Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2012
02/02/2012DE102010038727A1 Leistungshaltleitermodul, Verfahren zur Herstellung eines Leistungshalbleitermoduls und eines Gehäuseelements für ein Leistungshalbleitermodul Maintenance power semiconductor module, method for producing a power semiconductor module and a casing element for a power semiconductor module
02/02/2012DE102010038723A1 Leistungshalbleitermodul mit mindestens einer Positioniervorrichtung für ein Substrat Power semiconductor module having at least one positioning device for a substrate
02/02/2012DE102010032834A1 Optoelektronische Vorrichtung und Verfahren zu deren Herstellung Optoelectronic device and process for their preparation
02/02/2012DE102010032813A1 Verfahren zur Herstellung eines optoelektronischen Halbleiterbauteils und optoelektronisches Halbleiterbauteil A method for producing an optoelectronic semiconductor component and optoelectronic semiconductor component
02/02/2012DE102010032763A1 Flip-Chip-Gehäuse für zwei Filtertopologien Flip-chip package for two filter topologies
02/02/2012DE102010032506A1 Modul und Herstellungsverfahren Module and manufacturing method
02/02/2012DE102010022668B4 Thermoelektrisches Element und Modul umfassend mehrere derartige Elemente The thermoelectric element and module comprising a plurality of such elements
02/02/2012DE102007046085B4 Nanoröhrenverstärkte Lötkappe, Prozess zur Herstellung derselben und Rechenystem, die diese enthält Nanotubes reinforced Lötkappe, process for producing the same and Rechenystem that contains these
02/02/2012DE102007022428B4 Elektronisches Bauelement und Verfahren zu dessen Herstellung An electronic device and method for its production
02/02/2012DE102005033916B4 Ausrichtung eines MTJ-Stapels an Leiterbahnen in Abwesenheit von Topographie Orientation of a MTJ stack of printed conductors in the absence of topography
02/01/2012EP2413392A2 Light-emitting diode package
02/01/2012EP2413357A2 Power semiconductor module with at least one positioning means for a substrate
02/01/2012EP2413354A1 Sub-module and power semiconductor module
02/01/2012EP2413353A2 Heat sink device and method of repairing semiconductor device
02/01/2012EP2413351A1 Coated copper wire for ball bonding
02/01/2012EP2413347A1 Fringe capacitor based on fractal patterns
02/01/2012EP2412597A1 Heat sink
02/01/2012EP2412215A1 Grid heat sink
02/01/2012EP2412023A1 Esd network circuit with a through wafer via structure and a method of manufacture
02/01/2012EP2412020A1 Slip chip device and methods
02/01/2012EP1856739B1 Device for supplying an integrated circuit with power
02/01/2012EP1551081B1 Production method for component to be soldered
02/01/2012EP1334519B1 Ball limiting metallurgy for input/outputs and methods of fabrication
02/01/2012CN202135435U 具有回叠结构的电子电路用散热条 An electronic circuit having a stacked structure with back fins
02/01/2012CN202135434U Cooling device and electronic device
02/01/2012CN202135044U 智能变频复合功率模块 Intelligent Power Module Frequency complex
02/01/2012CN202134533U 智能伺服变压器用桥堆 Intelligent servo transformer bridge rectifiers
02/01/2012CN202134531U Semiconductor device
02/01/2012CN202134530U 一种集成电流体动力泵的微型lhp散热系统 An integrated micro electrohydrodynamic pump lhp cooling system
02/01/2012CN202134529U 一种石墨散热器装置 Graphite heat sink assembly
02/01/2012CN202134528U 鳍片组接结构及具有该结构的散热器 Group structure and radiator fins connected with this structure
02/01/2012CN202134527U 一种带有散热器的厚膜混合集成电路模块 A thick film hybrid integrated circuit module with heatsink
02/01/2012CN202134526U 小外形晶体管封装结构 Small Outline Transistor package
02/01/2012CN202134525U Semiconductor device with single installing hole
02/01/2012CN202134524U Substrate of semiconductor component
02/01/2012CN202134523U 封装芯片的承载座 Packaged chip carrier seat
02/01/2012CN202134522U 圆片级封闭孔互联结构 Wafer-level interconnection structure closed pores
02/01/2012CN202133860U 光刻对准标记 Lithography alignment marks
02/01/2012CN202133312U 热管结构 Heat pipe structure
02/01/2012CN102342194A Electronic component mounting device and method for producing the same
02/01/2012CN102342185A Multiple Patterning Wiring Board, Wiring Board Wiring Board and Electronic Apparatus
02/01/2012CN102341931A Encapsulation methods for organic electrical devices
02/01/2012CN102341908A Film for spacer formation, semiconductor wafer, and semiconductor device
02/01/2012CN102341907A Three dimensional integrated circuit integration using dielectric bonding first and through via formation last
02/01/2012CN102341905A Semiconductor integrated circuit device and method for designing same
02/01/2012CN102341895A Semiconductor chip and semiconductor device
