Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2012
02/08/2012CN102347282A Semiconductor device comprising a passive component of capacitors and process for fabrication
02/08/2012CN102347277A Semiconductor device structure and manufacturing method thereof
02/08/2012CN102347272A Method of forming rdl and semiconductor device
02/08/2012CN102347269A Fuse structure and method for forming the same
02/08/2012CN102347265A Method for preventing punch through voltage reduction of memory and memory thereof
02/08/2012CN102347253A Semiconductor device and method of forming rdl over contact pad
02/08/2012CN102347252A Bonding structure and method
02/08/2012CN102347250A Forming method and device of bump structure
02/08/2012CN102347246A Method for encapsulating chip with excellent radiating performance
02/08/2012CN102347243A Semiconductor device and method for manufacturing the same
02/08/2012CN102347241A Heat sink device and method of repairing semiconductor device
02/08/2012CN102346165A Sensor device and manufacturing method
02/08/2012CN102344567A Modified bismaleimide resin, preparation method thereof and composition containing resin
02/08/2012CN102005436B 度量衡校准晶圆 Wafer Metrology Calibration
02/08/2012CN101930931B 封装电路基板结构及其制造方法 Package structure and method of manufacturing the circuit substrate,
02/08/2012CN101859752B 具有内嵌式芯片及硅导通孔晶粒之堆栈封装结构及其制造方法 The embedded chip package structure having a silicon vias and the stack and the manufacturing method of the grain
02/08/2012CN101826513B 带有内嵌电容的电阻串分压装置 Voltage dividing resistor string device with embedded capacitor
02/08/2012CN101819957B 晶片封装结构及封装基板 Chip package and the package substrate
02/08/2012CN101819382B 在边缘去除过程中减少晶圆缺陷的方法及晶圆结构 Reducing the edge removal process the wafer and wafer defect of a structural
02/08/2012CN101807603B Vdmos晶体管测试结构 Vdmos transistor test structures
02/08/2012CN101785109B 具有内部稳定性网络的rf晶体管封装以及形成具有内部稳定性网络的rf晶体管封装的方法 Methods rf transistor package with internal stability of the network and the formation of rf transistor package with the internal stability of the network
02/08/2012CN101783314B 形成隔离结构的方法和相应的器件 The method of forming an isolation structure and the corresponding device
02/08/2012CN101752264B 散热型半导体封装结构及其制法 Cooling type semiconductor package structure Jiqizhifa
02/08/2012CN101677102B 具有局部互连的半导体器件 A semiconductor device having a local interconnect
02/08/2012CN101626010B 覆晶薄膜封装结构以及覆晶薄膜封装方法 COF COF packaging structure and method of packaging
02/08/2012CN101614325B 半导体照明装置 Semiconductor lighting device
02/08/2012CN101604684B 导线架的内引脚具有金属焊盘的交错堆叠式芯片封装结构 Staggered stacked chip package within the structure of a metal pin leadframe pad
02/08/2012CN101593768B 显示装置 The display device
02/08/2012CN101593761B 具封胶保护层的感测装置及其制造方法 Sensing device and method of manufacturing a sealed plastic protective layer
02/08/2012CN101582408B 半导体器件和制造半导体器件的方法 A semiconductor device and manufacturing a semiconductor device
02/08/2012CN101573790B 气冷式热装置中的三维散热 Three-dimensional air-cooled heat radiating device
02/08/2012CN101556969B 增强型碳化硅金属半导体场效应晶体管及其制造方法 Reinforced silicon carbide metal-semiconductor field-effect transistor and manufacturing method thereof
02/08/2012CN101515627B 半导体发光装置 The semiconductor light emitting device
02/08/2012CN101501846B 可变形的集成电路装置 The integrated circuit device may be deformable
02/08/2012CN101484991B 集成电路散热装置 IC cooling devices
02/08/2012CN101429278B 包含聚酰亚胺的光学半导体元件封装用树脂以及由该树脂获得的光学半导体器件 The optical semiconductor element encapsulation containing a polyimide resin and an optical semiconductor device obtained from the resin
02/08/2012CN101378057B 金属-绝缘体-金属电容器及其制造方法 Metal - insulator - metal capacitor and a manufacturing method
02/08/2012CN101370352B 一种印刷电路板及其制作方法和球栅阵列焊盘图案 A printed circuit board and its production method and ball grid array landpattern
02/08/2012CN101350319B 用来制作封装半导体器件的方法和系统 Method and system for making a semiconductor device package
02/08/2012CN101320716B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
02/08/2012CN101308799B 布线基板的连接方法及布线基板 Connecting a wiring board and a wiring board
02/08/2012CN101256994B 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
02/08/2012CN101241885B 功率半导体模块 Power semiconductor module
02/08/2012CN101238542B 真空装置 Vacuum device
02/08/2012CN101197390B 有机发光显示设备 The organic light emitting display device
02/08/2012CN101047159B 多层互连基板、半导体装置及阻焊剂 Multilayer interconnect substrate, a semiconductor device and a solder resist
02/07/2012US8111816 Methods and systems for enabling return to same position in a review of messages in a voice mail system using tag or identifier stored in the voice mail system
02/07/2012US8111515 Methods and apparatuses for transferring heat from stacked microfeature devices
02/07/2012US8111095 Temperature compensation for internal inductor resistance
02/07/2012US8110933 Semiconductor device mounted structure and semiconductor device mounted method
