Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2012
03/15/2012DE102011113212A1 Optoelektronisches bauelement Opto-electronic-device
03/15/2012DE102011079508A1 Cooling structure for semiconductor element, has cooling passage formed such that static pressure exerted on board in central section of pressure receiving area is lower than that exerted on board in end region of pressure receiving area
03/15/2012DE102011053362A1 Leistungs-halbleiterchip-verkapselung Power semiconductor chip encapsulation
03/15/2012DE102011053149A1 Die-Struktur, Die-Anordnung und Verfahren zum Prozessieren eines Dies The structure, the assembly and method for processing a This
03/15/2012DE102010045372A1 Producing a semiconductor module having two semiconductor chips and an interposer, which has electrically conductive structures, comprises imprinting the interposer directly on first one of the semiconductor chips
03/15/2012DE102010045055A1 Verfahren zur Herstellung eines Halbleiterbauelementes mit einer Durchkontaktierung und Halbleiterbauelement mit Durchkontaktierung A process for producing a semiconductor device having a via hole and semiconductor component with through-contact
03/15/2012DE102010040704A1 Verfahren zum Aufbauen einer elektrischen Schaltung und elektrische Schaltung A method of constructing an electrical circuit and electrical circuit
03/15/2012DE102010040558A1 Steuergerät und Verfahren zum Entwerfen einer Leiterplatte eines Steuergeräts Control device and method for designing a printed circuit board of a control unit
03/15/2012DE102009016354B4 Befestigungseinrichtung für zumindest einen Kühler Fastening device for at least a cooler
03/15/2012DE102007014363B4 Halbleitermodul und Verfahren zu dessen Herstellung Semiconductor module and method for its production
03/14/2012EP2429268A1 Thermal interface material for reducing thermal resistance and method of making the same
03/14/2012EP2429006A2 Method for manufacturing chip elements provided with wire insertion grooves
03/14/2012EP2428995A2 Gallium Nitride Based Semiconductor Devices and Methods of Manufacturing the Same
03/14/2012EP2428990A2 Electrical component assembly for thermal transfer
03/14/2012EP2428989A2 High-frequency circuit package and high-frequency circuit device
03/14/2012EP2428590A2 Sintered diamond having high thermal conductivity and method for producing the same and heat sink employing it
03/14/2012EP2427909A1 Panelized backside processing for thin semiconductors
03/14/2012EP2427908A1 A transition from a chip to a waveguide port
03/14/2012EP2427907A1 Variable capacitance integrated electronic circuit module
03/14/2012EP2427906A1 Thermally conductive foam product
03/14/2012EP2427905A1 Discontinuous thin semiconductor wafer surface features
03/14/2012EP2427714A1 Heat exchange device with an increased heat exchange coefficient and method for manufacturing such a device
03/14/2012EP1987169B8 Method of manufacturng a gold alloy
03/14/2012EP1609179B1 Internally reinforced bond pads
03/14/2012EP1497869B1 Semiconductor component comprising an integrated capacitor structure that has a plurality of metallization planes
03/14/2012EP1253172B1 Use of molded elastomer comprising crosslinkable fluoroelastomer composition for semiconductor production apparatus
03/14/2012DE202006021052U1 Wärmerohr-Kühlvorrichtung Heat pipe cooler
03/14/2012CN202168004U 一种大功率mosfet逆变半桥器件 One kind of half-bridge inverter power mosfet devices
03/14/2012CN202167999U 一种带真空泵的汽车交流发电机整流桥调节器总成 An automotive alternator rectifier bridge with a vacuum pump regulator assembly
03/14/2012CN202167991U 超低高度dc/dc电源模块 Ultra-low height dc / dc power modules
03/14/2012CN202167490U 分体式igbt晶体管与控制板的插接式安装结构 Split igbt transistors and plug-in control panel mounting structure
03/14/2012CN202167483U Igbt功率半桥模块 Igbt power half-bridge module
03/14/2012CN202167482U High-voltage silicon stack after secondary treating
03/14/2012CN202167481U 一种改进的4mm发光二极管封装结构 An improved light emitting diode package structure of 4mm
03/14/2012CN202167480U 一种qfn封装框架结构 One kind of framework qfn package
03/14/2012CN202167479U Surface mount type diode improved structure
03/14/2012CN202167478U 集成电路封装的改进结构 The integrated circuit package of improved structure
03/14/2012CN202167477U 一种提高双台面可控硅产品可靠性的封装结构 A double mesa SCR package structure to improve product reliability
03/14/2012CN202167476U 散热器的风扇扣具 Radiator fan clip
03/14/2012CN202167475U 一种金属与塑料混合封装的可控硅封装结构 SCR package a mix of metal and plastic packaging
03/14/2012CN202167474U Semiconductor assembly possessing adhesive coating
03/14/2012CN202167473U 一种制造半导体器件的陶瓷板 A method of manufacturing a semiconductor device of the ceramic plate
03/14/2012CN202167472U 芯片封装结构 Chip package structure
03/14/2012CN202167471U Controlled silicon solidly packaged by plastic material for silicon chip with large size
