| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/16/2012 | US20120036717 Photovoltaic module ground mount |
| 02/16/2012 | US20120036710 Overmolded electronic module with an integrated electromagnetic shield using smt shield wall components |
| 02/16/2012 | DE112008002480T5 Mikroelektronisches Bauelement und Verfahren zu seiner Bildung Microelectronic device and method for its formation |
| 02/16/2012 | DE112005000504B4 Mehrschichtüberlagerungsmessungs- und Korrekturtechnik für die IC-Herstellung Mehrschichtüberlagerungsmessungs- and correction technique for the IC fabrication |
| 02/16/2012 | DE102011080707A1 Integrierte Niederleistungs-Hochspannungsschaltungen Integrated low-power high-voltage circuits |
| 02/16/2012 | DE102011079232A1 Struktur und verfahren zur anordnung eines schwingungsisolierten targets Structure and process for the formation of a vibration-isolated targets |
| 02/16/2012 | DE102011076235A1 Leistungshalbleitervorrichtung Power semiconductor device |
| 02/16/2012 | DE102010039330A1 Verfahren zum Herstellen einer elektrischen Durchkontaktierung in einem Substrat sowie Substrat mit einer elektrischen Durchkontaktierung A method of making an electrical plated-through hole in a substrate as well as substrate to an electrical through-contact |
| 02/16/2012 | DE102010039298A1 Verfahren zum Füllen von Hohlräumen in Wafern, entsprechend gefülltes Sackloch und Wafer mit entsprechend gefüllten Isolationsgräben A method for filling cavities in wafers, according blind hole and filled wafer with corresponding filled isolation trenches |
| 02/16/2012 | DE102010039258A1 Transistorbauelement mit reduziertem Kurzschlussstrom Transistor device with reduced short-circuit current |
| 02/16/2012 | DE102010039156A1 Verfahren zum Herstellen einer elektrischen Schaltung und elektrische Schaltung A method of manufacturing an electrical circuit and electrical circuit |
| 02/16/2012 | DE102010039118A1 Steuermodul, insbesondere Getriebe- oder Motorsteuermodul für ein Kraftfahrzeug Control module, in particular transmission or engine control module for a motor vehicle |
| 02/16/2012 | DE102010034431A1 Bauelement mit geschützten Bauelementstrukturen und Verfahren zur Herstellung Component having protected device structures and processes for making |
| 02/16/2012 | DE102010033963A1 Optoelektronisches Bauelement und Verfahren zur Herstellung eines optoelektronischen Bauelements Optoelectronic component and process for producing an optoelectronic component |
| 02/16/2012 | DE102010033868A1 Chipträger, elektronisches Bauelement mit Chipträger und Verfahren zur Herstellung eines Chipträgers Chip carrier, electronic device with chip carrier and method for producing a chip carrier |
| 02/16/2012 | DE102009044712B4 Halbleiter-Bauelement Semiconductor component |
| 02/16/2012 | DE102008026135B4 Steuerung für tiefe Temperaturen in einem Halbleiterbauelement Control for low temperatures in a semiconductor device |
| 02/16/2012 | DE102007038937B4 Baugruppenanordnung Assembly arrangement |
| 02/15/2012 | EP2418923A1 Thermal expansion suppressing member and anti-thermally-expansive member |
| 02/15/2012 | EP2418679A2 Control module, in particular gear or motor control module for a motor vehicle |
| 02/15/2012 | EP2418587A1 High performance sub-system design & assembly |
| 02/15/2012 | EP2418254A1 Curable fluorine-containing polyether composition |
| 02/15/2012 | EP2417843A2 Low stress-inducing heat sink |
| 02/15/2012 | EP2417842A1 Conductor grid for electronic housings and manufacturing method |
| 02/15/2012 | EP2305013B1 Electronic assembly and method for the production thereof |
