Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2012
03/22/2012US20120068299 Transient voltage suppressors
03/22/2012US20120068223 Bidirectional protection component
03/22/2012US20120068186 Electronic Device
03/22/2012US20120068176 Semiconductor device and method of manufacturing semiconductor device
03/22/2012US20120068175 Method to Optimize and Reduce Integrated Circuit, Package Design, and Verification Cycle Time
03/22/2012US20120068174 Electrical mask inspection
03/22/2012US20120068106 Resin composition and semiconductor device produced by using the same
03/22/2012US20120068078 Radiation detector, imaging device and electrode structure thereof, and method for acquiring an image
03/22/2012US20120067633 Multi-layer printed circuit board and method of manufacturing multi-layer printed circuit board
03/22/2012US20120067628 Printed wiring board
03/22/2012DE102011113781A1 Vorrichtung und Verfahren zur Herstellung einer Vorrichtung Apparatus and method for manufacturing a device
03/22/2012DE102011082715A1 Die package used for a semiconductor device comprises a leadframe containing a die attach pad, a conductive layer on a portion of the die attach pad, a boundary feature comprising a bond wire, and a die on the conductive layer
03/22/2012DE102011053519A1 Elektronisches Bauelement Electronic component
03/22/2012DE102011004238A1 Dichtringstruktur mit Metallpad Sealing ring structure with metal pad
03/22/2012DE102010046214A1 Wafer test structure has interface that is connected to integrated test circuit, for receiving and outputting test data
03/22/2012DE102010045783A1 Trägersubstrat für ein optoelektronisches Bauelement, Verfahren zu dessen Herstellung und optoelektronisches Bauelement A carrier substrate for an optoelectronic component, to processes for its preparation and optoelectronic component
03/22/2012DE102010041129A1 Multifunktionssensor als PoP-mWLP Multifunction sensor as PoP mWLP
03/22/2012DE102010041101A1 Bauelement mit einer Durchkontaktierung Component with a via
03/22/2012DE102007019523B4 Halbleiterleistungsmodul The semiconductor power module
03/22/2012DE102007006447B4 Elektronisches Modul und Verfahren zur Herstellung des elektronischen Moduls An electronic module and method for manufacturing the electronic module
03/22/2012DE102005036116B4 Leistungshalbleitermodul The power semiconductor module
03/21/2012EP2432106A1 Electric vehicle, and method for cooling vehicular dc/dc-converter
03/21/2012EP2432014A1 Semiconductor device
03/21/2012EP2432013A2 Sealing member for electronic component package and electronic component package
03/21/2012EP2432012A1 Heat exchanger, semiconductor device, method for manufacturing the heat exchanger, and method for manufacturing the semiconductor device
03/21/2012EP2430701A1 Miniature microwave component for surface-mounting
03/21/2012EP2430657A1 Integrated circuit and integrated circuit package
03/21/2012EP2430656A1 System-in packages
03/21/2012EP2430655A1 Power semiconductor heatsinking
03/21/2012EP2345070B1 High-yield method of exposing and contacting through-silicon vias
03/21/2012CN202172359U 一种新型mosfmt模块 A new mosfmt module
03/21/2012CN202172066U 一种igbt模块和双层铜排电连接结构 One kind igbt module and double copper electrical connection structure
03/21/2012CN202172065U 一种to3p防水密封引线框架 One kind to3p watertight seal leadframe
03/21/2012CN202172064U 一种预覆焊料层的气密性封装盖板 One kind of pre-coating the solder layer cover plate hermetic package
03/21/2012CN1837220B Method for producing borazine compound
03/21/2012CN102388473A Light-emitting diode package
03/21/2012CN102388455A Semiconductor device and method for manufacturing semiconductor device
03/21/2012CN102388453A Robust ESD protection circuit, method and design structure for tolerant and failsafe designs
03/21/2012CN102388413A Active element substrate and manufacturing method thereof, and display apparatus using active element substrate manufactured by this manufacturing method
03/21/2012CN102388163A Masking jig, substrate heating apparatus, and film formation method
03/21/2012CN102388161A Method for forming manganese oxide film, method for manufacturing semiconductor device, and semiconductor device
03/21/2012CN102388100A Liquid sealing resin composition, semiconductor device using liquid sealing resin composition, and method for producing same
03/21/2012CN102388090A Optical device and method of producing the same
03/21/2012CN102387692A Radiating fin of electronic component
03/21/2012CN102387691A Aluminum profile for radiator
03/21/2012CN102387690A Aluminum profile for radiator
03/21/2012CN102387659A Printed circuit board and production method thereof
