Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2012
02/09/2012DE102010061647A1 Elektronische Vorrichtung, die bei niedriger Umgebungstemperatur in Betrieb genommen werden kann, und Verfahren zur Inbetriebnahme der elektronischen Vorrichtung An electronic device, which can be taken into operation at low ambient temperatures, and methods of start-up of the electronic device
02/09/2012DE102010039063A1 Sensormodul mit einem elektromagnetisch abgeschirmten elektrischen Bauteil Sensor module with an electromagnetically shielded electrical component
02/09/2012DE102010033551A1 Verfahren zur Herstellung einer Mehrzahl von elektronischen Bauelementen mit elektromagnetischer Schirmung und elektronisches Bauelement mit elektromagnetischer Schirmung A method of manufacturing a plurality of electronic components with electromagnetic shielding and electromagnetic shielding electronic component with
02/09/2012DE102010033374A1 Einrichtung zur elektrischen Verbindung einer Leistungsbaugruppe mit Terminalflächenelementen Means for electrically connecting a power module with the terminal surface elements
02/09/2012DE102010033284A1 Method for producing arrangement of electronic component e.g. microelectro mechanical system (MEMS) chip, involves partially removing support elements, such that supporting elements are in non-contact state with respect to component
02/09/2012DE102008049726B4 Gestapelte Chipkonfiguration mit stromgespeistem Wärmeübertragungssystem und Verfahren zum Steuern der Temperatur in einem Halbleiterbauelement Stacked chip configuration with stromgespeistem heat transfer system and method for controlling the temperature in a semiconductor device
02/09/2012DE102007013737B4 Verfahren zur Herstellung eines Substrats mit Substratkern für eine elektronische Baugruppe A method for producing a substrate with substrate core for an electronic assembly
02/09/2012DE102006057352B4 Halbleitervorrichtungen und Verfahren zu ihrer Herstellung Semiconductor devices and processes for their preparation
02/09/2012DE102005056872B4 Mehrchipmodul mit Leistungssystem und Durchgangslöchern Multi-chip module with a power system and through holes
02/09/2012DE102005008750B4 Struktur zum Enthalten von Trocknungsmitteln, Verfahren zum Herstellen und Verwendung der Struktur Structure for containing drying agents, methods of making and using the structure
02/09/2012DE102004044946B4 Verfahren zum Trennen eines Halbleiterwafers A method for separating a semiconductor wafer
02/09/2012CA2806689A1 Vertical capacitors formed on semiconducting substrates
02/08/2012EP2416632A1 Circuit substrate and manufacturing method thereof
02/08/2012EP2416459A1 Semiconductor laser apparatus
02/08/2012EP2416358A2 Electronic device and method for fabricating the same, spiral inductor device and method for fabricating the same
02/08/2012EP2416357A2 Methods of forming a thermal conduction region in a semiconductor structure and structures resulting therefrom
02/08/2012EP2416356A1 Process for producing metallized substrate and metallized substrate
02/08/2012EP2416355A1 Circuit board
02/08/2012EP2416348A1 Patterning method
02/08/2012EP2416064A1 Electric signal switch assembly, preferably electric signal light assembly
02/08/2012EP2415728A1 Sintered ceramic and substrate comprising same for semiconductor device
02/08/2012EP2415592A1 Film for resin spacer, light-receiving device and method for manufacturing same, and mems device and method for manufacturing same
02/08/2012EP2415332A2 Conductor structural element and method for producing a conductor structural element
02/08/2012EP2415076A2 Pressure support for an electronic circuit
02/08/2012EP2414304A1 Metal/ceramic substrate
02/08/2012EP2165362B1 Low resistance through-wafer via
02/08/2012EP1964034B1 Electrical device manufacturing techniques
02/08/2012EP1959493B1 Process for producing electronic part, process for producing heat conducting member, and method of mounting heat conducting member for electronic part
02/08/2012EP1826227B1 Thermosetting epoxy resin composition and use thereof
02/08/2012EP1157420B1 Light extractor apparatus
02/08/2012CN202142525U Novel power module without base plate
02/08/2012CN202142524U 改进型三极管引线框架 Improved triode leadframe
02/08/2012CN202142523U 改进型半导体焊脚结构 Improved semiconductor fillet structure
02/08/2012CN202142522U 圆片级盲孔互联结构 Wafer-level interconnection structure blind hole
02/08/2012CN202142521U 组合式大功率半导体芯片 Modular high-power semiconductor chip
02/08/2012CN202142520U 导流结构 Diversion Structure
02/08/2012CN202142519U 薄型热板结构 Thin hot plate structure
02/08/2012CN202142518U 折叠翅片式散热器 Folded fin heat sink
02/08/2012CN202142517U 半导体散热封装结构 Cooling semiconductor package structure
02/08/2012CN202142516U 汽车整体式调节器 Cars monolithic regulator
