Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2014
12/17/2014CN104218014A 一种无线控制芯片以及相应的无线设备 A radio control chip and a corresponding wireless device
12/17/2014CN104218013A 半导体装置以及半导体装置的制造方法 The method of manufacturing a semiconductor device and a semiconductor device
12/17/2014CN104218012A 金属焊线及其制造方法 Metal bonding wire and manufacturing method thereof
12/17/2014CN104218011A 微处理器散热系统 The microprocessor cooling system
12/17/2014CN104218010A 一种金属热界面材料 Metal thermal interface material
12/17/2014CN104218009A 芯片卡模块和用于制造芯片卡模块的方法 Chip card module and a method for manufacturing a chip card module
12/17/2014CN104218008A 被包装半导体器件 Are packaged semiconductor devices
12/17/2014CN104218007A 小脚印半导体封装 Small footprint semiconductor packaging
12/17/2014CN104218006A 半导体封装 The semiconductor package
12/17/2014CN104218005A 芯片密封圈及包括该密封圈的芯片 Chip seals and includes the chip seals
12/17/2014CN104218004A 提高锂电池保护芯片精度的芯片封装结构及其工艺方法 Improve the accuracy of lithium battery protection chip chip package structure and process methods
12/17/2014CN104218003A 具有缓冲材料和加强层的半导体器件 A semiconductor device having a buffer material and a reinforcing layer
12/17/2014CN104217997A 3d封装件及其形成方法 3d package and method of forming
12/17/2014CN104217967A 半导体器件及其制作方法 Semiconductor device and manufacturing method thereof
12/17/2014CN104217966A 包括两个基板的功率模块及其制造方法 Includes both a method of manufacturing a power module substrate
12/17/2014CN104217965A 芯片堆叠封装体及其制作方法 Chip stack package and fabrication method thereof
12/17/2014CN104217220A 一种嵌入式的半导体指纹传感器 An embedded semiconductor fingerprint sensor
12/17/2014CN104212369A 热固型芯片接合薄膜、带切割片的芯片接合薄膜和半导体装置的制造方法 The method of manufacturing a thin film semiconductor device and a thermosetting die-bonding film with the die-bonding dicing sheet
12/17/2014CN103107128B 一种三维芯片结构的金属键合的方法 Metal bonding method of the three-dimensional structure of the chip
12/17/2014CN102892805B 具有优异的it0粘附性的可紫外固化的聚合物厚膜介电组合物 Has excellent adhesion it0 UV curable polymer thick film dielectric compositions
12/17/2014CN102798810B 实作随机逻辑功能的基于半导体的测试装置 The semiconductor test apparatus based on the random logic functions Implementing
12/17/2014CN102782050B 固化性组合物、固化物和固化性组合物的使用方法 Use curable composition, cured product of the curable composition and
12/17/2014CN102719058B 一液型氰酸酯-环氧复合树脂组合物 A liquid type cyanate ester - epoxy composite resin composition
12/17/2014CN102569275B 堆叠式半导体封装结构及其制造方法 Stacked semiconductor package structure and manufacturing method
12/17/2014CN102543893B 半导体器件的制造方法 The method of manufacturing a semiconductor device
12/17/2014CN102484108B 高带宽倾斜叠层芯片封装 High bandwidth tilt stacked chip package
12/17/2014CN102473651B 半导体器件的制造方法 The method of manufacturing a semiconductor device
12/17/2014CN102412241B 半导体芯片封装件及其制造方法 The semiconductor chip package and method of manufacturing
12/17/2014CN102244032B 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/17/2014CN102208408B 栅驱动晶闸管以及静电保护电路 And electrostatic protection thyristor gate driver circuit
12/17/2014CN102208388B 半导体装置以及半导体装置的制造方法 The method of manufacturing a semiconductor device and a semiconductor device
12/17/2014CN102194822B 位元线结构、半导体元件及其形成方法 Bit line structure, and method of forming a semiconductor device
12/17/2014CN102088835B 风扇导接固定架及具有该固定架的散热装置 Fan guide holder and has a cooling device connected to the holder of the
12/17/2014CN102088822B 具有焊点自保护功能的pcb基板及其焊盘制作工艺 Pcb board and solder pads craftsmanship has self-protection function
12/17/2014CN102051141B 电路部件连接用粘接剂及使用该粘接剂的半导体装置 The semiconductor device circuit member connecting adhesive using the adhesive agent
12/17/2014CN101866906B 用于降低功率电子系统中的干扰辐射的装置 Reducing interference in the system power electronic means for the radiation
12/17/2014CN101826534B 半导体装置及其制造方法 Semiconductor device and manufacturing method thereof
12/17/2014CN101584044B 集成电路封装体和用于在集成电路封装体中散热的方法 An integrated circuit package and method for cooling an integrated circuit package body
12/16/2014US8913398 Mount board and electronic device
12/16/2014US8913389 Heat radiation device and electronic equipment using the same
12/16/2014US8913386 Cooling module for cooling electronic components
12/16/2014US8913356 Composite electronic circuit assembly
12/16/2014US8913237 Device-like scatterometry overlay targets
12/16/2014US8913182 Portable hand-held device having networked quad core processor
12/16/2014US8913180 Folded tape package for electronic devices