| 02/15/2012 | EP1576667B1 Poly-silicon stringer fuse |
| 02/15/2012 | CN1996582B 包含多层内连线结构的载板及其制造、回收以及应用方法 Contained within a multilayer wiring structure of the carrier board and a manufacturing, recycling and application methods |
| 02/15/2012 | CN102356703A Circuit board and mother laminated body |
| 02/15/2012 | CN102356462A Method for manufacturing substrate for semiconductor element, and semiconductor device |
| 02/15/2012 | CN102356461A Semiconductor device, method for manufacturing same, electronic device and electronic component |
| 02/15/2012 | CN102356170A A method for the removal of hydrogen from a hydrogen sensitive device by means of a non-evaporable yttrium based getter alloy |
| 02/15/2012 | CN102356109A Inclusion complex, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor |
| 02/15/2012 | CN102356088A Process for production of phosphorus-atom-containing phenol, novel phosphorus-atom-containing phenol, curable resin composition, cured product thereof, printed circuit board, and semiconductor sealing material |
| 02/15/2012 | CN102356014A Heat sink |
| 02/15/2012 | CN102355793A Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device |
| 02/15/2012 | CN102355223A Single-chip GSM (Global System for Mobile Communications) radio-frequency antenna switch module and GSM radio-frequency front end |
| 02/15/2012 | CN102354692A Wafer and a method of dicing a wafer |
| 02/15/2012 | CN102354691A Quad flat non-lead (QFN) package with high density and manufacturing method |
| 02/15/2012 | CN102354690A Multi-chip module for battery power control |
| 02/15/2012 | CN102354689A Quad flat non-lead (QFN) package with leads arranged in plane array and manufacturing method |
| 02/15/2012 | CN102354688A Power module |
| 02/15/2012 | CN102354687A Barrier medium material used for thick film circuit and preparation method thereof |
| 02/15/2012 | CN102354519A 3D semiconductor device |
| 02/15/2012 | CN102352090A Flame retarded epoxy resin composite material |
| 02/15/2012 | CN101930954B Radiating structure for SOI field effect transistor |
| 02/15/2012 | CN101894828B 具有测试焊垫的硅晶圆及其测试方法 With a silicon wafer and method of test pads |
| 02/15/2012 | CN101853819B 芯片制作工艺 Chip production process |
| 02/15/2012 | CN101821431B 连接器制造方法和通过该方法制造的连接器 Connector manufacturing methods and connectors manufactured by the method of |
| 02/15/2012 | CN101789380B 内埋芯片封装的结构及工艺 Structure and Process buried chip package |
| 02/15/2012 | CN101752345B 半导体器件p2id和sm的测试结构 Test structure of semiconductor devices p2id and sm |
| 02/15/2012 | CN101752335B 半导体装置以及半导体装置的制造方法 The method of manufacturing a semiconductor device and a semiconductor device |
| 02/15/2012 | CN101740409B 一种二极管引线烧焊方法及二极管 Welding method leads to a diode and diode |
| 02/15/2012 | CN101728397B 主动元件阵列基板及其检测方法 Active device array substrate and detection methods |
| 02/15/2012 | CN101728362B 三维集成电路的堆叠接合界面结构 Stacking bonding interface structure of three-dimensional integrated circuits |
| 02/15/2012 | CN101710471B 显示装置 The display device |
| 02/15/2012 | CN101657897B 制造具有应用于微电子封装的导电构件的元件的方法 The method of manufacturing a microelectronic package having electrically conductive element is applied to the member |
| 02/15/2012 | CN101656236B 副安装座及其制造方法 Submount and its manufacturing method |
| 02/15/2012 | CN101621061B 半导体装置 Semiconductor device |
| 02/15/2012 | CN101604702B 有机电子器件的垂直互连 Vertical interconnects organic electronic devices |
| 02/15/2012 | CN101577237B 包括第一和第二支座的半导体装置和方法 Includes a semiconductor device and a method of the first and second bearing |
| 02/15/2012 | CN101548589B 发热体冷却构造以及驱动装置 The heat generator cooling structure and a driving means |
