Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2012
03/20/2012US8138570 Isolated junction field-effect transistor
03/20/2012US8138569 Guard ring structures and method of fabricating thereof
03/20/2012US8138566 Integrated circuit chip made secure against the action of electromagnetic radiation
03/20/2012US8138550 Method of manufacturing a semiconductor device and a semiconductor device
03/20/2012US8138549 System for displaying images
03/20/2012US8138498 Apparatus and methods for determining overlay of structures having rotational or mirror symmetry
03/20/2012US8138497 Test structure for detecting via contact shorting in shallow trench isolation regions
03/20/2012US8138428 Lead-embedded metallized ceramics substrate and package
03/20/2012US8138276 Silicone containing encapsulant
03/20/2012US8138079 Method of wire bonding over active area of a semiconductor circuit
03/20/2012US8138065 Solid-state imaging device and method for manufacturing the same
03/20/2012US8138025 Microcap wafer bonding method and apparatus
03/20/2012US8138024 Package system for shielding semiconductor dies from electromagnetic interference
03/20/2012US8138016 Large area integration of quartz resonators with electronics
03/20/2012US8137791 Fuse and pad stress relief
03/20/2012US8137438 Methods and materials for the reduction and control of moisture and oxygen in OLED devices
03/20/2012US8136725 IC card
03/20/2012US8136581 Heat transport apparatus and heat transport apparatus manufacturing method
03/20/2012US8136238 Methods for manufacturing semiconductor devices
03/20/2012US8136223 Apparatus for forming a wireless communication device
03/20/2012CA2669122C Cu-ni-si-co copper alloy for electronic materials and method for manufacturing same
03/19/2012DE202011052204U1 WLCSP für kleine, hochvolumige Chips WLCSP for small, high-volume chip
03/16/2012DE202012100573U1 Befestigungsstruktur eines Kühlkörpers mit Kühlrippen Mounting structure of a heat sink with cooling fins
03/15/2012WO2012034052A1 Semiconductor chip device with polymeric filler trench
03/15/2012WO2012034034A1 Semiconductor chip with redundant thru-silicon-vias
03/15/2012WO2012033641A1 Monolithic microwave integrated circuit
03/15/2012WO2012033640A1 Configurable power switch cells and methodology
03/15/2012WO2012033172A1 Semiconductor device production method and rinse
03/15/2012WO2012033161A1 Cover glass for packaging semiconductor material, and process for production thereof
03/15/2012WO2012031845A1 Method for producing a semiconductor component with a through-contact and semiconductor component with through-contact
03/15/2012WO2012031704A1 Method for coating an optoelectronic chip-on-board module and optoelectronic chip-on-board-module
03/15/2012WO2012031703A1 Coating method for an optoelectronic chip-on-board module
03/15/2012WO2012031517A1 Design method of multilayer printed circuit board and multilayer printed circuit board
03/15/2012WO2012031385A1 Warm white light led chip with high brightness and high color rendering
03/15/2012WO2012031362A1 Methods, apparatus and system to support large-scale micro- systems including embedded and distributed power supply, thermal regulation, multi-distributed-sensors and electrical signal propagation
03/15/2012WO2011161514A3 Pick and bond method for attachment of adhesive element to substrate
03/15/2012WO2011107044A3 Waterproof structure for bonding pad, waterproof bonding pad and method for forming waterproof structure
03/15/2012US20120063190 Complex semiconductor device for use in mobile equipment
03/15/2012US20120063090 Cooling mechanism for stacked die package and method of manufacturing the same
03/15/2012US20120061861 Resin composition for encapsulating semiconductor and semiconductor device
03/15/2012US20120061860 Method for Constructing an Electrical Circuit, and Electrical Circuit
03/15/2012US20120061859 Integrated circuit packaging system with encapsulant containment and method of manufacture thereof
03/15/2012US20120061858 Semiconductor Device and Method of Forming Mold Underfill Using Dispensing Needle Having Same Width as Semiconductor Die
03/15/2012US20120061857 Electronic Packaging With A Variable Thickness Mold Cap
03/15/2012US20120061856 Apparatus and Methods for High-Density Chip Connectivity
03/15/2012US20120061855 Integrated circuit packaging system with film encapsulation and method of manufacture thereof
03/15/2012US20120061854 Integrated circuit packaging system with package-on-package and method of manufacture thereof
03/15/2012US20120061853 Semiconductor chip device with underfill
03/15/2012US20120061852 Semiconductor chip device with polymeric filler trench
03/15/2012US20120061851 Simulated wirebond semiconductor package
03/15/2012US20120061850 Semiconductor device and method of manufacturing the same
