| Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155) |
|---|
| 02/23/2012 | DE10297021B4 Grabenstruktur für Halbleiterbauelemente Grave structure for semiconductor devices |
| 02/23/2012 | DE102011080066A1 Mehrfach-Dichtringstruktur Multi-ring structure |
| 02/23/2012 | DE102011050953A1 Leiterbahnen und Anschlussflächen und Verfahren zu deren Herstellung Conductor tracks and connecting surfaces, and processes for their preparation |
| 02/23/2012 | DE102010043978A1 Anordnung zum Kühlen von Bauteilen eines HEV Arrangement for cooling of components of an HEV |
| 02/23/2012 | DE102010039550A1 Steuermodul Control module |
| 02/23/2012 | DE102010035110A1 Polymerkomposit, Verwendung des Polymerkomposits und optoelektronisches Bauelement enthaltend das Polymerkomposit Polymer composite using the composite polymer and optoelectronic component comprising the composite polymer |
| 02/23/2012 | DE102010035047A1 Method for determining process proximity function (PPF) for electron beam exposure of e.g. wafer, involves associating results of line width measurements and exposure amount of patterns, for point-wise determination of PPF |
| 02/23/2012 | DE102009012139B4 Modulsubstrat und Verfahren zur Herstellung Module substrate and methods for preparing |
| 02/23/2012 | DE102006033701B4 Herstellungsverfahren für ein elektronisches Bauelement in VQFN-Bauweise Manufacturing method for an electronic component in construction VQFN |
| 02/23/2012 | DE102005008600B4 Chipträger, System aus einem Chipträger und Halbleiterchips und Verfahren zum Herstellen eines Chipträgers und eines Systems Chip carrier system comprising a chip carrier and a semiconductor chip and method of manufacturing a chip carrier and a system |
| 02/23/2012 | DE102004059389B4 Halbleiterbauelement mit Ausgleichsmetallisierung A semiconductor device comprising Ausgleichsmetallisierung |
| 02/22/2012 | EP2421041A1 Semiconductor device and method for manufacturing semiconductor device |
| 02/22/2012 | EP2421038A1 Radiation substrate for power led and power led production and manufacturing method thereof |
| 02/22/2012 | EP2421037A1 Electronic device mounting structure and electronic device mounting method |
| 02/22/2012 | EP2421036A1 Circuitry component and method for forming the same |
| 02/22/2012 | EP2421032A1 Semiconductor Device Packaging Method and Semiconductor Device Package |
| 02/22/2012 | EP2420117A1 Housing for an on-board electronic card |
| 02/22/2012 | EP2419930A2 Through substrate vias |
| 02/22/2012 | EP2419376A1 Thermoelectric alloys with improved thermoelectric power factor |
| 02/22/2012 | EP2277799B1 Hydrated humidity control substance and process for its preparation |
| 02/22/2012 | EP2019810B1 Chip housing with reduced coupling-in of vibrations |
| 02/22/2012 | EP1970955B1 Semiconductor module |
| 02/22/2012 | EP1666515B1 Alicyclic epoxy resin, process for producing the same, composition thereof, cured epoxy resin, and use of alicyclic epoxy resin composition |
| 02/22/2012 | EP1625618B1 Semiconductor package having filler metal of gold/silver/copper alloy |
| 02/22/2012 | EP1451858B1 Interconnects with improved barrier layer adhesion |
| 02/22/2012 | EP1423898B1 An arrangement for esd protection of an integrated circuit |
| 02/22/2012 | EP1406300B1 Method of manufacturing a lead frame |
| 02/22/2012 | EP1134804B1 Thermally enhanced semiconductor carrier |
| 02/22/2012 | CN202151007U 用于接触式ic卡模块的pcb电子载板 Pcb electronic carrier board for contactless ic card module |
| 02/22/2012 | CN202150461U 一种高抗干扰性红外接收器专用支架 A high-noise immunity IR receiver Bracket |
| 02/22/2012 | CN202150453U Double flat no-carrier and no-lead wire inner pin staggered type IC chip packaging member |
| 02/22/2012 | CN202150452U Square nail head lead wire used in diode |
| 02/22/2012 | CN202150451U 均温板结构 Average temperature board structure |
| 02/22/2012 | CN202150450U 散热模组扣具 Cooling modules Button |
| 02/22/2012 | CN202150449U 一种用于太阳能逆变器的导热硅胶片 Thermal silica film for a solar inverter |
| 02/22/2012 | CN1791311B 制造电路基板的方法和制造电子部件封装结构的方法 The method of manufacturing a circuit board and a method of manufacturing an electronic component package structure |
| 02/22/2012 | CN102362430A Package member assembly, method for manufacturing package member assembly, package member, and method for manufacturing piezoelectric vibration device using package member |
| 02/22/2012 | CN102362349A Esd network circuit with a through wafer via structure and a method of manufacture |
| 02/22/2012 | CN102362347A IC package with capacitors disposed on an interposal layer |
| 02/22/2012 | CN102362346A Via structure and method thereof |
| 02/22/2012 | CN102362345A Semiconductor element substrate, method for manufacturing same, and semiconductor device |
| 02/22/2012 | CN102361534A Multilayer printed wiring board |
| 02/22/2012 | CN102361032A 半导体装置 Semiconductor device |
| 02/22/2012 | CN102361028A Semiconductor packaging structure with multiple convex block structures |
| 02/22/2012 | CN102361026A Copper-based bonding wire with anti-oxidation function |
| 02/22/2012 | CN102361025A High-density integrated circuit packaging structure, packaging method for packaging structure, and integrated circuit |
| 02/22/2012 | CN102361024A Semiconductor package with single sided substrate design and manufacturing methods thereof |
