Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2012
03/21/2012CN102382422A Epoxy resin composition with hydrated alumina
03/21/2012CN102382421A Liquid epoxy resin packaging material and preparation method thereof
03/21/2012CN101989586B Metal terminal and construction method thereof
03/21/2012CN101988655B Street lamp with high-power light-emitting diode (LED) single polycrystalline chip die set
03/21/2012CN101950746B Pixel structure
03/21/2012CN101930963B Segment difference type ceramic copper-clad plate unit and manufacturing method thereof
03/21/2012CN101930953B Semiconductor device assembly and radiator assembly
03/21/2012CN101924099B Light-emitting diode device
03/21/2012CN101922615B LED lamp
03/21/2012CN101908521B Semiconductor device and method of manufacturing the same
03/21/2012CN101886802B Lamp
03/21/2012CN101883483B Three-plate mini-type heat radiator
03/21/2012CN101866900B Copper bonding wire, bonding wire joint structure and bonding wire processing and jointing method
03/21/2012CN101866895B 芯片结构及其形成方法 Chip structure and method of forming
03/21/2012CN101853842B Package structure for chip and method for forming the same
03/21/2012CN101836282B Mos structures that exhibit lower contact resistance and methods for fabricating the same
03/21/2012CN101794774B Semiconductor integrated circuit
03/21/2012CN101789383B Method for making packaging substrate with recess structure
03/21/2012CN101752370B Transistor-type protection device and semiconductor integrated circuit
03/21/2012CN101719489B Ultra-low parasitic ESD protection device
03/21/2012CN101713618B A flow distributor assembly and a cooling unit with a flow distributor assembly
03/21/2012CN101711434B Led lighting device
03/21/2012CN101652051B Portable electronic device and manufacturing method and scent supplementing method thereof
03/21/2012CN101636065B Heat sink
03/21/2012CN101621909B Heat sink
03/21/2012CN101621907B Heat sink
03/21/2012CN101587886B Electronic device package and fabrication method thereof
03/21/2012CN101581444B Light emitting diode lighting device
03/21/2012CN101573018B Radiating device
03/21/2012CN101567344B Semiconductor chip encapsulating structure capable of reaching front-surface electric conduction and preparing method thereof
03/21/2012CN101548376B One-time-programmable logic bit with multiple logic elements
03/21/2012CN101533813B Contact bonding pad for reducing parasitic capacitance and manufacturing method thereof
03/21/2012CN101527313B Metal oxide semiconductor element and manufacturing method thereof
03/21/2012CN101512724B Design rules for on-chip inductors
03/21/2012CN101506309B Curable solidified organic group polysiloxane composition and semiconductor device
03/21/2012CN101470499B Heat radiator and fastening spring sheet used for the same
03/21/2012CN101466232B Radiating device
03/21/2012CN101466229B Radiating device
03/21/2012CN101443907B Assembly, chip and method of operating
03/21/2012CN101420834B Heat Radiation device
03/21/2012CN101416311B Clipless and wireless semiconductor die package and method for making the same
03/21/2012CN101393902B Flip chip structure and method of manufacture
03/21/2012CN101383364B Image sensor and method for manufacturing same
03/21/2012CN101355074B 半导体器件封装 The semiconductor device package
03/21/2012CN101350349B Semiconductor device and method for fabricating the same
03/21/2012CN101326867B Arrangement comprising at least one electronic component
03/21/2012CN101317263B Sensor device and method for manufacturing same
03/21/2012CN101316492B Fastener for heat sink and combination of cooling device
03/21/2012CN101286456B Wiring board manufacturing method, semiconductor device manufacturing method and wiring board
03/21/2012CN101246875B Semiconductor device and method for fabricating the same
03/21/2012CN101243551B A novel method for wafer processing
03/21/2012CN101241917B Semiconductor device, method of manufacturing semiconductor device, and electronic apparatus
03/21/2012CN101241883B Preparation method of a coating of gallium nitride
03/21/2012CN101226923B Semiconductor structure with field shield and method of forming the structure