02/07/2012US8110932 Semiconductor circuit with amplifier, bond wires and inductance compensating bond wire
02/07/2012US8110931 Wafer and semiconductor package
02/07/2012US8110930 Die backside metallization and surface activated bonding for stacked die packages
02/07/2012US8110929 Semiconductor module
02/07/2012US8110928 Stacked-type chip package structure and method of fabricating the same
02/07/2012US8110927 Explosion-proof module structure for power components, particularly power semiconductor components, and production thereof
02/07/2012US8110926 Redistribution layer power grid
02/07/2012US8110925 Power semiconductor component with metal contact layer and production method therefor
02/07/2012US8110924 Semiconductor device and method for manufacturing same
02/07/2012US8110923 Semiconductor device and method of manufacturing the same
02/07/2012US8110922 Wafer level semiconductor module and method for manufacturing the same
02/07/2012US8110921 Semiconductor package and method of manufacturing the same
02/07/2012US8110920 In-package microelectronic apparatus, and methods of using same
02/07/2012US8110918 Flexible substrate for a semiconductor package, method of manufacturing the same, and semiconductor package including flexible substrate
02/07/2012US8110917 Package substrate with a conductive connecting pin
02/07/2012US8110916 Chip package structure and manufacturing methods thereof
02/07/2012US8110915 Open cavity leadless surface mountable package for high power RF applications
02/07/2012US8110914 Wafer level package with removable chip protecting layer
02/07/2012US8110913 Integrated circuit package system with integral inner lead and paddle
02/07/2012US8110912 Semiconductor device
02/07/2012US8110911 Semiconductor chip package with post electrodes
02/07/2012US8110910 Stack package
02/07/2012US8110909 Semiconductor package including top-surface terminals for mounting another semiconductor package
02/07/2012US8110908 Integrated circuit packaging system using bottom flip chip die bonding and method of manufacture thereof
02/07/2012US8110907 Semiconductor device including first substrate having plurality of wires and a plurality of first electrodes and a second substrate including a semiconductor chip being mounted thereon, and second electrodes connected with first electrodes of first substrate
02/07/2012US8110906 Semiconductor device including isolation layer
02/07/2012US8110905 Integrated circuit packaging system with leadframe interposer and method of manufacture thereof
02/07/2012US8110904 Lead frame for semiconductor device and method of manufacturing of the same
02/07/2012US8110903 QFN package
02/07/2012US8110902 Chip package and manufacturing method thereof
02/07/2012US8110899 Method for incorporating existing silicon die into 3D integrated stack
02/07/2012US8110894 Protection for an integrated circuit chip containing confidential data
02/07/2012US8110893 Semiconductor device mounted with fuse memory
02/07/2012US8110892 Semiconductor device having a plurality of repair fuse units
02/07/2012US8110888 Edge termination for high voltage semiconductor device
02/07/2012US8110878 Semiconductor device having a plurality of shallow wells
02/07/2012US8110876 System for ESD protection with extra headroom in relatively low supply voltage integrated circuits
02/07/2012US8110875 Structure for charge dissipation during fabrication of integrated circuits and isolation thereof
02/07/2012US8110856 Solid-state imaging device and method for manufacturing the same
02/07/2012US8110855 Offset geometries for area reduction in memory arrays
02/07/2012US8110775 Systems and methods for distinguishing reflections of multiple laser beams for calibration for semiconductor structure processing
02/07/2012US8110755 Package for an optical device
02/07/2012US8110750 Multilayer printed wiring board
02/07/2012US8110748 Wiring, display device and method of manufacturing the same
02/07/2012US8110495 Multilayer wiring structure of semiconductor device, method of producing said multilayer wiring structure and semiconductor device to be used for reliability evaluation
02/07/2012US8110477 Semiconductor device and method of forming high-frequency circuit structure and method thereof
02/07/2012US8110462 Reduced finger end MOSFET breakdown voltage (BV) for electrostatic discharge (ESD) protection
02/07/2012US8110441 Method of electrically connecting a shielding layer to ground through a conductive via disposed in peripheral region around semiconductor die
02/07/2012US8110440 Semiconductor device and method of forming overlapping semiconductor die with coplanar vertical interconnect structure
02/07/2012US8110437 Method for attaching a semiconductor chip in a plastic encapsulant, optoelectronic semiconductor component and method for the production thereof
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