Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2012
02/21/2012US8120159 Semiconductor integrated circuit, manufacturing method thereof, and semiconductor device using semiconductor integrated circuit
02/21/2012US8120158 Laminate electronic device
02/21/2012US8120157 Printed wiring board structure, electronic component mounting method and electronic apparatus
02/21/2012US8120156 Integrated circuit package system with die on base package
02/21/2012US8120155 Reduced stiction and mechanical memory in MEMS devices
02/21/2012US8120154 Interconnection of lead frame to die utilizing flip chip process
02/21/2012US8120153 High-temperature, wirebondless, injection-molded, ultra-compact hybrid power module
02/21/2012US8120152 Advanced quad flat no lead chip package having marking and corner lead features and manufacturing methods thereof
02/21/2012US8120150 Integrated circuit package system with dual connectivity
02/21/2012US8120149 Integrated circuit package system
02/21/2012US8120148 Package structure with embedded die and method of fabricating the same
02/21/2012US8120146 Protected semiconductor device and method of manufacturing thereof
02/21/2012US8120138 High-Z structure and method for co-alignment of mixed optical and electron beam lithographic fabrication levels
02/21/2012US8120123 Semiconductor device and method of forming the same
02/21/2012US8120114 Transistor having an etch stop layer including a metal compound that is selectively formed over a metal gate
02/21/2012US8120112 Method and apparatus for improving triggering uniformity of snapback electrostatic discharge protection devices
02/21/2012US8120104 Semiconductor device and method of manufacturing semiconductor device
02/21/2012US8120102 Semiconductor device
02/21/2012US8120052 Flip chip type LED lighting device manufacturing method
02/21/2012US8120031 Display device including an opening formed in a gate insulating film, a passivation film, and a barrier film
02/21/2012US8120026 Testing wiring structure and method for forming the same
02/21/2012US8120024 Semiconductor package having test pads on top and bottom substrate surfaces and method of testing same
02/21/2012US8120017 Organic light emitting display and method of manufacturing the same
02/21/2012US8119992 System for overlay measurement in semiconductor manufacturing
02/21/2012US8119920 Multilayer printed wiring board
02/21/2012US8119737 Adhesive composition, process for producing the same, adhesive film using the same, substrate for mounting semiconductor and semiconductor device
02/21/2012US8119534 Semiconductor light emitting device with protrusions to improve external efficiency and crystal growth
02/21/2012US8119533 Pattern formation in semiconductor fabrication
02/21/2012US8119518 Noble metal barrier for fluorine-doped carbon films
02/21/2012US8119516 Bump structure formed from using removable mandrel
02/21/2012US8119495 Method of manufacturing a semiconductor device having an active region and dummy patterns
02/21/2012US8119493 Method of forming a semiconductor device an alignment mark formed in a groove
02/21/2012US8119456 Bond pad for wafer and package for CMOS imager
02/21/2012US8119455 Wafer level package fabrication method
02/21/2012US8119447 Integrated circuit packaging system with through via die having pedestal and recess and method of manufacture thereof
02/21/2012US8119446 Integrated chip package structure using metal substrate and method of manufacturing the same
02/21/2012US8119322 Method for producing self-aligned mask, articles produced by same and composition for same
02/21/2012US8119249 Silicone resin composition
02/21/2012US8117742 Fabrication method of semiconductor integrated circuit device
02/20/2012DE202012000392U1 Thermoelektrisches LED-Lampenmodul Thermoelectric LED lamp module
02/16/2012WO2012021641A2 Stitch bump stacking design for overall package size reduction for multiple stack
02/16/2012WO2012021310A1 Disaggregated semiconductor chip assembly and packaging technique
02/16/2012WO2012020730A1 Epoxy silicone condensate, curable composition comprising epoxy silicone condensate, and cured product thereof
02/16/2012WO2012020689A1 Method of manufacturing semiconductor device and semiconductor device
02/16/2012WO2012020688A1 Low moisture permeability resin composition and hardened material thereof
02/16/2012WO2012020625A1 Curable resin composition and cured article thereof
02/16/2012WO2012020064A1 Packaging an integrated circuit die
02/16/2012WO2012019867A1 Chip carrier, electronic component having a chip carrier, and method for producing a chip carrier
02/16/2012WO2012005435A9 Manufacturing method of chip package and chip package manufactured using the same
02/16/2012WO2011162470A3 Diode package having improved lead wire and manufacturing method therefor
02/16/2012WO2011130748A3 Heat transporting unit, electronic circuit board and electronic device
