Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2012
03/01/2012DE102011052471A1 Integrierte Schaltung mit Verbindungsebenen An integrated circuit interconnect levels
03/01/2012DE102011018296A1 Bauelement und Verfahren zum Herstellen eines Bauelements Device and method for manufacturing a device
03/01/2012DE102010048440B3 Integrated electronic device, has buffer and stage whose respective inputs are coupled with node, and switch in one configuration for connecting input of stage with output of buffer and for separating input of stage from node
03/01/2012DE102010040068A1 Bewertung der thermisch-mechanischen Eigenschaften komplexer Halbleiterbauelemente durch integrierte Heizsysteme Evaluation of the thermal-mechanical properties of complex semiconductor devices with integrated heating systems
03/01/2012DE102010040065A1 Verspannungsreduktion in einem Chipgehäuse unter Anwendung eines Chip-Gehäuse-Verbindungsschemas bei geringer Temperatur Stress reduction in a chip package using a chip package interconnection scheme at low temperature
03/01/2012DE102010040063A1 Verfahren zur Herstellung bleifreier Lotkugeln mit einer stabilen Oxidschicht auf der Grundlage eines Plasmaprozesses A process for preparing lead-free solder balls having a stable oxide layer on the basis of a plasma process
03/01/2012DE102010040062A1 Eine Substratzerteilungstechnik für das Separieren von Halbleiterchips mit geringerem Flächenverbrauch A Substratzerteilungstechnik for the separation of semiconductor chips with a lower surface of consumption
03/01/2012DE102010039824A1 Leistungsbaugruppe mit einer flexiblen Verbindungseinrichtung Power module with a flexible connector
03/01/2012DE102010039729A1 Elektrische Schaltung mit zu kühlender Schaltungskomponente, Kühlkörper und Verfahren zur abgedichteten Einbettung einer elektrischen Schaltung Electrical circuit for cooling circuit component, heat sink and method for embedding a sealed electrical circuit
03/01/2012DE102010039728A1 Verfahren zur Herstellung einer elektrischen Schaltung und elektrischen Schaltung A method of producing an electrical circuit and electrical circuit
03/01/2012DE102010039676A1 Verbindungsvorrichtung zum Verbinden von Aufstecköffnungen mindestens einer Kühlvorrichtung und Kühlsystem zum Kühlen von Elektronikkomponenten Connection device for connecting at least Aufstecköffnungen a cooling device and cooling system for cooling of electronic components
03/01/2012DE102010035980A1 Anschlusseinrichtung für ein Leistungshalbleitermodul Connection device for a power semiconductor module
03/01/2012DE102007034342B4 Vorrichtung für Leistungshalbleiter Apparatus for power semiconductors
03/01/2012DE102005031613B4 LED und LED-Array mit einer jeweiligen Kleberschicht LED and LED array with a respective adhesive layer
02/2012
02/29/2012EP2423959A2 Power system with a flexible connection device
02/29/2012EP2423958A2 Integral heat sink with spiral manifolds
02/29/2012EP2423955A1 Method for mounting semiconductor package component, and structure having semiconductor package component mounted therein
02/29/2012EP2423950A2 Via-less thin film resistor with a dielectric cap and manufacturing method thereof
02/29/2012EP2423949A2 Multi-layer via-less thin film resistor and manufacturing method therefor
02/29/2012EP2423948A2 Lateral connection for a via-less thin film resistor and method of forming the same
02/29/2012EP2423947A2 Electronic device including a feature in a trench
02/29/2012EP2423160A1 Assembly of objects by means of a sealing bead comprising intermetallic compounds
02/29/2012EP2422369A1 Silicone coated light-emitting diode
02/29/2012EP2422368A1 Semiconductor chip and method for generating digital value using process variation
02/29/2012EP2422367A1 Encapsulated circuit device for substrates with absorption layer and method for producing the same
02/29/2012EP1812967B1 Off-width pitch for improved circuit card routing
02/29/2012EP1668692B1 Adjustable self-aligned air gap dielectric for low capacitance wiring
02/29/2012EP1654759B1 Phase change thermal interface materials using polyester resin and clay filler
02/29/2012DE202012001323U1 Kühlkörper mit Kühlplatte Heatsink with cooling plate
02/29/2012CN202153516U 一种双重增强的集成电路引线框架版 A dual enhanced integrated circuit lead frame version
02/29/2012CN202153515U Semiconductor packaging part connected by bonding sliver wire clad by palladium layer on surface
02/29/2012CN202153514U 热管散热器及散热系统 Heat pipe radiator and cooling system
02/29/2012CN202153513U 散热器的固定扣件 Radiator fixed fastener
02/29/2012CN202153512U 一种半导体晶块 A semiconductor ingot
02/29/2012CN202153511U 一种半导体器件的散热板 A semiconductor device heat sink plate
02/29/2012CN202153510U 一种模组化qfn封装结构 A modular package structure of qfn
02/29/2012CN1976028B ESD protection element
02/29/2012CN1971866B Smart card body, manufacturing method thereof, smart card, installation method thereof and belt carrier
02/29/2012CN1930263B Resin composition and semiconductor devices made by using the same
02/29/2012CN1725945B Heat spreader for display device
