Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2012
02/14/2012US8115297 Substrate structure with die embedded inside and dual build-up layers over both side surfaces and method of the same
02/14/2012US8115296 Electronic device package
02/14/2012US8115295 Semiconductor device
02/14/2012US8115294 Multichip module with improved system carrier
02/14/2012US8115292 Interposer for semiconductor package
02/14/2012US8115291 Semiconductor package
02/14/2012US8115290 Storage medium and semiconductor package
02/14/2012US8115289 Onboard electric power control device
02/14/2012US8115288 Lead frame for semiconductor device
02/14/2012US8115287 Integrated circuit packaging system with dual row lead-frame having top and bottom terminals and method of manufacture thereof
02/14/2012US8115286 Integrated sensor including sensing and processing die mounted on opposite sides of package substrate
02/14/2012US8115284 Electronic component and semiconductor device, method of making the same and method of mounting the same, circuit board and electronic instrument
02/14/2012US8115283 Reversible top/bottom MEMS package
02/14/2012US8115270 Electrostatic discharge protection method and device for semiconductor device including an electrostatic discharge protection element providing a discharge path of a surge current
02/14/2012US8115269 Integrated circuit package having reduced interconnects
02/14/2012US8115266 MEMS device having a movable electrode
02/14/2012US8115241 Solid state imaging apparatus and method for fabricating the same
02/14/2012US8115202 Thin film transistor array substrate and electronic ink display device
02/14/2012US8115099 Industrial automation input output module with elastomeric sealing
02/14/2012US8114785 Electrical passivation of silicon-containing surfaces using organic layers
02/14/2012US8114714 Electronic device and production method thereof
02/14/2012US8114711 Method of electrically connecting a microelectronic component
02/14/2012US8114708 System and method for pre-patterned embedded chip build-up
02/14/2012US8114518 Single-walled carbon nanotube and aligned single-walled carbon nanotube bulk structure, and their production process, production apparatus and application use
02/14/2012CA2470229C Method for making a non-detachable microcircuit card
02/14/2012CA1341626C Devices and systems based on novel superconducting material
02/09/2012WO2012019173A1 Systems and methods for heat dissipation using thermal conduits
02/09/2012WO2012018701A1 Vertical capacitors formed on semiconducting substrates
02/09/2012WO2012018684A1 Encapsulating resin composition
02/09/2012WO2012018471A1 Systems and methods of coupling digitizing sensors to a structure
02/09/2012WO2012018415A1 Air through-silicon via structure
02/09/2012WO2012017888A1 Electronic component manufacturing method and electronic component
02/09/2012WO2012017725A1 Substrate module for having heat generating source mounted thereon, and lighting device
02/09/2012WO2012017584A1 Thin film transistor substrate
02/09/2012WO2012017576A1 Solid-state image pickup device
02/09/2012WO2012017571A1 Functional particle, group of functional particles, filler, resin composition for electronic part, electronic part, and semiconductor device
02/09/2012WO2012017507A1 Circuit board and method for manufacturing same
02/09/2012WO2012016460A1 Microwave and millimeter wave circuit
02/09/2012WO2011098187A3 Semiconductor component and corresponding production method
02/09/2012US20120033810 Authentication of integrated circuits
02/09/2012US20120032693 Crack detection in a semiconductor die and package
02/09/2012US20120032357 Semiconductor package and method of manufacturing the same
02/09/2012US20120032356 Production of high alignment marks and such alignment marks on a semiconductor wafer
02/09/2012US20120032355 Encapsulation film, package structure utilizing the same, and method for forming the package structure
02/09/2012US20120032354 Wirebonding method and device enabling high-speed reverse wedge bonding of wire bonds
02/09/2012US20120032353 Semiconductor device
02/09/2012US20120032352 Side wettable plating for semiconductor chip package
02/09/2012US20120032351 Semiconductor package
02/09/2012US20120032350 Systems and Methods for Heat Dissipation Using Thermal Conduits
02/09/2012US20120032349 Method of fabricating stacked assembly including plurality of stacked microelectronic elements
02/09/2012US20120032348 Three-dimensional integrated circuits with protection layers