| 02/15/2012 | CN101506970B 减小基片与基片上的凸出电极之间的应力 Reduce stress protruding electrode substrate and between the substrate |
| 02/15/2012 | CN101500392B 电子装置及其散热风扇模块 Electronic device and cooling fan modules |
| 02/15/2012 | CN101457918B 液冷led灯 Liquid Cooled led lights |
| 02/15/2012 | CN101399243B 半导体封装及半导体封装的制造方法 The method of manufacturing a semiconductor package and a semiconductor package |
| 02/15/2012 | CN101303984B 半导体装置的制造方法 The method of manufacturing a semiconductor device |
| 02/15/2012 | CN101266968B 发光装置和制造该种发光装置的方法 A light emitting device and a method for manufacturing the luminescent device |
| 02/15/2012 | CN101233619B 微电子部件的封装及其制造方法 Package and method for manufacturing microelectronic components |
| 02/15/2012 | CN101091313B 电子部件封装结构 Electronic parts packaging structure |
| 02/15/2012 | CN101066001B 布线基板及其制造方法以及半导体器件 Wiring board and its manufacturing method and a semiconductor device |
| 02/15/2012 | CN101026135B 具有斜面鳍片的散热器 Radiator fin with a slant |
| 02/14/2012 | US8116091 Printed circuit board |
| 02/14/2012 | US8116088 Semiconductor package and method of forming the same, and printed circuit board |
| 02/14/2012 | US8115326 Flexible substrates having a thin-film barrier |
| 02/14/2012 | US8115325 Semiconductor integrated circuit including plurality of bonding pads |
| 02/14/2012 | US8115323 Semiconductor package and method of manufacturing the semiconductor package |
| 02/14/2012 | US8115321 Separate probe and bond regions of an integrated circuit |
| 02/14/2012 | US8115320 Bond pad structure located over active circuit structure |
| 02/14/2012 | US8115319 Flip chip package maintaining alignment during soldering |
| 02/14/2012 | US8115318 Semiconductor device having silicon-diffused metal wiring layer and its manufacturing method |
| 02/14/2012 | US8115317 Semiconductor device including electrode structure with first and second openings and manufacturing method thereof |
| 02/14/2012 | US8115316 Packaging board, semiconductor module, and portable apparatus |
| 02/14/2012 | US8115315 Semiconductor chips having redistributed power/ground lines directly connected to power/ground lines of internal circuits and methods of fabricating the same |
| 02/14/2012 | US8115314 Deep contacts of integrated electronic devices based on regions implanted through trenches |
| 02/14/2012 | US8115313 Method to form an interconnect |
| 02/14/2012 | US8115312 Semiconductor device having a through electrode |
| 02/14/2012 | US8115311 Wiring structure in a semiconductor device |
| 02/14/2012 | US8115310 Copper pillar bonding for fine pitch flip chip devices |
| 02/14/2012 | US8115309 Semiconductor device |
| 02/14/2012 | US8115308 Microelectronic assemblies having compliancy and methods therefor |
| 02/14/2012 | US8115307 Embedding device in substrate cavity |
| 02/14/2012 | US8115306 Apparatus and method for packaging circuits |
| 02/14/2012 | US8115305 Integrated circuit package system with thin profile |
| 02/14/2012 | US8115304 Method of implementing a discrete element in an integrated circuit |
| 02/14/2012 | US8115303 Semiconductor package structures having liquid coolers integrated with first level chip package modules |
| 02/14/2012 | US8115302 Electronic module with carrier substrates, multiple integrated circuit (IC) chips and microchannel cooling device |
| 02/14/2012 | US8115301 Methods for manufacturing thermally enhanced flip-chip ball grid arrays |
| 02/14/2012 | US8115300 Wiring substrate and manufacturing method thereof, and semiconductor apparatus |
| 02/14/2012 | US8115299 Semiconductor device, lead frame and method of manufacturing semiconductor device |
| 02/14/2012 | US8115298 Semiconductor device |