Patents
Sitemap › H01 - Basic electric elements › H01L - Semiconductor devices; Electric solid state devices not otherwise provided for › H01L 23 - Details of semiconductor or other solid state devices
Patents for H01L 23 - Details of semiconductor or other solid state devices (226,155)
12/2014
12/18/2014US20140367866 Memory module in a package
12/18/2014US20140367865 Leadless integrated circuit package having standoff contacts and die attach pad
12/18/2014US20140367864 Semiconductor device and method for producing same
12/18/2014US20140367863 Semiconductor device
12/18/2014US20140367862 Semiconductor device with internal substrate contact and method of production
12/18/2014US20140367861 Semiconductor device and semiconductor device fabrication method
12/18/2014US20140367860 Semiconductor packages including heat diffusion vias and interconnection vias
12/18/2014US20140367859 Tin-based wirebond structures
12/18/2014US20140367858 Thin Film Devices and Low Temperature Process To Make Thin Film Devices
12/18/2014US20140367857 Method and Apparatus for Back End of Line Semiconductor Device Processing
12/18/2014US20140367856 Semiconductor manufacturing process and structure thereof
12/18/2014US20140367855 Self-Aligned Via Interconnect Using Relaxed Patterning Exposure
12/18/2014US20140367854 Interconnect structure for molded ic packages
12/18/2014US20140367853 Solid-state imaging device, imaging apparatus, substrate, semiconductor device and method of manufacturing the solid-state imaging device
12/18/2014US20140367852 Substrate having pillar group and semiconductor package having pillar group
12/18/2014US20140367851 Embedded packages, methods of fabricating the same, electronic systems including the same, and memory cards including the same
12/18/2014US20140367850 Stacked package and method of fabricating the same
12/18/2014US20140367849 Interposer and method of manufacturing the same
12/18/2014US20140367848 Semiconductor Device and Method of Making an Embedded Wafer Level Ball Grid Array (EWLB) Package on Package (POP) Device With a Slotted Metal Carrier Interposer
12/18/2014US20140367847 Methods for establishing thermal joints between heat spreaders or lids and heat sources
12/18/2014US20140367846 Power semiconductor device
12/18/2014US20140367845 Semiconductor device
12/18/2014US20140367844 Underfill-accommodating heat spreaders and related semiconductor device assemblies and methods
12/18/2014US20140367843 Forming in-situ micro-feature structures with coreless packages
12/18/2014US20140367842 Power semiconductor device and method of manufacturing the same
12/18/2014US20140367841 Semiconductor package structure and semiconductor process
12/18/2014US20140367840 Mold cap for semiconductor device
12/18/2014US20140367839 Semiconductor package
12/18/2014US20140367838 Leadframe with lead of varying thickness
12/18/2014US20140367837 Semiconductor substrate and method for making the same
12/18/2014US20140367836 Semiconductor apparatus and substrate
12/18/2014US20140367835 Die Seal Ring and Method of Forming the Same
12/18/2014US20140367828 Process for producing a through-silicon via and a through-silicon capacitor in a substrate, and corresponding device
12/18/2014US20140367826 Making an efuse
12/18/2014US20140367808 Semiconductor device and microphone
12/18/2014US20140367799 Semiconductor Chip Including Digital Logic Circuit Including At Least Nine Linear-Shaped Conductive Structures Collectively Forming Gate Electrodes of At Least Six Transistors with Some Transistors Forming Cross-Coupled Transistor Configuration and Associated Methods
12/18/2014US20140367792 Structure and method of latchup robustness with placement of through wafer via within cmos circuitry
12/18/2014US20140367759 Multi-level contact to a 3d memory array and method of making
12/18/2014US20140367753 Cmos device with double-sided terminals and method of making the same
12/18/2014US20140367744 Monolithic Integrated Composite Group III-V and Group IV Semiconductor Device and IC
12/18/2014US20140367739 Semiconductor device and an electronic device
12/18/2014US20140367738 Semiconductor device
12/18/2014US20140367736 Semiconductor device and method for manufacturing semiconductor device
12/18/2014US20140367733 Light-emitting device
12/18/2014US20140367702 Semiconductor device and method of manufacturing the same
12/18/2014US20140367701 Semiconductor device and method of manufacturing semiconductor device
12/18/2014US20140367699 Method for fabricating semiconductor device and the semiconductor device
12/18/2014US20140367698 Method of controlling stress in group-iii nitride films deposited on substrates
12/18/2014US20140367685 Semiconductor substrate and semiconductor chip