02/16/2012WO2010133227A3 A pump housing for an electromagnetic pump
02/16/2012US20120040166 Composite Material, Method of Manufacturing and Device for Moldable Calibration
02/16/2012US20120038067 Encapsulation methods for organic electrical devices
02/16/2012US20120038066 Encapsulation methods and dielectric layers for organic electrical devices
02/16/2012US20120038065 Method for Producing an Electrical Circuit and Electrical Circuit
02/16/2012US20120038064 Semiconductor Device and Method of Forming Wafer-Level Multi-Row Etched Leadframe With Base Leads and Embedded Semiconductor Die
02/16/2012US20120038063 Repairable semiconductor device and method
02/16/2012US20120038062 Stacked semiconductor package and stacking method thereof
02/16/2012US20120038061 Semiconductor chip with offset pads
02/16/2012US20120038060 Stacking method and stacking carrier
02/16/2012US20120038059 Stitch bump stacking design for overall package size reduction for multiple stack
02/16/2012US20120038058 Vertically contacted electronic component and method for producing same
02/16/2012US20120038057 Thermal enhancement for multi-layer semiconductor stacks
02/16/2012US20120038056 Interconnect structure for improved time dependent dielectric breakdown
02/16/2012US20120038055 Power and ground routing of integrated circuit devices with improved ir drop and chip performance
02/16/2012US20120038054 Impedance controlled electrical interconnection employing meta-materials
02/16/2012US20120038053 Semiconductor Device and Method of Forming FO-WLCSP Having Conductive Layers and Conductive Vias Separated by Polymer Layers
02/16/2012US20120038052 Semiconductor device and fabricating method thereof
02/16/2012US20120038051 Buried silicide local interconnect with sidewall spacers and method for making the same
02/16/2012US20120038050 Sputtering target
02/16/2012US20120038049 Component having a via, and a method for manufacturing such a component
02/16/2012US20120038048 Stabilized nickel silicide interconnects
02/16/2012US20120038047 Semiconductor Device and Method of Forming B-Stage Conductive Polymer Over Contact Pads of Semiconductor Die in FO-WLCSP
02/16/2012US20120038046 Semi-conductor chip with compressible contact structure and electronic package utilizing same
02/16/2012US20120038045 Stacked Semiconductor Device And Method Of Fabricating The Same
02/16/2012US20120038044 Chip scale package and fabrication method thereof
02/16/2012US20120038043 Manufacturing fan-out wafer level packaging
02/16/2012US20120038042 Lead-free solder alloy, solder ball, and electronic member comprising solder bump
02/16/2012US20120038041 Heat dissipation structure for electronic device and fabrication method thereof
02/16/2012US20120038040 Integrated circuit packaging system with stacked lead and method of manufacture thereof
02/16/2012US20120038039 Semiconductor device and method for manufacturing semiconductor device
02/16/2012US20120038038 Aluminum nitride substrate, aluminum nitride circuit board, semiconductor apparatus, and method for manufacturing aluminum nitride substrate
02/16/2012US20120038037 Semiconductor structures and methods of manufacture
02/16/2012US20120038036 Structure for Multi-Row Leadframe and Semiconductor Package Thereof and Manufacture Method Thereof
02/16/2012US20120038035 Semiconductor package substrate and semiconductor package having the same
02/16/2012US20120038034 Semiconductor Device and Method of Forming Vertical Interconnect in FO-WLCSP Using Leadframe Disposed Between Semiconductor Die
02/16/2012US20120038033 Semiconductor device
02/16/2012US20120038032 Flexible device and method of manufacturing the same
02/16/2012US20120038031 Dispensing liquid containing material to patterned surfaces using a dispensing tube
02/16/2012US20120038028 Multiple seal ring structure
02/16/2012US20120038021 Overlay mark enhancement feature
02/16/2012US20120038020 Seal ring structure with metal pad
02/16/2012US20120037990 Method and system for pre-migration of metal ions in a semiconductor package
02/16/2012US20120037981 Power Semiconductor Chip with a Formed Patterned Thick Metallization Atop
02/16/2012US20120037962 Semiconductor structure having a contact-level air gap within the interlayer dielectrics above a semiconductor device and a method of forming the semiconductor structure using a self-assembly approach
02/16/2012US20120037576 Device for fixing metallic structures to the floor
02/16/2012US20120037220 Conductive paste and electronic device and solar cell including an electrode formed using the conductive paste
02/16/2012US20120037214 Solar cell module, solar cell attachment stand, photovoltaic power generating system
02/16/2012US20120036799 Support device for mounting a solar panel and mounting system incorporating same
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