Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2012
03/08/2012WO2012029579A1 Semiconductor package and semiconductor device
03/08/2012WO2012029560A1 Thermally conductive sheet
03/08/2012WO2012029549A1 Semiconductor package, and semiconductor device
03/08/2012WO2012029526A1 Semiconductor package and semiconductor device
03/08/2012WO2012029489A1 Electrical connector
03/08/2012WO2012029475A1 Method for manufacturing semiconductor device
03/08/2012WO2012029474A1 Etching method and etching system
03/08/2012WO2012029473A1 Etching method and etching apparatus
03/08/2012WO2012029425A1 Thermosetting epoxy resin composition and uses thereof
03/08/2012WO2012029318A1 Substrate for mounting element and optical module
03/08/2012WO2012029213A1 Circuit board and electronic device
03/08/2012WO2012029165A1 Semiconductor module
03/08/2012WO2012029164A1 Semiconductor module
03/08/2012WO2012029128A1 Cooling device, printed circuit board unit, and electronic device
03/08/2012WO2012028793A2 Treatment, before the bonding of a mixed copper oxide surface, by a plasma containing nitrogen and hydrogen
03/08/2012WO2012028432A1 Staggered thin film transistor and method of forming the same
03/08/2012WO2012028415A1 Electrodeposition methods of gallium and gallium alloy films and related photovoltaic structures
03/08/2012WO2012028109A1 Semicondunctor device and method of fabricating the same
03/08/2012WO2012027936A1 Led integrated structure with cooling device
03/08/2012WO2012027929A1 Crystal device without packaging and manufacturing method thereof
03/08/2012WO2012007271A3 Carrier device for a semiconductor chip with a solder barrier against solder creep, electronic component and optoelectronic component provided therewith
03/08/2012WO2012003530A9 Optical bus in 3d integrated circuit stack
03/08/2012WO2012000685A3 Interposer and method for producing holes in an interposer
03/08/2012WO2011159417A3 Thermal interface material assemblies, and related methods
03/08/2012WO2011154033A3 Method for marking a solar cell and solar cell
03/08/2012WO2011151453A3 Method for dividing a large substrate into smaller ones and method for controllably selectively depositing a sealant material
03/08/2012WO2011132971A3 Semiconductor chip including bump having barrier layer, and manufacturing method thereof
03/08/2012WO2011086550A3 Semiconductor structure with heat spreader and method of its manufacture
03/08/2012US20120059984 Semiconductor memory device
03/08/2012US20120058603 Fabrication method of semiconductor integrated circuit device
03/08/2012US20120058113 Cancer treatment method
03/08/2012US20120056648 Semiconductor device, electric circuit using the same and method of controlling electric circuit
03/08/2012US20120056338 Pressure-sensitive adhesive sheet for protecting semiconductor wafer
03/08/2012US20120056337 Rfic chip mounting structure
03/08/2012US20120056336 Semiconductor package for controlling warpage
03/08/2012US20120056335 Multi-chip package with offset die stacking
03/08/2012US20120056334 Semiconductor Device and Method of Forming Pre-Molded Substrate to Reduce Warpage During Die Mounting
03/08/2012US20120056332 Compliant printed circuit wafer level semiconductor package
03/08/2012US20120056331 Methods of forming semiconductor device and semiconductor devices formed by the same
03/08/2012US20120056330 Semiconductor device
03/08/2012US20120056329 Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect
03/08/2012US20120056328 Die Edge Contacts for Semiconductor Devices
03/08/2012US20120056327 Ramp-stack chip package with static bends
03/08/2012US20120056326 Titanium nitride films
03/08/2012US20120056325 Methods of fabricating electronic devices using direct copper plating
03/08/2012US20120056324 Substrate for a microelectronic package and method of fabricating thereof
03/08/2012US20120056323 Semiconductor structure and method for manufacturing the same
03/08/2012US20120056322 Semiconductor device with pads of enhanced moisture blocking ability
03/08/2012US20120056321 Semiconductor Device and Method of Forming WLP With Semiconductor Die Embedded Within Penetrable Encapsulant Between TSV Interposers
03/08/2012US20120056320 Semiconductor device and manufacturing method of semiconductor device
03/08/2012US20120056319 Embedded package and method for manufacturing the same
03/08/2012US20120056318 Semiconductor device
03/08/2012US20120056317 Chip
03/08/2012US20120056316 Semiconductor Device and Method of Forming Different Height Conductive Pillars to Electrically Interconnect Stacked Laterally Offset Semiconductor Die
03/08/2012US20120056315 Alignment Marks in Substrate Having Through-Substrate Via (TSV)
03/08/2012US20120056314 Semiconductor Device and Method of Forming Base Leads from Base Substrate as Standoff for Stacking Semiconductor Die
03/08/2012US20120056313 Semiconductor package
03/08/2012US20120056312 Semiconductor Device and Method of Forming TSV Semiconductor Wafer with Embedded Semiconductor Die
03/08/2012US20120056311 Leadframe for semiconductor device
03/08/2012US20120056310 Semiconductor device and method for increasing semiconductor device effective operation aera
