| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
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| 02/07/2012 | US8110344 Metal photoetching product and production method thereof |
| 02/07/2012 | US8110245 Semiconductor device, mounting substrate and method of manufacturing mounting substrate, circuit board, and electronic instrument |
| 02/07/2012 | DE202012000145U1 Kapillarstruktur eines Vapor-Chamber-Kühlers Capillary of a Vapor Chamber cooler |
| 02/07/2012 | CA2608550C Electronic control unit and process of producing the same |
| 02/07/2012 | CA2460577C Material separation to form segmented product |
| 02/02/2012 | WO2012015755A1 Reinforced wafer-level molding to reduce warpage |
| 02/02/2012 | WO2012015040A1 Component for accommodating electronic component, electronic module, and electronic device |
| 02/02/2012 | WO2012015015A1 Glass ceramic composition, substrate for light-emitting element, and light-emitting device |
| 02/02/2012 | WO2012014853A1 Substrate for light-emitting element, light-emitting device, and method for producing substrate for light-emitting element |
| 02/02/2012 | WO2012014843A1 Power semiconductor unit, power module, production method for power semiconductor unit and production method for power module |
| 02/02/2012 | WO2012014842A1 Power converter |
| 02/02/2012 | WO2012014815A1 Method for abrasion processing of glass substrate for semiconductor chip mounting |
| 02/02/2012 | WO2012014718A1 Method for manufacturing interposer |
| 02/02/2012 | WO2012014717A1 Method for manufacturing semiconductor device |
| 02/02/2012 | WO2012014715A1 Curing resin composition, cured product thereof, phenolic resin, epoxy resin, and semiconductor sealing material |
| 02/02/2012 | WO2012014560A1 Curable composition for semiconductor encapsulation |
| 02/02/2012 | WO2012014527A1 High-frequency module and communications device |
| 02/02/2012 | WO2012014516A1 Led light-emitting device |
| 02/02/2012 | WO2012014382A1 Semiconductor device |
| 02/02/2012 | WO2012013977A1 Compensation for stress induced resistance variations |
| 02/02/2012 | WO2012013514A1 Electronic component and method for producing an electronic component |
| 02/02/2012 | WO2012013431A1 Flip-chip housing for two filter topologies |
| 02/02/2012 | WO2012013416A1 Module and production method |
| 02/02/2012 | WO2012013162A1 Tsv interconnect structure and manufacturing method thereof |
| 02/02/2012 | WO2012013161A1 Water resistant surface mount device package |
| 02/02/2012 | WO2012013061A1 Fuse structure and method for forming the same |
| 02/02/2012 | WO2011127416A3 Improved mechanical support for a thin-film thermoelectric cooling device |
| 02/02/2012 | WO2011126893A3 Apparatuses enabling concurrent communication between an interface die and a plurality of dice stacks, interleaved conductive paths in stacked devices, and methods for forming and operating the same |
| 02/02/2012 | WO2011094319A3 Microfabricated pillar fins for thermal management |
| 02/02/2012 | WO2011069737A4 Circuit device comprising a semiconductor component |
| 02/02/2012 | US20120028582 Methods of operating electronic devices, and methods of providing electronic devices |
| 02/02/2012 | US20120028458 Alpha particle blocking wire structure and method fabricating same |
| 02/02/2012 | US20120025892 Semiconductor integrated circuit device |
| 02/02/2012 | US20120025863 Solder joint inspection |
| 02/02/2012 | US20120025862 Test Structure for ILD Void Testing and Conduct Resistance Measurement in a Semiconductor Device |
| 02/02/2012 | US20120025405 Liquid encapsulating resin composition, semiconductor device using liquid encapsulating resin composition, and method of manufacturing the same |
| 02/02/2012 | US20120025404 Film for flip chip type semiconductor back surface |
| 02/02/2012 | US20120025403 Design apparatus of semiconductor device, design method of semiconductor device, and semiconductor device |
| 02/02/2012 | US20120025402 Methods of forming semiconductor device structures and semiconductor device structures including a uniform pattern of conductive lines |
| 02/02/2012 | US20120025401 Integrated circuit package with voltage distributor |
| 02/02/2012 | US20120025400 Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor device |
| 02/02/2012 | US20120025399 Film for flip chip type semiconductor back surface, and its use |
| 02/02/2012 | US20120025398 Integrated circuit packaging system with package-on-package and method of manufacture thereof |
| 02/02/2012 | US20120025397 Semiconductor Chip Layout |
| 02/02/2012 | US20120025396 Semiconductor device with die stack arrangement including staggered die and efficient wire bonding |
| 02/02/2012 | US20120025395 Semiconductor device and method of manufacturing semiconductor device |
| 02/02/2012 | US20120025394 Semiconductor device |
| 02/02/2012 | US20120025393 Power Semiconductor Module, Method for Producing a Power Semiconductor Module and a Housing Element for a Power Semiconductor Module |
| 02/02/2012 | US20120025392 Increased Stability of a Complex Material Stack in a Semiconductor Device by Providing Fluorine Enriched Interfaces |
| 02/02/2012 | US20120025391 Semiconductor device and multilayer semiconductor device |
| 02/02/2012 | US20120025390 Semiconductor device and method for fabricating the same |
| 02/02/2012 | US20120025389 Hermetic Wafer Level Packaging |
| 02/02/2012 | US20120025388 Three-dimensional integrated circuit structure having improved power and thermal management |
| 02/02/2012 | US20120025387 Chip package and fabricating method thereof |
| 02/02/2012 | US20120025386 Semiconductor memory device and method of manufacturing the same |
