| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/01/2012 | CN101752279B 接合第一和第二基板的方法、印刷模板和堆叠基板的系统 Engagement of the first system and the second substrate method, a printing substrate, and stacking the template |
| 02/01/2012 | CN101740572B 存储器元件 Memory elements |
| 02/01/2012 | CN101728337B 无芯基板、其制造方法以及包含其的微电子器件封装件 Coreless substrate, its manufacturing method, and contains its microelectronic device package |
| 02/01/2012 | CN101656229B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof |
| 02/01/2012 | CN101635296B 有机电致发光显示器件及其制造方法 Organic electroluminescent display device and manufacturing method thereof |
| 02/01/2012 | CN101626005B 键合银丝及其制备方法 Bonded silver and preparation method |
| 02/01/2012 | CN101593745B 用于集成电路的封环结构 The seal ring structure for integrated circuits |
| 02/01/2012 | CN101562186B 像素结构及其修补方法 Pixel structure and repair methods |
| 02/01/2012 | CN101442032B 散热装置 Cooling devices |
| 02/01/2012 | CN101415310B 散热装置 Cooling devices |
| 02/01/2012 | CN101410975B Ⅲ族-氮化物功率半导体器件 Ⅲ Group - nitride power semiconductor devices |
| 02/01/2012 | CN101330087B 阵列基板及其制造方法和具有该阵列基板的显示器件 The method of manufacturing the array substrate and a display device having the array substrate, |
| 02/01/2012 | CN101325859B 散热装置 Cooling devices |
| 02/01/2012 | CN101303981B 具有内置部件的布线板及其用于制造该布线板的方法 A wiring board having a built-in component and a method for manufacturing the wiring board |
| 02/01/2012 | CN101213890B 多层布线基板及其制造方法 A multilayer wiring board and its manufacturing method |
| 02/01/2012 | CN101107324B 发光元件封装用有机硅组合物及发光装置 A light emitting element package with the silicone composition and a light-emitting device |
| 02/01/2012 | CN101010800B 安装基板、安装体及使用安装基板和安装体的电子设备 Mounting an electronic device substrate, and use of the mounting substrate mounting body and mounting member |
| 01/31/2012 | US8108817 Semiconductor structure and method of designing semiconductor structure to avoid high voltage initiated latch-up in low voltage sectors |
| 01/31/2012 | US8107253 Printed circuit board |
| 01/31/2012 | US8107241 Electric power conversion apparatus including cooling units |
| 01/31/2012 | US8107240 Electronic gaming machine interface system |
| 01/31/2012 | US8107203 Electrostatic discharge protection device |
| 01/31/2012 | US8107079 Multi layer alignment and overlay target and measurement method |
| 01/31/2012 | US8106953 Imaging apparatus including a cooled imaging element which is shifted to perform high-definition imaging |
| 01/31/2012 | US8106523 Liquid resin composition, semi-conductor device, and process of fabricating the same |
| 01/31/2012 | US8106521 Semiconductor device mounted structure with an underfill sealing-bonding resin with voids |
| 01/31/2012 | US8106520 Signal delivery in stacked device |
| 01/31/2012 | US8106519 Methods for pitch reduction |
| 01/31/2012 | US8106518 Semiconductor device and method of manufacturing the same |
| 01/31/2012 | US8106516 Wafer-level chip scale package |
| 01/31/2012 | US8106515 Local metallization and use thereof in semiconductor devices |
| 01/31/2012 | US8106514 Semiconductor device having an annular guard ring |
| 01/31/2012 | US8106512 Low resistance high reliability contact via and metal line structure for semiconductor device |
| 01/31/2012 | US8106509 Electronic device and electronic apparatus |
| 01/31/2012 | US8106508 Electronic component for surface mounting |
| 01/31/2012 | US8106507 Semiconductor package having socket function, semiconductor module, electronic circuit module and circuit board with socket |
| 01/31/2012 | US8106506 Electronic component |
| 01/31/2012 | US8106505 Assembly including plural through wafer vias, method of cooling the assembly and method of fabricating the assembly |
| 01/31/2012 | US8106504 Stacking package structure with chip embedded inside and die having through silicon via and method of the same |
| 01/31/2012 | US8106503 High frequency semiconductor device |
| 01/31/2012 | US8106502 Integrated circuit packaging system with plated pad and method of manufacture thereof |
| 01/31/2012 | US8106501 Semiconductor die package including low stress configuration |
| 01/31/2012 | US8106500 Stackable integrated circuit package system |
| 01/31/2012 | US8106499 Integrated circuit packaging system with a dual substrate package and method of manufacture thereof |
| 01/31/2012 | US8106498 Integrated circuit packaging system with a dual board-on-chip structure and method of manufacture thereof |
| 01/31/2012 | US8106496 Semiconductor packaging system with stacking and method of manufacturing thereof |
| 01/31/2012 | US8106495 Semiconductor apparatus and manufacturing method thereof |
| 01/31/2012 | US8106494 Leadframe for leadless package, structure and manufacturing method using the same |
| 01/31/2012 | US8106493 Semiconductor device package having features formed by stamping |
| 01/31/2012 | US8106492 Semiconductor package and manufacturing method thereof |
