semiconductor package |
| 12/11/2014 | US20140361441 Stack packages and methods of manufacturing the same |
| 12/11/2014 | US20140361440 Process for producing at least one through-silicon via with improved heat dissipation, and corresponding three-dimensional integrated structure |
| 12/11/2014 | US20140361439 Packaging substrate and method for manufacturing same |
| 12/11/2014 | US20140361438 Seal ring structure and method of forming the same |
| 12/11/2014 | US20140361437 Package substrates and methods of fabricating the same |
| 12/11/2014 | US20140361436 Semiconductor device manufacturing method, storage medium and semiconductor device |
| 12/11/2014 | US20140361435 Methods of forming copper-based nitride liner/passivation layers for conductive copper structures and the resulting device |
| 12/11/2014 | US20140361434 Semiconductor device, method of manufacturing thereof, circuit board and electronic apparatus |
| 12/11/2014 | US20140361433 Semiconductor device |
| 12/11/2014 | US20140361432 Pillar Design for Conductive Bump |
| 12/11/2014 | US20140361431 Semiconductor device and manufacturing method thereof |
| 12/11/2014 | US20140361430 Semiconductor device |
| 12/11/2014 | US20140361429 Semiconductor device with bumps and display device module incorporating the same |
| 12/11/2014 | US20140361428 Semiconductor packages |
| 12/11/2014 | US20140361427 Flexible stack packages, electronic systems including the same, and memory cards including the same |
| 12/11/2014 | US20140361426 Stacked semiconductor package and method for manufacturing the same |
| 12/11/2014 | US20140361425 Semiconductor device including cooler |
| 12/11/2014 | US20140361424 Semiconductor device |
| 12/11/2014 | US20140361423 Semiconductor Device and Method of Using Leadframe Bodies to Form Openings Through Encapsulant for Vertical Interconnect of Semiconductor Die |
| 12/11/2014 | US20140361422 Semiconductor device |
| 12/11/2014 | US20140361421 Lead frame based semiconductor die package |
| 12/11/2014 | US20140361420 Hybrid packaging multi-chip semiconductor device and preparation method thereof |
| 12/11/2014 | US20140361419 Power control device and preparation method thereof |
| 12/11/2014 | US20140361418 A semiconductor package of a flipped mosfet |
| 12/11/2014 | US20140361417 Ground shield structure and semiconductor device |
| 12/11/2014 | US20140361416 Resin-sealed semiconductor device and method of manufacturing resin-sealed semiconductor device |
| 12/11/2014 | US20140361413 Process for fabricating a three-dimensional integrated structure with improved heat dissipation, and corresponding three-dimensional integrated structure |
| 12/11/2014 | US20140361411 Semiconductor device |
| 12/11/2014 | US20140361410 Semiconductor device |
| 12/11/2014 | US20140361404 Capacitor structure |
| 12/11/2014 | US20140361402 Integrated circuit package with printed circuit layer |
| 12/11/2014 | US20140361401 Patterned ground shield structures and semiconductor devices |
| 12/11/2014 | US20140361400 Electrostatic discharge protection structure and method for forming the same |
| 12/11/2014 | US20140361392 Memory Devices with Magnetic Random Access Memory (MRAM) Cells and Associated Structures for Connecting the MRAM Cells |
| 12/11/2014 | US20140361382 Semiconductor devices having compact footprints and related devices, systems, and methods |
| 12/11/2014 | US20140361357 Nonvolatile semiconductor memory device including pillars buried inside through holes same |
| 12/11/2014 | US20140361331 Light-emitting apparatus, surface light source, and method for manufacturing package for light-emitting apparatus |
| 12/11/2014 | US20140361200 Opto-Electronic Modules, In Particular Flash Modules, and Method For Manufacturing The Same |
| 12/11/2014 | US20140361183 Electric device, method for manufacturing the same, and radiation inspection apparatus |
| 12/11/2014 | US20140360759 Wiring board and method for manufacturing the same |
| 12/10/2014 | CN204014389U 热管散热装置 Heat pipe cooling device |
| 12/10/2014 | CN204014280U Mos管散热装置 Mos pipe cooling device |
| 12/10/2014 | CN204011439U 点接触型二极管 Point-contact diode |
| 12/10/2014 | CN204011438U 硅双向触发二极管 Silicon diac |
| 12/10/2014 | CN204011423U 一种柔性驱动基板和柔性显示装置 A flexible substrate and the flexible display device driving |
| 12/10/2014 | CN204011419U 具线圈驱动功能的半导体封装结构 Semiconductor package structure with coil drive functions |
| 12/10/2014 | CN204011413U 塑封超薄型桥式整流器 Ultra-thin plastic bridge rectifier |
| 12/10/2014 | CN204011412U 互连结构尾端安全间距的测试结构 End of the test structure interconnect structure safety pitch |
| 12/10/2014 | CN204011411U 可快速识别正负极的发光二极管 Can quickly identify the positive and negative light emitting diode |
| 12/10/2014 | CN204011410U 电路板及使用该电路板的半导体封装结构 Circuit boards and semiconductor packaging structure of the circuit board |
| 12/10/2014 | CN204011409U 提高材料利用率的sop 8l 12r引线框架 Improve sop 8l 12r lead frame material utilization |