02/01/2012CN102341870A Magnetic Film Enhanced Inductor
02/01/2012CN102341866A Electrically conductive paste composition and electrically conductive film formed by using same
02/01/2012CN102341525A Method for forming cu film and storage medium
02/01/2012CN102340971A Wind scooper and electronic device having wind scooper
02/01/2012CN102340969A Heat dissipation apparatus possessing tilting double fans
02/01/2012CN102340158A Structure of battery disconnection unit for electric vehicle
02/01/2012CN102339855A Interconnection structure and manufacturing method thereof
02/01/2012CN102339847A Memory device
02/01/2012CN102339836A Silicon on insulator device
02/01/2012CN102339832A Pillar type capacitor of semiconductor device and method for forming the same
02/01/2012CN102339829A Semiconductor device and method for forming the same
02/01/2012CN102339824A Defectivity-immune technique of implementing MIM-based decoupling capacitors
02/01/2012CN102339818A 功率模块 Power Modules
02/01/2012CN102339817A Semiconductor package and mobile device using the same
02/01/2012CN102339816A Wafer test key structure and wafer test method
02/01/2012CN102339815A Test structure for analyzing through-hole type metal-interconnected electromigration reliability
02/01/2012CN102339814A Method and structure for testing metal-oxide-semiconductor field-effect transistor (MOSFET)
02/01/2012CN102339813A Semiconductor structure and manufacturing method thereof
02/01/2012CN102339812A 接触结构及半导体器件 Contact structure and semiconductor device
02/01/2012CN102339811A Circuit board with COB (Chip On Board) packaged power device
02/01/2012CN102339810A Silicon based substrate and fabrication method thereof
02/01/2012CN102339809A QFN (quad flat non-lead) package with multiple circles of pins and manufacturing method thereof
02/01/2012CN102339808A Packaging lead frame structure
02/01/2012CN102339807A Lead frame with T-shaped gaps among radiating fins
02/01/2012CN102339806A Lead frame with toothed groove on front side of matrix
02/01/2012CN102339805A Lead frame with pressing edge on back side of matrix
02/01/2012CN102339804A 半导体器件 Semiconductor devices
02/01/2012CN102339803A Die package structure and related die package structure manufacturing method
02/01/2012CN102339802A 高频半导体装置 High-frequency semiconductor devices
02/01/2012CN102339801A Directive thermosyphon-type heat conducting column
02/01/2012CN102339800A Stacked interconnect heat sink
02/01/2012CN102339799A Heat-dissipating structure for single IGBT (Insulated Gate Bipolar Transistor)
02/01/2012CN102339798A Composite substrate, gallium nitride-based element and method for manufacturing same
02/01/2012CN102339795A Method for manufacturing semiconductor devices having a metallisation layer
02/01/2012CN102339788A Method for manufacturing leads of semiconductor device and intraconnection structure
02/01/2012CN102339769A Temporary semiconductor structure bonding methods and related bonded semiconductor structures
02/01/2012CN102339768A Methods of forming bonded semiconductor structures, and semiconductor structures formed by such methods
02/01/2012CN102339767A Semiconductor element and manufacturing method thereof
02/01/2012CN102339763A Method for assembling integrated circuit device
02/01/2012CN102339762A Non-carrier semiconductor packaging part and manufacturing method thereof
02/01/2012CN102339757A Method for manufacturing semiconductor devices having a glass substrate
02/01/2012CN102337104A Ant nest-like heat dissipation material and heat dissipation device prepared from the ant nest-like heat dissipation material
02/01/2012CN102337005A Resin composition, method of its composition, and cured formulation
02/01/2012CN102034785B 一种改进型三极管引线框架 An improved transistor leadframe
02/01/2012CN102030968B 用于半导体器件封装的环氧树脂组合物及其制备方法 The epoxy resin composition for a semiconductor device package and a method for preparing
02/01/2012CN101996861B 电感器的形成方法 The method of forming an inductor
02/01/2012CN101984282B High-power LED street lamp
02/01/2012CN101958289B 半导体组件 Semiconductor Components
02/01/2012CN101950739B 线路基板 Circuit board
02/01/2012CN101943391B 一种led筒灯及其制作方法 One kind of its production methods led downlights
02/01/2012CN101887892B 像素结构及具有此种像素结构的显示面板 Pixel structure having such a pixel structure and a display panel
02/01/2012CN101831142B 树脂组合物、其制造方法及固化物 The resin composition, manufacturing method thereof and a cured product
02/01/2012CN101777555B Nmos场效应晶体管辅助触发的互补型scr结构 Nmos assist trigger a field effect transistor structure complementary scr
02/01/2012CN101752330B 散热冷板与冷冻系统 Cold plate refrigeration systems and heat
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