02/29/2012CN102365764A Semiconductor device
02/29/2012CN102365737A Method of producing substrate for semiconductor element, and semiconductor device
02/29/2012CN102365736A Semiconductor device and method of manufacturing substrates for semiconductor elements
02/29/2012CN102365735A Interconnect structure for a semiconductor device with a resilient stress absorber and related method of manufacture
02/29/2012CN102365734A Pressure support for an electronic circuit
02/29/2012CN102365733A Process for producing metallized substrate, and metallized substrate
02/29/2012CN102365709A Patterning method
02/29/2012CN102365247A Glass composition and covering and sealing members using same
02/29/2012CN102364712A Synthetic jet heat radiating device
02/29/2012CN102364683A Packaging structure and method thereof, and electronic equipment
02/29/2012CN102364682A Perpendicular double-diffusion MOS (Metal Oxide Semiconductor) test structure as well as forming and testing methods
02/29/2012CN102364681A Welding disc and silicon-on-insulator (SOI) device with same
02/29/2012CN102364680A DIP packaging lead frame
02/29/2012CN102364679A Chip packaging structure
02/29/2012CN102364678A Novel chip packaging structure
02/29/2012CN102364677A Flip chip packaging structure
02/29/2012CN102364676A Packaging shell structure for semiconductor power module
02/29/2012CN102023438B Liquid crystal display device, manufacturing method and defect repair method
02/29/2012CN101933140B Nanostructures and methods of making the same
02/29/2012CN101919050B Semiconductor device
02/29/2012CN101877318B Frame type direct copper-ceramic bonding plate and manufacturing method thereof
02/29/2012CN101866902B Semiconductor packaging structure, lead frame and chip holder thereof
02/29/2012CN101840909B Integrated circuit device
02/29/2012CN101814504B Metal structure for memory device and semiconductor device manufacture method
02/29/2012CN101800208B Semiconductor packaging structure and heat radiating fin thereof
02/29/2012CN101777547B Bonding structure of pattern electrodes using ultra-violet curing agent including naturally curing agent
02/29/2012CN101764113B Metal protruding block structure on connecting pad of circuit surface of semiconductor element and forming method
02/29/2012CN101752329B Top-side cooled semiconductor package with stacked interconnection plates and method
02/29/2012CN101740675B Circuit board of light-emitting diode
02/29/2012CN101681903B Electronic package and manufacturing method thereof
02/29/2012CN101627459B Semiconductor device manufacturing method and semiconductor device manufacturing apparatus
02/29/2012CN101625987B Fabricating process of a chip package structure
02/29/2012CN101577248B Array substrate and forming method thereof
02/29/2012CN101552262B Polycrystalline packaging unit and manufacture method thereof
02/29/2012CN101545057B Method for preparing diamond/Cu composite material with high heat conductivity
02/29/2012CN101540298B TFT-LCD array substrate and manufacturing method thereof
02/29/2012CN101495533B Epoxy resin composition and cured article thereof, novel epoxy resin and production method thereof, and novel phenol resin
02/29/2012CN101463245B Adhesive film composition for semiconductor assembly, adhesive film, dicing die bonding film, device package, and associated methods
02/29/2012CN101453159B Power terminal having built-in power terminal
02/29/2012CN101425496B Silicon substrate having flip chip projection
02/29/2012CN101405561B Heat exchanger and method for manufacturing it
02/29/2012CN101383303B Semiconductor device and manufacturing method thereof
02/29/2012CN101355061B High performance semiconductor module with sealant device on substrate carrier and corresponding production method
02/29/2012CN101315928B Layout methods of integrated circuits having unit mos devices
02/29/2012CN101312185B Light emitting device and method for manufacturing the same
02/29/2012CN101312166B Power semiconductor module
02/29/2012CN101295680B Active-matrix substrate and method for producing the same, electrooptical device and method for producing the same, and electronic apparatus
02/29/2012CN101253447B Thin-film transistor substrate and display device
02/29/2012CN101223207B Epoxy resin composition and semiconductor device
02/29/2012CN101217153B An active member array structure and the corresponding manufacturing method
02/29/2012CN101208752B Nonvolatile memory cell comprising a diode and a resistance-switching material
02/29/2012CN101084622B A power device and a method for controlling a power device
02/28/2012USRE43215 ESD protection design with turn-on restraining method and structures
02/28/2012US8126501 Semiconductor device and electronic device
02/28/2012US8125790 OC2 oriented connections 2
02/28/2012US8125092 Semiconductor device packages and assemblies
02/28/2012US8125091 Wire bonding over active circuits
02/28/2012US8125090 Semiconductor power module
02/28/2012US8125089 Optically-initiated silicon carbide high voltage switch
02/28/2012US8125088 Semiconductor device
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