03/14/2012CN202166811U 一种阵列基板、液晶面板及显示设备 One kind of an array substrate, a liquid crystal panel and a display device
03/14/2012CN202166348U 均温板毛细成型结构 Average temperature of the plate forming capillary structure
03/14/2012CN1992247B Heat-radiating semiconductor chip, tape wiring substrate and tape package using the same
03/14/2012CN102379165A Conductor grid for electronic housings and manufacturing method
03/14/2012CN102379039A Wiring substrate, imaging device and imaging device module
03/14/2012CN102379038A Electronic device mounting structure and electronic device mounting method
03/14/2012CN102379037A Integrated circuit chip using top post-passivation technology and bottom structure technology
03/14/2012CN102379036A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
03/14/2012CN102378790A Epoxy resin composite
03/14/2012CN102378554A Circuit board with heating-conducting and heat-radiating structure
03/14/2012CN102378553A 散热器及其制造方法 And a method of manufacturing the heat sink
03/14/2012CN102378552A Radiating device and electronic device using same
03/14/2012CN102378550A Radiating device
03/14/2012CN102378548A Radiating device
03/14/2012CN102378484A Method for improving solder joint reliability, printed circuit board, packaging device and packaging module
03/14/2012CN102378477A 线路板及其制造方法 Circuit board and its manufacturing method
03/14/2012CN102377401A Electronic device, electronic apparatus, and electronic device manufacturing method
03/14/2012CN102376737A Integrated circuit embedded into MRAM(Magnetic Random Access Memory) and preparation method of integrated circuit
03/14/2012CN102376723A Sensor array substrate, display device including the same, and method of manufacturing the sensor array substrate
03/14/2012CN102376710A Integrated circuit including interconnect levels
03/14/2012CN102376703A Edge devices layout for improved performance
03/14/2012CN102376693A Monolithic magnetic induction device
03/14/2012CN102376692A Isolated epitaxial modulation device
03/14/2012CN102376691A Semiconductor device and stacked semiconductor apparatus
03/14/2012CN102376690A Electronic component and method of manufacturing electronic component
03/14/2012CN102376689A Through silicon hole structure with step and manufacture process of through silicon hole
03/14/2012CN102376688A Interconnection structure for interposer and packaging component having the same
03/14/2012CN102376687A 半导体元件封装结构及其制造方法 The semiconductor device package structure and method for manufacturing
03/14/2012CN102376686A Semiconductor device and production method thereof
03/14/2012CN102376685A Electric fuse structure and formation method thereof
03/14/2012CN102376684A Copper interconnecting structure and manufacturing method thereof
03/14/2012CN102376683A Seal ring structure with metal pad
03/14/2012CN102376682A Semiconductor device and formation method thereof
03/14/2012CN102376681A Package substrate
03/14/2012CN102376680A Stacked semiconductor package and stacking method thereof
03/14/2012CN102376679A Package substrate and flip chip package including the same
03/14/2012CN102376678A Chip scale package and manufacturing method thereof
03/14/2012CN102376677A Semiconductor encapsulating structure and manufacturing method thereof
03/14/2012CN102376676A Package substrate embedded with semiconductor chip
03/14/2012CN102376675A Packaging structure with embedded semiconductor element and manufacturing method thereof
03/14/2012CN102376674A Packaging structure with embedded semi-conductor element
03/14/2012CN102376673A Packaging substrate and formation method thereof
03/14/2012CN102376672A Foundation island-free ball grid array packaging structure and manufacturing method thereof
03/14/2012CN102376671A Lead frame and flip-chip type semiconductor packaging structure using the same
03/14/2012CN102376670A 半导体封装件 The semiconductor package
03/14/2012CN102376669A 半导体器件 Semiconductor devices
03/14/2012CN102376668A Flip chip package and semiconductor chip
03/14/2012CN102376667A Package apparatus and method for making same
03/14/2012CN102376666A Ball grid array packaging structure and manufacturing method thereof
03/14/2012CN102376665A Semiconductor structure and manufacture method thereof
03/14/2012CN102376664A Semiconductor device, semiconductor circuit substrate, and method of manufacturing semiconductor circuit substrate
03/14/2012CN102376663A Thick-film circuit board having novel pin
03/14/2012CN102376662A System packaging module provided with ball grid array and production method thereof
03/14/2012CN102376661A Semiconductor power module
03/14/2012CN102376660A Radiating device
03/14/2012CN102376659A Radiating structure of heat source
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