Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
02/2012
02/28/2012US8125087 High-density flip-chip interconnect
02/28/2012US8125086 Substrate for semiconductor package
02/28/2012US8125085 Semiconductor device having wiring with oxide layer of impurity from the wiring
02/28/2012US8125084 Semiconductor device and semiconductor device manufacturing method
02/28/2012US8125083 Protective barrier layer for semiconductor device electrodes
02/28/2012US8125081 Semiconductor device, printed wiring board for mounting the semiconductor device and connecting structure for these
02/28/2012US8125079 Molded semiconductor device, apparatus for producing the same, and method for manufacturing the same
02/28/2012US8125078 Semiconductor element cooling structure
02/28/2012US8125077 Package with heat transfer
02/28/2012US8125076 Semiconductor package system with substrate heat sink
02/28/2012US8125075 Carbon nanotube micro-chimney and thermo siphon die-level cooling
02/28/2012US8125074 Laminated substrate for an integrated circuit BGA package and printed circuit boards
02/28/2012US8125073 Wafer integrated with permanent carrier and method therefor
02/28/2012US8125072 Device including a ring-shaped metal structure and method
02/28/2012US8125071 Package structure utilizing high and low side drivers on separate dice
02/28/2012US8125070 Semiconductor component
02/28/2012US8125069 Semiconductor device and etching apparatus
02/28/2012US8125068 Semiconductor chip including a chip via plug penetrating a substrate, a semiconductor stack, a semiconductor device package and an electronic apparatus including the semiconductor chip
02/28/2012US8125066 Package on package configurations with embedded solder balls and interposal layer
02/28/2012US8125065 Elimination of RDL using tape base flip chip on flex for die stacking
02/28/2012US8125064 Increased I/O semiconductor package and method of making same
02/28/2012US8125063 COL package having small chip hidden between leads
02/28/2012US8125062 Lead frame, lead frame fabrication, and semiconductor device
02/28/2012US8125061 Semiconductor package and method of manufacturing the same
02/28/2012US8125060 Electronic component with layered frame
02/28/2012US8125059 Semiconductor device
02/28/2012US8125058 Faraday cage for circuitry using substrates
02/28/2012US8125057 Magnetic shielding for integrated circuit
02/28/2012US8125054 Semiconductor device having enhanced scribe and method for fabrication
02/28/2012US8125053 Embedded scribe lane crack arrest structure for improved IC package reliability of plastic flip chip devices
02/28/2012US8125052 Seal ring structure with improved cracking protection
02/28/2012US8125036 Integrated circuit having an edge passivation and oxidation resistant layer and method
02/28/2012US8125034 Graded ARC for high NA and immersion lithography
02/28/2012US8125022 Semiconductor device and method of manufacturing the same
02/28/2012US8125009 Mounting circuit substrate
02/28/2012US8124881 Printed board and portable electronic device which uses this printed board
02/28/2012US8124523 Fabrication method of a semiconductor device and a semiconductor device
02/28/2012US8124522 Reducing UV and dielectric diffusion barrier interaction through the modulation of optical properties
02/28/2012US8124520 Integrated circuit mount system with solder mask pad
02/28/2012US8124460 Integrated circuit package system employing an exposed thermally conductive coating
02/28/2012US8124453 Vertically packaged MOSFET and IC power devices as integrated module using 3D interconnected laminates
02/28/2012US8124451 Integrated circuit packaging system with interposer
02/28/2012US8124449 Device including a semiconductor chip and metal foils
02/28/2012US8124446 Structure of high performance combo chip and processing method
02/28/2012US8124435 Method for manufacturing a microelectromechanical component, and a microelectromechanical component
02/28/2012US8124428 Structure and method for testing MEMS devices
02/28/2012US8124173 Process for packaging electronic devices
02/28/2012US8123861 Apparatus for making interconnect seed layers and products
02/28/2012CA2462093C Phonon-blocking, electron-transmitting low-dimensional structures
02/27/2012DE202012100090U1 Halbleiteranordnung mit plattierter Basisplatte A semiconductor device comprising plated base plate
02/23/2012WO2012023902A1 A flexible circuit and a method of producing the same
