Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2012
03/07/2012EP2426409A1 Device for generating a cold air flow in a preferred flow direction for cooling electrical components
03/07/2012EP2425451A1 Composite electronic circuit assembly
03/07/2012EP2425450A2 Novel bonding process and bonded structures
03/07/2012EP2425449A2 Method for providing electrical connections to spaced conductive lines
03/07/2012EP2215008B1 Module housing and method for producing a module housing
03/07/2012EP2022758B1 Silica powder and method of using the same
03/07/2012EP1981319B1 Process for producing metallized ceramic substrate, metallized ceramic substrate produced by the process, and package
03/07/2012EP1851797B1 Device and method for fabricating double-sided soi wafer scale package with through via connections
03/07/2012EP1421619B1 Connecting the emitter contacts of a semiconductor device
03/07/2012DE202012001287U1 Wärmerohr Heat pipe
03/07/2012DE202012001283U1 Kühlmodul Cooling module
03/07/2012DE202009018568U1 Lichtemittierende Diode und lichtemittierende Vorrichtung Light emitting diode and light emitting device
03/07/2012CN202160368U 散热单元及其散热模组 Cooling units and cooling modules
03/07/2012CN202159697U 直接用交流电驱动的发光二极管 Direct use of AC-driven light-emitting diodes
03/07/2012CN202159666U 一种新型整流模块 A new rectifier
03/07/2012CN202159665U 一种抗光干扰红外线接收模组 An anti-light interference infrared receiver module
03/07/2012CN202159662U 红外线接收头内屏蔽支架 Shielding stent infrared receiver
03/07/2012CN202159661U Semiconductor packaging piece connected by bonding copper wire with surface coated by platinum layer
03/07/2012CN202159660U 一种贴片式sod二极管 A patch type sod diode
03/07/2012CN202159659U 一种具有防漏水功能的换流器用igbt水冷系统 Used commutation function having a leak-proof water cooling system igbt
03/07/2012CN202159658U Crystal-coated thin film
03/07/2012CN202159657U 芯片封装结构半成品 Semi-finished chip package
03/07/2012CN202159656U 一种功率晶体管芯片保护结构 A power transistor chip protection structures
03/07/2012CN202158432U 一种背光源和液晶显示装置 A backlight and a liquid crystal display device
03/07/2012CN1937902B Cooling structure of heating element
03/07/2012CN1838405B Heat receiving sheet, electronic apparatus, and fabrication method for heat receiving sheet
03/07/2012CN1790697B Robust power semiconductor package
03/07/2012CN102369600A Circuit board
03/07/2012CN102369229A Flame-retardant phosphorus-containing epoxy resin composition and cured product thereof
03/07/2012CN102369101A Film for resin spacer, light-receiving device and method for manufacturing same, and MEMS device and method for manufacturing same
03/07/2012CN102368682A Packaging method and structure
03/07/2012CN102368495A Anti-static chip packaging structure
03/07/2012CN102368494A Anti-electromagnetic interference chip packaging structure
03/07/2012CN102368493A Method for packaging integrated circuit chip
03/07/2012CN102368492A Triode lead frame with lead hole
03/07/2012CN102368491A Lead frame for transistor
03/07/2012CN102368490A Improved transistor lead frame
03/07/2012CN102368489A Electroplated triode lead frame
03/07/2012CN102368488A Lead frame with inward-concave chip area
03/07/2012CN102368487A Lead frame support of semiconductor element
03/07/2012CN102368486A Lead frame of semiconductor element
03/07/2012CN102368485A Improved semiconductor element lead framework
03/07/2012CN102368484A Multichip integrated circuit packaging structure
03/07/2012CN102368483A Novel chip packaging structure
03/07/2012CN102368482A High-efficiency heat sink of porous metal structure
03/07/2012CN102368481A High-strength chip packaging structure
03/07/2012CN102368480A High temperature resistance chip packaging structure
03/07/2012CN102368471A COF (Chip On Flex) packaging method and structure for LCD (liquid crystal display) driving chips
03/07/2012CN101971328B Method for manufacturing wafer stack
03/07/2012CN101911266B Semiconductor device manufacturing method, semiconductor manufacturing apparatus and storage medium
03/07/2012CN101911257B ULSI micro-interconnect member having ruthenium electroplating layer on barrier layer
03/07/2012CN101877334B Semiconductor device with heat radiation and gain
03/07/2012CN101826491B Semiconductor packaging structure and manufacturing method thereof
