Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2012
03/14/2012CN102376658A Chip radiating device in outdoor unit of air conditioner and application thereof
03/14/2012CN102376657A Integrated circuit structure with through via for heat evacuating
03/14/2012CN102376656A Foundation island-free packaging structure without pins on four surfaces and manufacturing method thereof
03/14/2012CN102376655A Chip packaging structure with metal layer
03/14/2012CN102376654A Multiple seal ring structure
03/14/2012CN102376653A Low-temperature bonding process
03/14/2012CN102376639A Method of forming metal lines of semiconductor device
03/14/2012CN102376633A Semiconductor structure and manufacturing method thereof
03/14/2012CN102376630A Semiconductor device and method for manufacturing local interconnect structure thereof
03/14/2012CN102376628A Manufacturing method and package structure for system in package module
03/14/2012CN102376625A Semiconductor device and manufacturing method thereof
03/14/2012CN102376624A Graphene device and production method thereof
03/14/2012CN102376616A Film for semiconductor back surface, dicing tape-integrated film for semiconductor back surface, method for producing semiconductor device, and flip chip type semiconductor device
03/14/2012CN102376615A Film for semiconductor back surface,dicing tape-integrated film for semiconductor back surface, method for producing semiconductor device, and flip chip type semiconductor device
03/14/2012CN102376610A Integrated circuit module and methods of manufaturing the same
03/14/2012CN102376601A Detection method and structure for deviation of contact hole
03/14/2012CN102376598A Apparatus for wafer level bump reflow, system and method thereof
03/14/2012CN102376597A Dual-damascene structure and manufacturing method thereof
03/14/2012CN102376596A Semiconductor device with nested row contact
03/14/2012CN102376595A Method and semiconductor device of forming FO-WLCSP having conductive layers and conductive vias
03/14/2012CN102376594A Electronic package structure and package method thereof
03/14/2012CN102376592A Chip size packaging part and production method thereof
03/14/2012CN102376591A Chip scale package and preparation method thereof
03/14/2012CN102376590A Chip scale package and production method thereof
03/14/2012CN102376589A Method for filling cavities in wafers, correspondingly filled blind hole and wafer having correspondingly filled insulation trenches
03/14/2012CN102376588A Side wettable plating for semiconductor chip package
03/14/2012CN102376539A Method for producing an electrical circuit and electrical circuit
03/14/2012CN102376414A Unequal-width multi-current-path inductor
03/14/2012CN102376405A Via-less thin film resistor with a dielectric cap
03/14/2012CN102376404A Multi-layer via-less thin film resistor
03/14/2012CN102372924A Organopolysiloxane composition and semiconductor apparatus
03/14/2012CN102372901A Hydantoin epoxy resin composite for encapsulating semiconductor devices
03/14/2012CN102372899A Flame-retarding green epoxy molding compound
03/14/2012CN102372836A Method for manufacturing cured product of thermosetting resin composition and cured product obtained thereby
03/14/2012CN102024783B Semiconductor element for use in interconnection process and manufacturing method thereof
03/14/2012CN101853855B Manufacturing method of silicon wafer with perforating holes
03/14/2012CN101771010B Backside metal treatment of semiconductor chips
03/14/2012CN101761786B Combined structure and method of light fitting component
03/14/2012CN101719484B Backside connection to tsvs having redistribution lines
03/14/2012CN101667566B Gold-coated-sliver base bonding silk thread and manufacture method thereof
03/14/2012CN101652853B Passivation layer for a circuit device and method of manufacture
03/14/2012CN101652053B Heat dissipating device
03/14/2012CN101641004B Radiating device
03/14/2012CN101640190B Structure for reducing integrated circuit corner peeling
03/14/2012CN101610657B Heat radiating device
03/14/2012CN101604681B Semiconductor device, stacked semiconductor device and interposer substrate
03/14/2012CN101587874B Chip with drive integrated circuit and corresponding liquid crystal display
03/14/2012CN101566316B Light-emitting diode lamp
03/14/2012CN101472438B Method for determining electronic system radiating requirement