| 02/02/2012 | US20120025385 Low Resistance Peripheral Local Interconnect Contacts with Selective Wet Strip of Titanium |
| 02/02/2012 | US20120025384 Electronic device and method for production |
| 02/02/2012 | US20120025383 Integrated circuit structure incorporating a conductor layer with both top surface and sidewall passivation and a method of forming the integrated circuit structure |
| 02/02/2012 | US20120025382 Devices Formed With Dual Damascene Process |
| 02/02/2012 | US20120025381 Semiconductor device and method for fabricating the same |
| 02/02/2012 | US20120025380 Manganese oxide film forming method, semiconductor device manufacturing method and semiconductor device |
| 02/02/2012 | US20120025379 Front-end processing of nickel plated bond pads |
| 02/02/2012 | US20120025378 Solder interconnect on ic chip |
| 02/02/2012 | US20120025377 Semiconductor device and method of designing a wiring of a semiconductor device |
| 02/02/2012 | US20120025376 Ball grid array package |
| 02/02/2012 | US20120025375 Routable array metal integrated circuit package fabricated using partial etching process |
| 02/02/2012 | US20120025374 Integrated circuit packaging system with rounded interconnect |
| 02/02/2012 | US20120025373 Semiconductor Device and Method of Forming Vertically Offset Bond on Trace Interconnects on Different Height Traces |
| 02/02/2012 | US20120025372 Chip having a driving integrated circuit |
| 02/02/2012 | US20120025371 Semiconductor device |
| 02/02/2012 | US20120025370 Semiconductor structure comprising pillar and moisture barrier |
| 02/02/2012 | US20120025369 Semiconductor package |
| 02/02/2012 | US20120025368 Semiconductor Device Cover Mark |
| 02/02/2012 | US20120025367 Semiconductor device |
| 02/02/2012 | US20120025366 Semiconductor device and method for manufacturing the same |
| 02/02/2012 | US20120025365 Microelectronic packages with nanoparticle joining |
| 02/02/2012 | US20120025364 Semiconductor device and method of manufacturing the same |
| 02/02/2012 | US20120025363 Package structure and manufacturing method thereof |
| 02/02/2012 | US20120025362 Reinforced Wafer-Level Molding to Reduce Warpage |
| 02/02/2012 | US20120025361 Semiconductor device, lead frame assembly, and method for fabricating the same |
| 02/02/2012 | US20120025360 Semiconductor encapsulation and method thereof |
| 02/02/2012 | US20120025359 Semiconductor device and method of manufacturing the same |
| 02/02/2012 | US20120025358 Semiconductor element with semiconductor die and lead frames |
| 02/02/2012 | US20120025357 Leadframe for ic package and method of manufacture |
| 02/02/2012 | US20120025356 Semiconductor device packages having electromagnetic interference shielding and related methods |
| 02/02/2012 | US20120025355 Laminated semiconductor substrate, laminated chip package and method of manufacturing the same |
| 02/02/2012 | US20120025354 Laminated semiconductor substrate, laminated chip package and method of manufacturing the same |
| 02/02/2012 | US20120025348 Semiconductor device comprising a passive component of capacitors and process for fabrication |
| 02/02/2012 | US20120025332 Systems and methods for mounting inertial sensors |
| 02/02/2012 | US20120025215 Semiconductor package with heat dissipating structure |
| 02/02/2012 | US20120025204 SEMICONDUCTOR DEVICE HAVING Si-SUBSTRATE AND PROCESS TO FORM THE SAME |
| 02/02/2012 | US20120025188 Semiconductor device integrated with monitoring device in center thereof |
| 02/02/2012 | DE10342295B4 Anordnung eines elektrischen Bauelements mit einer elektrischen Isolationsfolie auf einem Substrat und Verfahren zum Herstellen der Anordnung Arrangement of an electrical component with an electrical insulation film on a substrate and method of manufacturing the arrangement |
| 02/02/2012 | DE102011076879A1 Clamping apparatus for pressing electronic part against cooling body for exhausting waste heat developed during operation of electronic part, has clamping element with centre part engaged at location of cooling body |
| 02/02/2012 | DE102011017543A9 Elektronische Vorrichtung, Verdrahtungsplatine und Verfahren zur Fertigung der elektrischen Vorrichtung An electronic apparatus wiring board and method for manufacturing the electric device |
| 02/02/2012 | DE102011011718B3 Method for producing heat dissipation mass of semiconductor device, involves covering surface of provisional substrate by form of electrical conducting layer |
| 02/02/2012 | DE102010038801A1 Detection device i.e. hot film air mass gauge, for detecting e.g. flow speed of suction air in suction tract of internal combustion engine in motor car, has displacement element reducing volume of material and partially enclosed by material |
| 02/02/2012 | DE102010038746A1 Reduzierte Topographie in Isolationsgebieten eines Halbleiterbauelements durch Anwenden einer Abscheide/Ätzsequenz vor der Herstellung des Zwischenschichtdielektrikums Reduced topography in insulation regions of a semiconductor device by applying a deposition / etch sequence before making the interlayer dielectric |
| 02/02/2012 | DE102010038745A1 Teststruktur für Prüfung von Zwischenschichtdielektrikumshohlräumen und Kontaktwiderstandsmessungen in einem Halbleiterbauelement Test structure for testing of Zwischenschichtdielektrikumshohlräumen and contact resistance measurements in a semiconductor device |
| 02/02/2012 | DE102010038739A1 Erhöhte Stabilität eines komplexen Materialstapels in einem Halbleiterbauelement durch Vorsehen von fluorangereicherten Grenzflächen Increased stability of a complex material stack in a semiconductor device by providing fluorine-enriched boundary surfaces |