03/07/2012CN101740472B Method for manufacturing semiconductor device with copper wiring and semiconductor device
03/07/2012CN101447472B Etch stop layer, double-mosaic structure and forming method thereof
03/07/2012CN101425500B Integrated circuit structure
03/07/2012CN101369564B Semi-conductor device
03/07/2012CN101355096B Organic light emitting display and method of manufacturing the same
03/07/2012CN101110401B Interconnect structure for semiconductor package
03/07/2012CN101026120B 半导体器件 Semiconductor devices
03/06/2012US8130532 High speed OTP sensing scheme
03/06/2012US8130496 Device and method for mitigating radio frequency interference
03/06/2012US8130493 Method of arranging components of circuit board for optimal heat dissipation and circuit apparatus having components arranged by performing the method
03/06/2012US8130315 Solid image capture device and electronic device incorporating same
03/06/2012US8130314 Solid-state image capturing apparatus, mounting method of solid-state image capturing apparatus, manufacturing method of solid-state image capturing apparatus, and electronic information device
03/06/2012US8129849 Method of making semiconductor package with adhering portion
03/06/2012US8129848 Light emitting device having a plurality of light emitting cells connected in series and method of fabricating the same
03/06/2012US8129846 Board adapted to mount an electronic device, semiconductor module and manufacturing method therefor, and portable device
03/06/2012US8129845 Semiconductor device and method of forming interconnect structure in non-active area of wafer
03/06/2012US8129844 Method of forming a metal silicide layer, devices incorporating metal silicide layers and design structures for the devices
03/06/2012US8129843 Methods to mitigate plasma damage in organosilicate dielectrics using a protective sidewall spacer
03/06/2012US8129842 Enhanced interconnect structure
03/06/2012US8129841 Solder joint flip chip interconnection
03/06/2012US8129839 Electronic device package structures
03/06/2012US8129838 Housed active microstructures with direct contacting to a substrate
03/06/2012US8129837 Flip chip interconnection pad layout
03/06/2012US8129836 Semiconductor device
03/06/2012US8129835 Package substrate having semiconductor component embedded therein and fabrication method thereof
03/06/2012US8129834 Integral metal structure with conductive post portions
03/06/2012US8129833 Stacked integrated circuit packages that include monolithic conductive vias
03/06/2012US8129832 Mountable integrated circuit package system with substrate having a conductor-free recess
03/06/2012US8129830 Electronic component package and method of manufacturing the same, and electronic component device
03/06/2012US8129829 Package substrate having embedded photosensitive semiconductor chip and fabrication method thereof
03/06/2012US8129828 Wiring substrate with reinforcement
03/06/2012US8129827 Integrated circuit package system with package encapsulation having recess
03/06/2012US8129826 Semiconductor package apparatus having redistribution layer
03/06/2012US8129825 IC chip package employing substrate with a device hole
03/06/2012US8129823 Materials, structures and methods for microelectronic packaging
03/06/2012US8129801 Discrete stress isolator attachment structures for MEMS sensor packages
03/06/2012US8129788 Capacitor triggered silicon controlled rectifier
03/06/2012US8129759 Semiconductor package and method using isolated VSS plane to accommodate high speed circuitry ground isolation
03/06/2012US8129746 Phase change memory device and method of manufacturing the same
03/06/2012US8129742 Semiconductor chip assembly with post/base heat spreader and plated through-hole
03/06/2012US8129741 Light emitting diode package
03/06/2012US8129632 Portable electronic device
03/06/2012US8129625 Multilayer printed wiring board
03/06/2012US8129286 Reducing effective dielectric constant in semiconductor devices
03/06/2012US8129277 Method of machining wafer
03/06/2012US8129276 Void sealing in a dielectric material of a contact level of a semiconductor device comprising closely spaced transistors
03/06/2012US8129266 Method of forming a shielded semiconductor device and structure therefor
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