03/08/2012US20120056302 Semiconductor device and method of manufacturing same
03/08/2012US20120056300 Semiconductor device and fabricating method of the same
03/08/2012US20120056296 Semiconductor device and method of blowing fuse thereof
03/08/2012US20120056292 Semiconductor package and manufacturing method for a semiconductor package as well as optical module
03/08/2012US20120056288 Semiconductor device, manufacturing method therefor, and electronic apparatus
03/08/2012US20120056277 Semiconductor device integrated with converter and package structure thereof
03/08/2012US20120056239 Electrostatic discharge protection device
03/08/2012US20120056181 Method of manufacturing electronic element and electronic element
03/08/2012US20120056178 Multi-chip packages
03/08/2012US20120056177 3d integrated circuit structure and method for detecting chip mis-alignement
03/08/2012US20120056066 Support arrangement for solar modules
03/08/2012US20120055691 Housing and method for manufacturing housing
03/08/2012DE19748847B4 Halbleiterbauelement mit einer Vielschichtverbindungsstruktur und Verfahren zur Herstellung desselben Of the same semiconductor device having a multilayer interconnection structure and methods for preparing
03/08/2012DE112009004248T5 Ein Herstellungsverfahren einer flüssigkeitsgekühlten Ummantelung A manufacturing method of a liquid-cooled jacket
03/08/2012DE10227658B4 Metall-Keramik-Substrat für elektrische Schaltkreise -oder Module, Verfahren zum Herstellen eines solchen Substrates sowie Modul mit einem solchen Substrat A metal-ceramic substrate for electrical circuits -or- modules, method of making such a substrate and module substrate having such a
03/08/2012DE102011082051A1 Halbleiteranordnung Semiconductor device
03/08/2012DE102011081218A1 Power semiconductor device for protective circuit for controlling motor of car, has insulation portion which insulates power semiconductor element, and heat dissipation plate is provided with flow communication portion for flow of coolant
03/08/2012DE102011052959A1 Semiconductor package for semiconductor memory device, has interface circuitry that is comprised with input connected with terminals in housing interface to provide difference signal based on received information
03/08/2012DE102011051880A1 Verfahren und system zum prüfen von halbleiterchips auf waferebene Method and system for testing semiconductor chips at wafer level
03/08/2012DE102010044709A1 Leistungshalbleitermodul mit Metallsinter-, vorzugsweise Silbersinterverbindungen sowie Herstellungsverfahren Power semiconductor module with sintered metal, preferably silver Inter compounds and manufacturing processes
03/08/2012DE102010044404A1 Bildsensor, Videokamera und Mikroskop Image sensor, video camera and microscope
03/08/2012DE102010040369A1 Contact structure for semiconductor-based circuit breaker, has conductive element in which recesses are formed, and bars between recesses, which are electrically connected in parallel between power terminals of conductive element
03/08/2012DE102010025966B4 Interposer und Verfahren zum Herstellen von Löchern in einem Interposer Interposer and method for making holes in an interposer
03/08/2012DE102006060484B4 Halbleiterbauelement mit einem Halbleiterchip und Verfahren zur Herstellung desselben Of the same semiconductor device with a semiconductor chip and method for producing
03/08/2012DE102006035645B4 Verfahren zum Ausbilden einer elektrisch leitfähigen Leitung in einem integrierten Schaltkreis A method of forming an electrically conductive line in an integrated circuit
03/08/2012DE102006022105B4 ESD-Schutz-Element und ESD-Schutz-Einrichtung zur Verwendung in einem elektrischen Schaltkreis ESD protection element and the ESD protection device for use in an electrical circuit
03/08/2012CA2810394A1 A light emitting apparatus
03/07/2012EP2427040A1 Electronic component mounting device and method for producing the same
03/07/2012EP2426795A1 Cooling module for laser, manufacture method thereof and semiconductor laser including the same
03/07/2012EP2426785A2 Ceramic antenna module and methods of manufacture thereof
03/07/2012EP2426720A1 Staggered thin film transistor and method of forming the same
03/07/2012EP2426718A1 Semiconductor device, manufacturing method therefor, and electronic apparatus
03/07/2012EP2426715A1 Power module
03/07/2012EP2426714A1 Device mounting structure and device mounting method
03/07/2012EP2426713A2 Package for a power semiconductor device
03/07/2012EP2426712A1 Planar power-switching electronic component.
03/07/2012EP2426711A2 Heat sink for a protrusion-type ic package
03/07/2012EP2426710A2 Method of Manufacturing a Wafer Assembly with Junction-Isolated Vias
03/07/2012EP2426707A1 Method for Manufacturing Electronic Parts Device and Resin Composition for Electronic Parts Encapsulation
03/07/2012EP2426550A1 Method for manufacturing liquid crystal panel, liquid crystal panel glass substrate, and liquid crystal panel provided with the liquid crystal panel glass substrate
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