| 02/22/2012 | CN102361023A Ceramic shell capable of enhancing radiation shielding and preparation method thereof |
| 02/22/2012 | CN102361004A Integration of barrier layer and seed layer |
| 02/22/2012 | CN102360796A Integrated transformer |
| 02/22/2012 | CN102360168A Integrated measured pattern and measurement method for lithography process |
| 02/22/2012 | CN101908522B Semiconductor wafer and method for manufacturing semiconductor device |
| 02/22/2012 | CN101858499B 照明装置 Lighting device |
| 02/22/2012 | CN101853845B 多芯片堆叠封装 Multi-chip stacked packages |
| 02/22/2012 | CN101840904B 用于芯片封装的柔性基板及其制作方法 A method for making a flexible substrate and chip package |
| 02/22/2012 | CN101783290B 在功率半导体晶片上形成带有图案的厚金属的方法 The method of forming a thick metal having a pattern on a semiconductor wafer, the power |
| 02/22/2012 | CN101740573B 半导体器件 Semiconductor devices |
| 02/22/2012 | CN101667574B 具有抗esd电容器的集成电路布置和相应的制造方法 Arrangement of the integrated circuit and a corresponding method for manufacturing a capacitor having anti esd |
| 02/22/2012 | CN101632175B 用于封装半导体装置的设备和制造半导体组件的方法 Apparatus and a method for manufacturing a semiconductor component of a semiconductor device package |
| 02/22/2012 | CN101625986B 芯片封装结构制程 Chip package process |
| 02/22/2012 | CN101604678B 半导体装置、层叠型半导体装置以及内插器基板 Semiconductor device, the multi-layer semiconductor device and an interpolation filter substrate |
| 02/22/2012 | CN101551871B 一种手机卡及其实现方法 One kind of phone card and its implementation |
| 02/22/2012 | CN101535383B 导热片、其制造方法以及使用了导热片的散热装置 Thermally conductive sheet, and a method of manufacturing a heat sink using a heat conductive sheet |
| 02/22/2012 | CN101499473B 具有绝缘栅半导体元件的半导体器件和绝缘栅双极晶体管 A semiconductor element having an insulated gate semiconductor device and an insulated gate bipolar transistor |
| 02/22/2012 | CN101325197B 具有共同封装的肖特基二极管的高压高功率升压变换器 Schottky diodes have a co-packaged high-voltage high-power boost converter |
| 02/22/2012 | CN101320726B 混入磁性体粉末的半导体装置及其制造方法 Semiconductor device and manufacturing method of the magnetic powder is mixed |
| 02/22/2012 | CN101158992B 半导体集成电路的布局设计方法 Layout design method of the semiconductor integrated circuit |
| 02/22/2012 | CN101080800B 具有基于非陶瓷的窗口框架的半导体封装 Based on a semiconductor package of non-ceramic window frame |
| 02/22/2012 | CN101003436B 氮化硼球形粒粉体以及它们的使用方法 Spherical boron nitride powder grains and their use |
| 02/21/2012 | USRE43200 High power light emitting diode package |
| 02/21/2012 | US8122412 Shelding mesh design for an integrated circuit device |
| 02/21/2012 | US8122386 Dummy pattern placement apparatus, method and program and semiconductor device |
| 02/21/2012 | US8121533 Wireless local loop antenna |
| 02/21/2012 | US8121331 Surface mount silicon condenser microphone package |
| 02/21/2012 | US8120920 Computer system with heat sink |
| 02/21/2012 | US8120918 Heat dissipation device |
| 02/21/2012 | US8120916 Facilitating cooling of an electronics rack employing water vapor compression system |
| 02/21/2012 | US8120188 Electronic component mounting structure and method for manufacturing the same |
| 02/21/2012 | US8120187 Integrated circuit package system employing device stacking and method of manufacture thereof |
| 02/21/2012 | US8120185 Semiconductor device having decreased contact resistance and method for manufacturing the same |
| 02/21/2012 | US8120184 Semiconductor constructions and methods of forming layers |
| 02/21/2012 | US8120183 Method of forming top electrode for capacitor and interconnection in integrated passive device (IPD) |
| 02/21/2012 | US8120182 Integrated circuit comprising conductive lines and contact structures and method of manufacturing an integrated circuit |
| 02/21/2012 | US8120179 Air gap interconnect structures and methods for forming the same |
| 02/21/2012 | US8120177 Wafer level package having a stress relief spacer and manufacturing method thereof |
| 02/21/2012 | US8120176 Semiconductor device having a conductive bump |
| 02/21/2012 | US8120175 Soft error rate mitigation by interconnect structure |
| 02/21/2012 | US8120174 Semiconductor device and manufacturing method thereof |
| 02/21/2012 | US8120173 Thin embedded active IC circuit integration techniques for flexible and rigid circuits |
| 02/21/2012 | US8120172 Semiconductor device having improved heat sink |
| 02/21/2012 | US8120171 Power drive unit including a heat sink and a fastener |
| 02/21/2012 | US8120170 Integrated package circuit with stiffener |
| 02/21/2012 | US8120169 Thermally enhanced molded leadless package |
| 02/21/2012 | US8120168 Methods and materials useful for chip stacking, chip and wafer bonding |
| 02/21/2012 | US8120167 System with semiconductor components having encapsulated through wire interconnects (TWI) |
| 02/21/2012 | US8120166 Semiconductor package and method of manufacturing the same, and semiconductor device and method of manufacturing the same |
| 02/21/2012 | US8120165 Semiconductor device |
| 02/21/2012 | US8120164 Semiconductor chip package, printed circuit board assembly including the same and manufacturing methods thereof |
| 02/21/2012 | US8120163 Non-reciprocal device having grounding arrangement and method of installation thereof |
| 02/21/2012 | US8120160 Integrated circuit device including a bifunctional core material in a chamber |