| 01/31/2012 | US8106491 Methods of forming stacked semiconductor devices with a leadframe and associated assemblies |
| 01/31/2012 | US8106490 Semiconductor chip package |
| 01/31/2012 | US8106489 Integrated circuit package and packaging method |
| 01/31/2012 | US8106488 Wafer level packaging |
| 01/31/2012 | US8106487 Semiconductor device having an inorganic coating layer applied over a junction termination extension |
| 01/31/2012 | US8106484 Silicon substrate for package |
| 01/31/2012 | US8106476 Semiconductor die with fuse window and a monitoring window over a structure which indicates fuse integrity |
| 01/31/2012 | US8106441 Semiconductor device having plural DRAM memory cells and a logic circuit and method for manufacturing the same |
| 01/31/2012 | US8106425 Interconnection substrate, semiconductor chip package including the same, and display system including the same |
| 01/31/2012 | US8106396 Thin film transistor array substrate |
| 01/31/2012 | US8106395 Semiconductor device and method of manufacturing the same |
| 01/31/2012 | US8106385 Organic siloxane film, semiconductor device using the same, flat panel display device, and raw material liquid |
| 01/31/2012 | US8106312 Sealing structure, electronic device, sealing method, gasket, and manufacturing method thereof |
| 01/31/2012 | US8106310 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board |
| 01/31/2012 | US8105943 Enhancing structural integrity and defining critical dimensions of metallization systems of semiconductor devices by using ALD techniques |
| 01/31/2012 | US8105940 Power distribution in a vertically integrated circuit |
| 01/31/2012 | US8105934 Bump structure for a semiconductor device and method of manufacture |
| 01/31/2012 | US8105886 Semiconductor electrically programmable fuse element with amorphous silicon layer after programming and method of programming the same |
| 01/31/2012 | US8105873 Flexible semiconductor device and identification label |
| 01/31/2012 | US8105860 Support with integrated deposit of gas absorbing material for manufacturing microelectronic microoptoelectronic or micromechanical devices |
| 01/31/2012 | US8105856 Method of manufacturing semiconductor device with wiring on side surface thereof |
| 01/31/2012 | US8105757 Method of making a semiconductor device |
| 01/31/2012 | US8105687 Electroconductive bonding material and electronic apparatus |
| 01/31/2012 | US8104863 Method for the printing of homogeneous electronic material with a multi-ejector print head |
| 01/31/2012 | US8104668 Method and apparatus providing fine alignment of a structure relative to a support |
| 01/31/2012 | US8104533 Spray nozzle apparatus and method of use |
| 01/31/2012 | US8104172 Method buffer coating having a physical mixture of high toughness polymer and a low shrinkage polymer |
| 01/31/2012 | DE202005021992U1 CPU-Stromversorgungssystem CPU power supply system |
| 01/31/2012 | CA2543909C High temperature electronic devices |
| 01/30/2012 | DE202011108919U1 Beleuchtungseinrichtung Lighting device |
| 01/26/2012 | WO2012012384A1 Polycrystalline aluminum nitride material and method of production thereof |
| 01/26/2012 | WO2012012338A1 Embedded structures and methods of manufacture thereof |
| 01/26/2012 | WO2012012323A2 Stackable molded microelectronic packages |
| 01/26/2012 | WO2012012321A2 Stackable molded microelectronic packages with area array unit connectors |
| 01/26/2012 | WO2012012220A2 Metal-contamination -free through-substrate via structure |
| 01/26/2012 | WO2012011957A2 Thermal management of environmentally-sealed electronics enclosure |
| 01/26/2012 | WO2012011932A1 Methods of forming semiconductor elements using micro-abrasive particle stream |
| 01/26/2012 | WO2012011931A1 Microelectronic elements having metallic pads overlying vias |
| 01/26/2012 | WO2012011930A1 Non-lithographic formation of three-dimensional conductive elements |
| 01/26/2012 | WO2012011587A1 Alumina ceramic and substrate for mounting light-emitting element using same |
| 01/26/2012 | WO2012011539A1 Cu alloy film for display device, and display device |
| 01/26/2012 | WO2012011410A1 Method for manufacturing functional component and functional component |
| 01/26/2012 | WO2012011362A1 Electrochemical device |
| 01/26/2012 | WO2012011210A1 Semiconductor device and method for manufacturing same |
| 01/26/2012 | WO2012011207A1 Semiconductor device manufacturing method comprising step of removing pad electrode for inspection |
| 01/26/2012 | WO2012011046A1 Optical interconnects in cooling substrates |
| 01/26/2012 | WO2012010874A1 Antenna |
| 01/26/2012 | WO2012010816A1 Method of fabrication of semiconductor device |
| 01/26/2012 | WO2012010662A2 Process for direct bonding two elements comprising copper portions and dielectric materials |
| 01/26/2012 | WO2012010479A1 Method and structure to improve the conductivity of narrow copper filled vias |