03/21/2012CN102386620A Electrostatic discharge protecting device and method thereof
03/21/2012CN102386320A Semiconductor apparatus, inspection method thereof and electric device
03/21/2012CN102386225A Lateral double-diffused metal oxide semiconductor device and manufacturing method thereof
03/21/2012CN102386190A Semiconductor device and method of double photolithography process for forming patterns of the semiconductor device
03/21/2012CN102386180A Semiconductor integrated circuit
03/21/2012CN102386173A Edge connect wafer level stacking microelectronic package and manufacturing method thereof
03/21/2012CN102386172A 半导体集成电路 The semiconductor integrated circuit
03/21/2012CN102386171A Multi-chip packaging structure
03/21/2012CN102386169A Electromigration test structure of silicon through hole metal interconnection wire
03/21/2012CN102386168A Alignment marks in substrate having through-substrate via
03/21/2012CN102386167A Structure of semiconductor device
03/21/2012CN102386166A Wafer level package including a device wafer integrated with a passive component
03/21/2012CN102386165A Chip package and manufacturing method thereof
03/21/2012CN102386164A Semiconductor device and manufacturing method of semiconductor device
03/21/2012CN102386163A Two-row lead frame for plastic encapsulated device for light-controlled device and sound-controlled device
03/21/2012CN102386162A Semiconductor memory card and manufacture method thereof
03/21/2012CN102386161A Multi-chip packages and manufacturing method thereof
03/21/2012CN102386160A Semiconductor device and manufacturing method of semiconductor device
03/21/2012CN102386159A Power system with a flexible connection device
03/21/2012CN102386158A Semiconductor device and manufacture method thereof
03/21/2012CN102386157A 半导体结构及其形成方法 And a method for forming a semiconductor structure
03/21/2012CN102386156A Chip package
03/21/2012CN102386155A Semiconductor device and method for forming light-emitting diode component
03/21/2012CN102386154A Method for manufacturing heat pipe radiator
03/21/2012CN102386153A Assembly used for fixing transistor
03/21/2012CN102386152A Automobile power amplifier integrated circuit (IC) fixed elastic sheet
03/21/2012CN102386151A Semiconductor chip packaging structure
03/21/2012CN102386150A Micro chip packaging structure
03/21/2012CN102386149A Contacting means and method for contacting electrical components
03/21/2012CN102386148A Connection device for power semiconductor module
03/21/2012CN102386147A Semiconductor device and manufacturing method of semiconductor device
03/21/2012CN102386146A 电子装置 Electronic devices
03/21/2012CN102386145A Electronic device including a feature in a trench
03/21/2012CN102386144A 芯片 Chip
03/21/2012CN102386143A 电路装置 Circuit means
03/21/2012CN102386130A Forming method of dual-stress liner semiconductor device
03/21/2012CN102386125A Method for preparing semiconductor structure for detection by transmission electron microscope, and semiconductor structure
03/21/2012CN102386113A Semiconductor device and method of manufacturing same
03/21/2012CN102386112A Method of manufacturing semiconductor device
03/21/2012CN102386111A Method for manufacturing electronic parts device and resin composition for electronic parts encapsulation
03/21/2012CN102386108A Semiconductor device and method of forming adhesive material over semiconductor die and carrier
03/21/2012CN102386107A Packaging method with four flat sides and without pin and structure manufactured by packaging method
03/21/2012CN102386105A Packaging method with four flat sides and without pin and structure manufactured by packaging method
03/21/2012CN102386103A Method for manufacturing package substrate, and package substrate structure
03/21/2012CN102386056A 半导体器件及其制造方法 Semiconductor device and manufacturing method thereof
03/21/2012CN102385911A 半导体存储器件 The semiconductor memory device
03/21/2012CN102385675A Semiconductor integrated circuit device
03/21/2012CN102385179A Fan-out line
03/21/2012CN102383160A Electroplating electric-conducting device for integrated circuit lead frame
03/21/2012CN102382613A Adhesive composition, circuit connecting material, connection structure of circuit member, and semiconductor device
03/21/2012CN102382587A Film for flip chip type semiconductor back surface and its use
03/21/2012CN102382586A Film for flip chip type semiconductor back surface
03/21/2012CN102382585A Film for flip chip type semiconductor back surface, process for producing strip film for semiconductor back surface, and flip chip type semiconductor device
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