03/14/2012CN101471337B Light source die set with good radiating performance
03/14/2012CN101466237B Radiating device
03/14/2012CN101466234B Radiating device
03/14/2012CN101466225B Radiating device and hot pipe thereof
03/14/2012CN101453865B Heat sink fan
03/14/2012CN101415312B Radiating device
03/14/2012CN101335251B Semiconductor device, lead frame, and manufacturing method for the lead frame
03/14/2012CN101276801B Wafer with through-wafer vias and manufacture method thereof
03/14/2012CN101221959B Thin film transistor substrate and fabricating method thereof
03/14/2012CN101047174B Composite semiconductor device, LED head, and image forming apparatus
03/13/2012US8136071 Three dimensional integrated circuits and methods of fabrication
03/13/2012US8134835 Compression clamping of semiconductor components
03/13/2012US8134242 Integrated circuit package system with concave terminal
03/13/2012US8134241 Electronic elements and devices with trench under bond pad feature
03/13/2012US8134240 Semiconductor device and manufacturing method for the same
03/13/2012US8134239 Address line wiring structure and printed wiring board having same
03/13/2012US8134237 Electronic component and semiconductor device, method of fabricating the same, circuit board mounted with the same, and electronic appliance comprising the circuit board
03/13/2012US8134235 Three-dimensional semiconductor device
03/13/2012US8134234 Application of Mn for damage restoration after etchback
03/13/2012US8134233 Method and apparatus for providing electrically isolated closely spaced features on a printed circuit board
03/13/2012US8134232 Heat dissipation for integrated circuit
03/13/2012US8134230 Sealed joint structure of device and process using the same
03/13/2012US8134229 Layered chip package
03/13/2012US8134228 Semiconductor device for battery power voltage control
03/13/2012US8134227 Stacked integrated circuit package system with conductive spacer
03/13/2012US8134226 Processing apparatus with memories coupled to respective processors
03/13/2012US8134225 Quad flat no-lead chip carrier with standoff
03/13/2012US8134220 Two-terminal nanotube devices including a nanotube bridge and methods of making same
03/13/2012US8134211 Triggered silicon controlled rectifier for RF ESD protection
03/13/2012US8134210 Master, pixel array substrate, electro-optical device and methods of manufacturing the same
03/13/2012US8134187 Integrated mask-programmable logic devices with multiple metal levels and manufacturing process thereof
03/13/2012US8134158 TFT-LCD pixel unit and method for manufacturing the same
03/13/2012US8134149 Organic light emitting device
03/13/2012US8134114 Direct attach optical receiver module and method of testing
03/13/2012US8133821 Method of manufacturing porous insulating film, method of manufacturing semiconductor device, and semiconductor device
03/13/2012US8133813 Semiconductor device with a barrier film
03/13/2012US8133764 Embedded inductor and method of producing thereof
03/13/2012US8132709 Semiconductor device and method for manufacturing same
03/13/2012CA2453562C Voltage limiting protection for high frequency power device
03/08/2012WO2012031178A2 A light emitting apparatus
03/08/2012WO2012030470A2 Ramp-stack chip package with static bends
03/08/2012WO2012030469A2 Manufacturing fixture for a ramp-stack chip package
03/08/2012WO2012030421A1 Devices and methods
03/08/2012WO2012030420A2 Package for system level electronic products
03/08/2012WO2012029915A1 Transistor circuit, flip-flop, signal processing circuit, driver circuit, and display device
03/08/2012WO2012029865A1 Method for manufacturing multilayer wiring board
03/08/2012WO2012029762A1 Resin molded product and process for producing same, resin composition and process for producing same, and electronic component device
03/08/2012WO2012029712A1 Mounting structure for electronic component
03/08/2012WO2012029709A1 Amorphous silicon nitride film and method for producing same
03/08/2012WO2012029703A1 Input/output member, package for element accommodation and semiconductor device
03/08/2012WO2012029684A1 Light-emitting device, package for light-emitting device, and method for manufacturing package for light-emitting device
1 ... 395 396 397 398 399 400 401 402 403 404 405 406 407 408 409 410 411 412 413 414 415 ... 2262