Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
03/2012
03/27/2012US8143709 Semiconductor package having solder ball which has double connection structure
03/27/2012US8143708 Semiconductor device and method for manufacturing the same
03/27/2012US8143707 Semiconductor device
03/27/2012US8143697 Method, apparatus, and system for low temperature deposition and irradiation annealing of thin film capacitor
03/27/2012US8143695 Contact fuse one time programmable memory
03/27/2012US8143694 Fuse device
03/27/2012US8143692 Capacitance trimming circuit of semiconductor device having vertically stacked capacitor layers and operation method thereof
03/27/2012US8143691 Semiconductor device and method for making the same
03/27/2012US8143674 Semiconductor devices having resistors
03/27/2012US8143673 Circuit with electrostatic discharge protection
03/27/2012US8143672 Semiconductor device including a metal layer having a first pattern and a second pattern which together form a web structure, thereby providing improved electrostatic discharge protection
03/27/2012US8143157 Fabrication of a diffusion barrier cap on copper containing conductive elements
03/27/2012US8143124 Methods of making power semiconductor devices with thick bottom oxide layer
03/27/2012US8143123 Methods of forming inter-poly dielectric (IPD) layers in power semiconductor devices
03/27/2012US8143108 Semiconductor device and method of dissipating heat from thin package-on-package mounted to substrate
03/27/2012US8143102 Integrated circuit package system including die having relieved active region
03/27/2012US8143100 Method of fabricating a semiconductor multi-package module having wire bond interconnect between stacked packages
03/27/2012US8143096 Integrated circuit package system flip chip
03/27/2012US8142605 Circuit-connecting material and circuit terminal connected structure and connecting method
03/27/2012US8142602 Method for mounting semiconductor device
03/27/2012US8141247 Method of a package on package packaging
03/27/2012US8141240 Manufacturing method for micro-SD flash memory card
03/27/2012CA2475491C Lead-free tin-silver-copper alloy solder composition
03/26/2012DE202012002623U1 Kühlmodul Cooling module
03/26/2012DE202012000486U1 Wärmeableitende Rippe und wärmeableitende Vorrichtung Heat dissipating fin and heat-dissipating device
03/22/2012WO2012037492A2 Multi-die mems package
03/22/2012WO2012037263A1 Electronic packaging with a variable thickness mold cap
03/22/2012WO2012037220A1 Multi-function and shielded 3d interconnects
03/22/2012WO2012037216A2 Staged via formation from both sides of chip
03/22/2012WO2012037140A2 Integrated circuits with through-substrate vias
03/22/2012WO2012036922A1 Multiple contact probes
03/22/2012WO2012036844A1 Systems and methods for integrating radio-frequency indentification circuitry into flexible circuits
03/22/2012WO2012036731A1 Disaster resistant server enclosure with cold thermal storage device and server cooling device
03/22/2012WO2012036219A1 Light-emitting element substrate and light-emitting device
03/22/2012WO2012035680A1 Power module and manufacturing method for same
03/22/2012WO2012035484A1 Embedded transient voltage suppression for light emitting devices
03/22/2012WO2012035428A1 Optical coupling device, opticalsystem and methods of assembly
03/22/2012WO2012034826A1 Optoelectronic component and method for producing it
03/22/2012WO2012034752A1 Carrier substrate for an optoelectronic component, method for producing same and optoelectronic component
03/22/2012WO2012034383A1 Multi-layer through-hole stacked layer structure
03/22/2012WO2012034332A1 Led integral structure with cooling equipment
03/22/2012WO2011138684A3 Pick and bond method and apparatus for transferring adhesive element to substrate
03/22/2012WO2011138674A3 Method and apparatus for placing adhesive element on a matrix
03/22/2012WO2011132069A3 Power semiconductor device packaging
03/22/2012WO2009117670A3 Self-aligned barrier layers for interconnects
03/22/2012US20120071037 Elastic contact device for electronic components with buckling columns
03/22/2012US20120068366 Selective etch chemistries for forming high aspect ratio features and associated structures
03/22/2012US20120068365 Metal can impedance control structure
03/22/2012US20120068364 Device and Method for Manufacturing a Device
03/22/2012US20120068363 Integrated circuit packaging system with die paddles and method of manufacture thereof
03/22/2012US20120068362 Semiconductor device having semiconductor member and mounting member