12/16/2014US8913151 Digital camera with quad core processor
12/16/2014US8913137 Handheld imaging device with multi-core image processor integrating image sensor interface
12/16/2014US8912959 Packaging structure and method of fabricating the same
12/16/2014US8912907 RFID tags and processes for producing RFID tags
12/16/2014US8912881 Methods and apparatus for dynamically authenticated identification
12/16/2014US8912865 Power combiner, power amplifying module having the same, and signal transceiving module
12/16/2014US8912811 Test contact system for testing integrated circuits with packages having an array of signal and power contacts
12/16/2014US8912671 Semiconductor device having alignment mark
12/16/2014US8912670 Bumpless build-up layer package including an integrated heat spreader
12/16/2014US8912669 Sealing resin sheet, method for producing electronic component package and electronic component package
12/16/2014US8912668 Electrical connections for chip scale packaging
12/16/2014US8912667 Packaged integrated circuit using wire bonds
12/16/2014US8912666 Structure and manufacturing method of chip scale package
12/16/2014US8912665 Dicing tape-integrated film for semiconductor back surface
12/16/2014US8912664 Leadless multi-chip module structure
12/16/2014US8912663 Embedded package structure and method for manufacturing thereof
12/16/2014US8912662 Wafer-level package and method of manufacturing the same
12/16/2014US8912661 Stacked die assembly having reduced stress electrical interconnects
12/16/2014US8912660 ESD protection device
12/16/2014US8912659 Stacked semiconductor package and method for manufacturing the same
12/16/2014US8912658 Interconnect structure with enhanced reliability
12/16/2014US8912656 Integrated circuit package and physical layer interface arrangement
12/16/2014US8912655 Semiconductor memory device, method of manufacturing the same and method of forming contact structure
12/16/2014US8912654 Semiconductor chip with integrated via
12/16/2014US8912653 Plasma treatment on semiconductor wafers
12/16/2014US8912652 Semiconductor device and method for manufacturing the same
12/16/2014US8912651 Package-on-package (PoP) structure including stud bulbs and method
12/16/2014US8912650 Semiconductor device and method of forming protective coating over interconnect structure to inhibit surface oxidation
12/16/2014US8912649 Dummy flip chip bumps for reducing stress
12/16/2014US8912648 Semiconductor device and method of forming compliant stress relief buffer around large array WLCSP
12/16/2014US8912647 Semiconductor device for smoothing the voltage of the end face of a drain of a high frequency semiconductor chip
12/16/2014US8912646 Integrated circuit assembly and method of making
12/16/2014US8912645 Semiconductor element cooling structure
12/16/2014US8912644 Semiconductor device and method for manufacturing same
12/16/2014US8912643 Electronic device cooling with microjet impingement and method of assembly
12/16/2014US8912642 Packaging substrate and fabrication method thereof
12/16/2014US8912641 Low profile electronic package and associated methods
12/16/2014US8912640 Semiconductor device and method of manufacturing the same
12/16/2014US8912639 IC package with embedded transformer
12/16/2014US8912638 Semiconductor device with hollow structure
12/16/2014US8912637 Self-adhesive die
12/16/2014US8912636 Semiconductor device
12/16/2014US8912635 Semiconductor device package and method of making a semiconductor device package
12/16/2014US8912634 High frequency transition matching in an electronic package for millimeter wave semiconductor dies
12/16/2014US8912627 Electrical fuse structure and method of fabricating same
12/16/2014US8912626 eFuse and method of fabrication
12/16/2014US8912605 ESD protection circuit
12/16/2014US8912586 Semiconductor device and method for manufacturing the same
12/16/2014US8912581 3D transmission lines for semiconductors
12/16/2014US8912577 Distributed heating transistor devices providing reduced self-heating
12/16/2014US8912574 Device isolation with improved thermal conductivity
12/16/2014US8912559 Group III nitride semiconductor light-emitting device
12/16/2014US8912546 Thin film transistor and display device
12/16/2014US8912540 Semiconductor device
12/16/2014US8912453 Electronic component package
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