03/15/2012US20120061849 Semiconductor component and device provided with heat dissipation means
03/15/2012US20120061848 Chip assembly with a coreless substrate employing a patterned adhesive layer
03/15/2012US20120061847 Semiconductor device and manufacturing method thereof
03/15/2012US20120061846 Compliant printed circuit area array semiconductor device package
03/15/2012US20120061845 Methods for filling a contact hole in a chip package arrangement and chip package arrangements
03/15/2012US20120061844 Copper alloy for wiring, semiconductor device, method for forming wiring, and method for manufacturing semiconductor device
03/15/2012US20120061843 Semiconductor package and method for manufacturing the same
03/15/2012US20120061842 Stack package and method for manufacturing the same
03/15/2012US20120061841 Semiconductor integrated circuit, manufacturing method thereof, and semiconductor device using semiconductor integrated circuit
03/15/2012US20120061840 Damascene interconnection structure and dual damascene process thereof
03/15/2012US20120061839 Metal cap layer with enhanced etch resistivity for copper-based metal regions in semiconductor devices
03/15/2012US20120061838 Barrier layer formation for metal interconnects through enhanced impurity diffusion
03/15/2012US20120061837 Method of manufacturing semiconductor device and semiconductor device
03/15/2012US20120061836 SPRAY PYROLYSIS OF Y-DOPED ZnO
03/15/2012US20120061835 Die structure, die arrangement and method of processing a die
03/15/2012US20120061834 Semiconductor chip, stacked chip semiconductor package including the same, and fabricating method thereof
03/15/2012US20120061833 Embedded ball grid array substrate and manufacturing method thereof
03/15/2012US20120061832 Collar structure around solder balls that connect semiconductor die to semiconductor chip package substrate
03/15/2012US20120061831 Semiconductor package and method for making the same
03/15/2012US20120061830 Back side protective structure for a semiconductor package
03/15/2012US20120061829 Method for manufacturing substrate for semiconductor element, and semiconductor device
03/15/2012US20120061828 Semiconductor device and layout method of semiconductor device
03/15/2012US20120061827 Semiconductor device
03/15/2012US20120061826 Semiconductor device
03/15/2012US20120061825 Chip scale package and method of fabricating the same
03/15/2012US20120061824 Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in fo-wlcsp
03/15/2012US20120061823 Semiconductor device having pad structure with stress buffer layer
03/15/2012US20120061822 Semiconductor Device and Method of Forming Base Substrate With Cavities Formed Through Etch-Resistant Conductive Layer for Bump Locking
03/15/2012US20120061821 Semiconductor chip with redundant thru-silicon-vias
03/15/2012US20120061820 Method for manufacturing electronic component, and electronic component
03/15/2012US20120061819 Semiconductor Module and Method for Production Thereof
03/15/2012US20120061818 3-D Integrated Semiconductor Device Comprising Intermediate Heat Spreading Capabilites
03/15/2012US20120061817 Semiconductor device and manufacturing method of the same
03/15/2012US20120061816 Semiconductor package and method of fabricating the same
03/15/2012US20120061815 Power semiconductor module having sintered metal connections, preferably sintered silver connections, and production method
03/15/2012US20120061814 Semiconductor Device and Method of Forming Leadframe Interposer Over Semiconductor Die and TSV Substrate for Vertical Electrical Interconnect
03/15/2012US20120061813 Package Structure for DC-DC Converter
03/15/2012US20120061812 Power Semiconductor Chip Package
03/15/2012US20120061811 Apparatus and method configured to lower thermal stresses
03/15/2012US20120061810 Led lead frame having different mounting surfaces
03/15/2012US20120061809 Method for manufacturing substrate for semiconductor element, and semiconductor device
03/15/2012US20120061808 Semiconductor packages having increased input/output capacity and related methods
03/15/2012US20120061797 Semiconductor device and method of fabricating the same
03/15/2012US20120061796 Programmable anti-fuse wire bond pads
03/15/2012US20120061794 Methods of forming through wafer interconnects in semiconductor structures using sacrificial material, and semiconductor structures formed by such methods
03/15/2012US20120061786 Isolated bond pad with conductive via interconnect
03/15/2012US20120061669 Chip on film (cof) package having test line for testing electrical function of chip and method for manufacturing same
03/15/2012US20120061337 Photovoltaic module mounting system
03/15/2012US20120060901 Profile rail, support element and solar module arrangement formed therewith, in particular for transversal mounting of solar modules
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