02/23/2012WO2012023899A1 Hermetic seal and method of manufacture thereof
02/23/2012WO2012023710A2 Air-conditioning device having a thermoelectric module
02/23/2012WO2012023618A1 Phenyl group-containing organic/inorganic hybrid prepolymer, heat resisitant organic/inorganic hybrid material, and element encapsulation structure
02/23/2012WO2012023394A1 Esd protection device
02/23/2012WO2012023332A1 Electronic part and method of manufacturing same
02/23/2012WO2012023236A1 Semiconductor device and method for manufacturing same
02/23/2012WO2012022575A1 Ignition device having improved thermal behaviour
02/23/2012WO2012022535A1 Control module
02/23/2012WO2012022404A2 Core-sheath ribbon wire
02/23/2012WO2012022308A1 Transistor with high electron mobility and inhomogeneous layer resistance of the guide channel
02/23/2012WO2012022108A1 Semiconductor device and method for forming the same
02/23/2012WO2011163599A3 Metal coating for indium bump bonding
02/23/2012WO2011146579A3 Electrical connector between die pad and z-interconnect for stacked die assemblies
02/23/2012WO2011139875A3 Tce compensation for ic package substrates for reduced die warpage assembly
02/23/2012WO2011124205A3 Package for metal-ceramic substrate, and method for packaging such substrates
02/23/2012WO2010105157A3 Microelectronic assembly wherein a wirebond is impedance controlled by using a conductive layer connected to a reference potential
02/23/2012US20120045611 Composite Carrier Structure
02/23/2012US20120044752 High density integrated circuitry for semiconductor memory
02/23/2012US20120044735 Structures with increased photo-alignment margins
02/23/2012US20120043673 Three-dimensional semiconductor memory device
02/23/2012US20120043672 Semiconductor Device and Method of Forming Vertically Offset Conductive Pillars Over First Substrate Aligned to Vertically Offset BOT Interconnect Sites Formed Over Second Substrate
02/23/2012US20120043671 Semiconductor memory device and semiconductor memory card
02/23/2012US20120043669 Stacked semiconductor chip device with thermal management circuit board
02/23/2012US20120043668 Stacked semiconductor chips with thermal management
02/23/2012US20120043667 Compliant printed circuit semiconductor package
02/23/2012US20120043666 Semiconductor Device and Method of Fabricating the Same
02/23/2012US20120043665 Semiconductor device and electronic apparatus including the same
02/23/2012US20120043664 Implementing multiple different types of dies for memory stacking
02/23/2012US20120043663 Power and ground routing of integrated circuit devices with improved ir drop and chip performance
02/23/2012US20120043662 Semiconductor device production method and semiconductor device
02/23/2012US20120043661 Integrated circuits and methods of forming conductive lines and conductive pads therefor
02/23/2012US20120043660 Thin foil semiconductor package
02/23/2012US20120043659 Interconnects with improved tddb
02/23/2012US20120043658 Semiconductor Constructions; And Methods For Providing Electrically Conductive Material Within Openings
02/23/2012US20120043657 Method for fabricating conductive lines
02/23/2012US20120043656 Semiconductor device, manufacturing method thereof, and manufacturing method of semiconductor module
02/23/2012US20120043655 Wafer-level package using stud bump coated with solder
02/23/2012US20120043654 Mechanisms for forming copper pillar bumps using patterned anodes
02/23/2012US20120043653 Lead pin for package substrate, and method for manufacturing package substrate with the same
02/23/2012US20120043652 Semiconductor power module
02/23/2012US20120043651 Leadframe, leadframe type package and lead lane
02/23/2012US20120043650 Packaging Integrated Circuits
02/23/2012US20120043642 Semiconductor device
02/23/2012US20120043628 Packaged device including a well for containing a die
02/23/2012US20120043616 Sub word line driver and apparatuses having the same
02/23/2012US20120043539 Semiconductor chip with thermal interface tape
02/23/2012US20120043131 Method for Producing a Sensor with Seamless Extrusion Coating of a Sensor Element
02/23/2012US20120042934 Laminated body having semiconductor layer and layer thickness measurement portion, and thin-film photoelectric conversion device and integrated thin-film solar cell having the same
02/23/2012DE19758891B4 Halbleitersensor und Verfahren zu dessen Herstellung A semiconductor sensor and method for its production
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