12/18/2014US20140367677 Semiconductor device and method for producing same
12/18/2014US20140367658 Array substrate and organic light-emitting display including the same
12/18/2014US20140367041 Wafer dicing using femtosecond-based laser and plasma etch
12/18/2014DE202014105560U1 Wärmerohr Heat pipe
12/17/2014CN204031715U 插片式电子散热器 Blade electronic radiator
12/17/2014CN204031707U 1c散热固定结构 1c heat fixed structure
12/17/2014CN204029811U 一种辐射探测器串扰隔离及辐射加固像素结构 A radiation detector pixel crosstalk isolation and radiation hardened structure
12/17/2014CN204029810U 一种封装结构 A packaged structure
12/17/2014CN204029802U 一种光学耦合器 An optical coupler
12/17/2014CN204029796U 一种单相整流桥 A single-phase rectifier bridge
12/17/2014CN204029794U Igbt模块灌胶孔防护结构及防护塞 Igbt module Glue protective structure and protective plug hole
12/17/2014CN204029793U 芯片封装体 Chip package
12/17/2014CN204029792U 一种车用大功率整流二极管引线结构 A vehicle power rectifier diode lead structure
12/17/2014CN204029791U 一种多边形散热器 Polygonal radiator
12/17/2014CN204029790U 一种半导体元器件的散热结构 Thermal structure of a semiconductor components
12/17/2014CN204029789U 指纹识别芯片封装结构 Fingerprint identification chip package structure
12/17/2014CN204029788U 指纹识别芯片封装结构 Fingerprint identification chip package structure
12/17/2014CN204029787U 指纹识别芯片封装结构 Fingerprint identification chip package structure
12/17/2014CN104221363A 光学组件 Optical Components
12/17/2014CN104221146A 在无芯衬底中具有嵌入式rf管芯的系统级封装 System level package having embedded rf die coreless substrate
12/17/2014CN104221145A 具有配置为模块的多级引线框的封装半导体器件 Having a multi-stage configuration for the lead frame of the packaged semiconductor device module
12/17/2014CN104221144A 热耗散特征、包含热耗散特征的电子设备以及制造热耗散特征的方法 Heat dissipation characteristics, including heat dissipation characteristics of the electronic device and method of manufacturing the heat dissipation characteristics
12/17/2014CN104221143A 导热片的制造方法 The method of manufacturing a thermally conductive sheet
12/17/2014CN104221142A 热传导体以及使用其的电子设备 Heat transfer body and an electronic device using the same
12/17/2014CN104221141A 用于制造器件的至少一个接触面的方法和用于接收定向的测量参量的方向分量的传感器 Method for manufacturing a sensor device and at least one contact surface for receiving a measurement parameter direction orientation of components
12/17/2014CN104221140A 树脂组合物和半导体装置 The resin composition and a semiconductor device
12/17/2014CN104220652A 用于制造人造丝线的设备 The equipment used in the manufacture of artificial silk
12/17/2014CN104220533A 固化性散热组合物 Heat curable composition
12/17/2014CN104220520A 复合金属氢氧化物颗粒、及含有其的树脂组合物 Composite metal hydroxide particles, and a resin composition containing the same
12/17/2014CN104219878A 布线基板 Wiring board
12/17/2014CN104218092A 一种薄膜晶体管及其制备方法、阵列基板和显示装置 A thin film transistor and its preparation method, the array substrate and a display device
12/17/2014CN104218077A Esd晶体管 Esd transistor
12/17/2014CN104218042A 一种阵列基板及其制备方法、显示装置 One kind of array substrate and its preparation method, the display device
12/17/2014CN104218036A 半导体元件及其制造方法 Semiconductor device and manufacturing method
12/17/2014CN104218034A 半导体封装 The semiconductor package
12/17/2014CN104218031A 母排联接式高性能igbt模块及其制作方法 Busbar connection, high-performance igbt module and its manufacturing method
12/17/2014CN104218029A 一种用于功率晶体管的内匹配结构 Within the structure of a match for the power transistors
12/17/2014CN104218028A 静电放电保护结构及其形成方法 ESD protection structure and method of forming
12/17/2014CN104218027A 半导体测试结构及其测试方法 Semiconductor test structure and test methods
12/17/2014CN104218026A 半导体检测结构及检测方法 Semiconductor detector structure and detection method
12/17/2014CN104218025A 半导体结构及其形成方法 And method of forming a semiconductor structure
12/17/2014CN104218024A 具有分层互连结构的桥互连 Bridge interconnect has a hierarchical interconnect structure
12/17/2014CN104218023A 半导体结构及其形成方法 And method of forming a semiconductor structure
12/17/2014CN104218022A 晶片封装体及其制造方法 Chip package and manufacturing method thereof
12/17/2014CN104218021A 电路结构及制造具有增强的接触通孔电性连接的方法 The method of manufacturing a circuit structure and enhanced contact electrically connected to the through hole
12/17/2014CN104218020A 接地屏蔽结构及半导体器件 Grounding the shield structure and semiconductor device
12/17/2014CN104218019A 薄膜晶体管阵列基板及其制造方法 The thin film transistor array substrate and manufacturing method thereof
12/17/2014CN104218018A 一种射频功放模块及其组装方法、射频模块、基站 A radio frequency power amplifier module and assembly methods, RF modules, base station
12/17/2014CN104218017A 半导体装置 Semiconductor device
12/17/2014CN104218016A 1c载板及具有该1c载板的半导体器件 1c A semiconductor device having a carrier plate and the carrier plate 1c
12/17/2014CN104218015A 封装结构及其制作方法 Package structure and manufacturing method thereof
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