02/08/2012CN202142515U 芯片保护框 Chip protection box
02/08/2012CN1949500B 配线板、半导体器件及制造配线板和半导体器件的方法 The method of wiring board, a semiconductor device and manufacturing wiring board and a semiconductor device
02/08/2012CN1848435B 具有更高可靠性的熔丝微调电路 With higher reliability fuse trimming circuit
02/08/2012CN102349363A Power semiconductor module having layered insulating side walls
02/08/2012CN102349362A Electronic component mounting method and electronic component mounting structure
02/08/2012CN102349233A Amplifier component comprising a compensation element
02/08/2012CN102349158A Method for manufacturing semiconductor device
02/08/2012CN102349153A Lead frame and method for manufacturing the same
02/08/2012CN102349152A Ebullient cooling device
02/08/2012CN102349151A Thermally conductive foam product
02/08/2012CN102349150A Semiconductor-based submount with electrically conductive feed-throughs
02/08/2012CN102349138A Method for forming cvd-ru film and method for manufacturing semiconductor devices
02/08/2012CN102348830A Method for forming cu film, and storage medium
02/08/2012CN102348736A Semiconductor-sealing resin composition and semiconductor device
02/08/2012CN102348364A Cooling device
02/08/2012CN102348332A Circuit device and method of manufacturing the same
02/08/2012CN102348328A Chip embedding method and chip-embedded circuit board
02/08/2012CN102348324A Electronic module with feed through conductor between wiring patterns
02/08/2012CN102347429A Lighting device, cooling heat-dissipation system and cooling module thereof
02/08/2012CN102347367A Structure of radiation-resistant MOS (Metal Oxide Semiconductor) device based on partially-consumed type SOI (Silicon-On-Insulator) process
02/08/2012CN102347358A Semiconductor device structure and manufacturing method thereof
02/08/2012CN102347325A Integrated light-emitting device and manufacturing device thereof
02/08/2012CN102347321A Sub-module and power semiconductor module
02/08/2012CN102347320A 装置及其制造方法 Apparatus and manufacturing method thereof
02/08/2012CN102347319A Package-on-package structures with reduced bump bridging
02/08/2012CN102347317A 半导体装置 Semiconductor device
02/08/2012CN102347316A Three-dimensional integrated circuit structure
02/08/2012CN102347315A Ceramic electronic component and wiring board
02/08/2012CN102347314A Semiconductor device for driving electric motor
02/08/2012CN102347313A Packaging structure for integrated circuit chip
02/08/2012CN102347312A Semiconductor device cover mark
02/08/2012CN102347311A Semiconductor device and a manufacturing method therefor
02/08/2012CN102347310A Semiconductor device and method of driving the same
02/08/2012CN102347309A Electric fuse structure and formation method thereof
02/08/2012CN102347308A 电路装置 Circuit means
02/08/2012CN102347307A Circuit board and manufacturing method thereof, circuit device and manufacturing method thereof, and conductive foil provided with insulating layer
02/08/2012CN102347306A Semiconductor package having dimpled plate interconnections
02/08/2012CN102347305A Array structure of lead frame
02/08/2012CN102347304A Leadless chip carrier with improved installability
02/08/2012CN102347303A Packaging body formed by piling multiple chips and manufacturing method thereof
02/08/2012CN102347302A Semiconductor device and method of designing a wiring of a semiconductor device
02/08/2012CN102347301A System and method of chip package build-up
02/08/2012CN102347300A Chip package and fabricating method thereof
02/08/2012CN102347299A Wafer level chip scale package
02/08/2012CN102347298A Bump structure on substrate and forming method of bump structure
02/08/2012CN102347297A Packaging structure for a plurality of small-size chips
02/08/2012CN102347296A Ceramic chip assembly
02/08/2012CN102347295A Power semiconductor module and method for producing same
02/08/2012CN102347294A Semiconductor device
02/08/2012CN102347293A Chip packaging structure with good heat radiation performance
02/08/2012CN102347292A Novel chip packaging structure
02/08/2012CN102347291A Semiconductor device and method of manufacturing same
02/08/2012CN102347290A Chip packaging structure with good heat dispersion property
02/08/2012CN102347289A Power conductor module having at least one positioning apparatus for substrate
02/08/2012CN102347288A 集成电路装置 The integrated circuit device
02/08/2012CN102347287A Multilayer wiring substrate
02/08/2012CN102347286A Anti-interference chip packaging structure
02/08/2012CN102347285A Tape carrier substrate
02/08/2012CN102347284A Semiconductor element and forming method
02/08/2012CN102347283A Microelectronic elements having metallic pads overlying vias
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