03/21/2012CN101202268B Semiconductor device for measuring an overlay error, method for measuring an overlay error, lithographic apparatus and device manufacturing method
03/21/2012CN101154646B Metal line in semiconductor device and method for forming the same
03/21/2012CN101075620B Non-volatile memory integrated circuit device and method of fabricating the same
03/21/2012CN101038906B Interlayer connecting line structure of three-dimensional storage and method for making the same
03/20/2012US8139356 Plunger security lock and personal electronic device configured to be secured by the plunger lock
03/20/2012US8139332 Level conversion circuit and semiconductor integrated circuit device employing the level conversion circuit
03/20/2012US8139327 Semiconductor integrated circuit
03/20/2012US8139217 Alignment systems and methods for lithographic systems
03/20/2012US8138768 Sensing circuit for devices with protective coating
03/20/2012US8138757 Manufacturing method for magnetic sensor and lead frame therefor
03/20/2012US8138617 Apparatus and method for packaging circuits
03/20/2012US8138616 Bond pad structure
03/20/2012US8138615 Semiconductor integrated circuit providing for wire bonding directly above an active circuit region, and manufacturing method thereof
03/20/2012US8138614 Semiconductor device having an antenna with anisotropic conductive adhesive
03/20/2012US8138613 Microelectronic devices
03/20/2012US8138612 Semiconductor device
03/20/2012US8138611 Semiconductor device having shifted stacked chips
03/20/2012US8138610 Multi-chip package with interconnected stacked chips
03/20/2012US8138609 Semiconductor device and method of manufacturing semiconductor device
03/20/2012US8138608 Integrated circuit package substrate having configurable bond pads
03/20/2012US8138607 Metal fill structures for reducing parasitic capacitance
03/20/2012US8138606 Wiring conductor, method for fabricating same, terminal connecting assembly, and Pb-free solder alloy
03/20/2012US8138605 Multiple layer barrier metal for device component formed in contact trench
03/20/2012US8138604 Metal cap with ultra-low k dielectric material for circuit interconnect applications
03/20/2012US8138603 Redundancy design with electro-migration immunity
03/20/2012US8138602 Solder interconnect pads with current spreading layers
03/20/2012US8138601 Ultrasonic measuring method, electronic component manufacturing method, and semiconductor package
03/20/2012US8138600 Semiconductor device and method of manufacturing the same
03/20/2012US8138599 Wireless communication device integrated into a single package
03/20/2012US8138597 Semiconductor assembly that includes a power semiconductor die located in a cell defined by a patterned polymer layer
03/20/2012US8138596 Method for manufacturing an element having electrically conductive members for application in a microelectronic package
03/20/2012US8138595 Integrated circuit packaging system with an intermediate pad and method of manufacture thereof
03/20/2012US8138593 Packaged microchip with spacer for mitigating electrical leakage between components
03/20/2012US8138592 Planar array contact memory cards
03/20/2012US8138591 Integrated circuit package system with stacked die
03/20/2012US8138590 Integrated circuit package system with wire-in-film encapsulation
03/20/2012US8138589 Semiconductor device and method of fabricating the same
03/20/2012US8138587 Device including two mounting surfaces
03/20/2012US8138586 Integrated circuit package system with multi-planar paddle
03/20/2012US8138585 Four mosfet full bridge module
03/20/2012US8138584 Method of forming a semiconductor package and structure thereof
03/20/2012US8138581 Semiconductor device with channel stop trench and method
03/20/2012US8138580 Adhesive composition for electronic components, and adhesive sheet for electronic components using the same
03/20/2012US8138579 Structures and methods of forming SiGe and SiGeC buried layer for SOI/SiGe technology
03/20/2012US8138578 Method and system for creating self-aligned twin wells with co-planar surfaces in a semiconductor device
03/20/2012US8138577 Pulse-laser bonding method for through-silicon-via based stacking of electronic components
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