03/22/2012US20120068361 Stacked multi-die packages with impedance control
03/22/2012US20120068360 Stacked Semiconductor Device Assembly
03/22/2012US20120068359 Semiconductor device and method for manufacturing semiconductor device
03/22/2012US20120068358 Semiconductor package and method for making the same
03/22/2012US20120068357 Semiconductor device and power semiconductor device
03/22/2012US20120068356 Component having a VIA
03/22/2012US20120068355 Semiconductor device and method for manufacturing the same
03/22/2012US20120068354 Semiconductor memory device and method for manufacturing the same
03/22/2012US20120068353 Semiconductor Device and Method of Forming Dam Material With Openings Around Semiconductor Die for Mold Underfill Using Dispenser and Vacuum Assist
03/22/2012US20120068352 Stacked chip assembly having vertical vias
03/22/2012US20120068351 Chip assembly having via interconnects joined by plating
03/22/2012US20120068350 Semiconductor packages, electronic devices and electronic systems employing the same
03/22/2012US20120068349 Tape package
03/22/2012US20120068348 Interconnect Regions
03/22/2012US20120068347 Method for processing semiconductor structure and device based on the same
03/22/2012US20120068346 Structure for nano-scale metallization and method for fabricating same
03/22/2012US20120068345 Layer stacks and integrated circuit arrangements
03/22/2012US20120068344 Interconnect structure with a planar interface between a selective conductive cap and a dielectric cap layer
03/22/2012US20120068343 Semiconductor device and method for manufacturing the same
03/22/2012US20120068342 Electrically conductive adhesive for temporary bonding
03/22/2012US20120068341 Method for Depackaging Prepackaged Integrated Circuit Die and a Product from the Method
03/22/2012US20120068340 Ball grid array semiconductor package and method of manufacturing the same
03/22/2012US20120068339 VLSI Package for High Performance Integrated Circuit
03/22/2012US20120068338 Impedance controlled packages with metal sheet or 2-layer rdl
03/22/2012US20120068337 Semiconductor Device and Method of Forming Composite Bump-on-Lead Interconnection
03/22/2012US20120068335 Printed circuit board having hexagonally aligned bump pads for substrate of semiconductor package, and semiconductor package including the same
03/22/2012US20120068334 Semiconductor device and manufacturing method thereof
03/22/2012US20120068333 Wire Bond Through-Via Structure and Method
03/22/2012US20120068332 Integrated circuit packaging system with post and method of manufacture thereof
03/22/2012US20120068331 Microsprings Partially Embedded In A Laminate Structure And Methods For Producing Same
03/22/2012US20120068330 Staged via formation from both sides of chip
03/22/2012US20120068329 Semiconductor device
03/22/2012US20120068328 Integrated circuit packaging system with active surface heat removal and method of manufacture thereof
03/22/2012US20120068327 Multi-function and shielded 3d interconnects
03/22/2012US20120068326 Anti-tamper microchip package based on thermal nanofluids or fluids
03/22/2012US20120068325 Substrate bonding with metal germanium silicon material
03/22/2012US20120068324 Semiconductor device
03/22/2012US20120068323 Semiconductor device package and method of making a semiconductor device package
03/22/2012US20120068322 Package substrate, module and electric/electronic devices using the same
03/22/2012US20120068321 Semiconductor device
03/22/2012US20120068320 Integrated Power Converter Package With Die Stacking
03/22/2012US20120068319 Integrated circuit packaging system with stack interconnect and method of manufacture thereof
03/22/2012US20120068318 Integrated circuit packaging system with paddle molding and method of manufacture thereof
03/22/2012US20120068317 Tsop with impedance control
03/22/2012US20120068316 Transition from a chip to a waveguide port
03/22/2012US20120068315 Method of improving mechanical properties of semiconductor interconnects with nanoparticles
03/22/2012US20120068313 Semiconductor device and method of forming conductive TSV with insulating annular ring
03/22/2012US20120068312 Adhesive sheet and method for manufacturing the same, semiconductor device manufacturing method and semiconductor device
03/22/2012US20120068302 Electronic device and method for direct mounting of passive components
1 ... 390 391 392 393 394 395 396 397 398 399 400 401 402 403 404 405 406 407 408 409 410 ... 2262