02/09/2012US20120032347 Chip scale package and fabrication method thereof
02/09/2012US20120032346 Environment-resistant module, micropackage and methods of manufacturing same
02/09/2012US20120032345 Multilayer circuit
02/09/2012US20120032344 Semiconductor device and method of manufacturing semiconductor device
02/09/2012US20120032343 Package substrate for bump on trace interconnection
02/09/2012US20120032342 Semiconductor package for selecting semiconductor chip from a chip stack
02/09/2012US20120032341 Semiconductor package and manufacturing method thereof
02/09/2012US20120032340 Semiconductor Die and Method of Forming FO-WLCSP Vertical Interconnect Using TSV and TMV
02/09/2012US20120032339 Integrated circuit structure with through via for heat evacuating
02/09/2012US20120032338 Semiconductor device and method for fabricating the same
02/09/2012US20120032337 Flip Chip Substrate Package Assembly and Process for Making Same
02/09/2012US20120032336 Self-aligned permanent on-chip interconnect structure formed by pitch splitting
02/09/2012US20120032335 Electronic component and method for manufacturing the same
02/09/2012US20120032334 Soft error rate (ser) reduction in advanced silicon processes
02/09/2012US20120032333 Semiconductor device and method of manufacturing the same
02/09/2012US20120032331 Circuit substrate and manufacturing method thereof and package structure and manufacturing method thereof
02/09/2012US20120032330 Mitigation of plating stub resonance by controlling surface roughness
02/09/2012US20120032329 Semiconductor integrated circuit device
02/09/2012US20120032328 Package structure with underfilling material and packaging method thereof
02/09/2012US20120032327 Systems and methods for reinforcing chip packages
02/09/2012US20120032326 Air through-silicon via structure
02/09/2012US20120032325 Semiconductor device
02/09/2012US20120032324 Semiconductor device
02/09/2012US20120032323 Semiconductor device and method of manufacturing the same
02/09/2012US20120032322 Flip chip package utilizing trace bump trace interconnection
02/09/2012US20120032321 Electrical Contact Alignment Posts
02/09/2012US20120032320 Flexible micro-system and fabrication method thereof
02/09/2012US20120032319 High-voltage packaged device
02/09/2012US20120032317 Self-Aligning Structures and Method for Integrated Chips
02/09/2012US20120032316 Semiconductor device, method of manufacturing semiconductor device, mold, and sealing device
02/09/2012US20120032315 Integrated circuit packaging system with die paddle and method of manufacture thereof
02/09/2012US20120032314 Package-on-package with fan-out wlcsp
02/09/2012US20120032311 Multi component dielectric layer
02/09/2012US20120032296 Semiconductor device, semiconductor circuit substrate, and method of manufacturing semiconductor circuit substrate
02/09/2012US20120032256 Semiconductor device and method of forming the same
02/09/2012US20120032205 Microdisplay packaging system
02/09/2012US20120032190 Package and fabrication method of the same
02/09/2012US20120032189 Organopolysiloxane composition and semiconductor apparatus
02/09/2012US20120032167 Semiconductor package and method of testing same
02/09/2012US20120032145 Detection device, light-receiving element array, semiconductor chip, method for manufacturing the same, and optical sensor apparatus
02/09/2012US20120031862 Folding mount for photovoltaic modules
02/09/2012US20120031859 Adjustable tilt solar panel support system
02/09/2012US20120031590 Indoor unit of air conditioning apparatus
02/09/2012US20120031472 Support for Photovoltaic Module and Photovoltaic Module
02/09/2012US20120031470 Solar panel configurations
02/09/2012US20120031469 Support for mounting a solar panel
02/09/2012DE10215104B4 Drucksensor, bei welchem ein Harzhaftmittel zwischen einem Halbleiter-Sensorelement und einem Metallschaft verwendet wird Pressure sensor is used in which a resin adhesive between a semiconductor sensor element and a metal shaft
02/09/2012DE102011109295A1 Providing semiconductor chip package with solder wettable plating, comprises separating chip package, immersing in bath, contacting connecting contact pad with conductive contact material connected to cathode electrical, and plating
02/09/2012DE102011002534A1 Chippaket umfassend eine Vielzahl von Chips und Leiterausrichtung Chip package comprising a plurality of chips and circuit alignment
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